# US 2019/0380200 A1 · Embedded component structure and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0380200 A1 - Document ID: US20190380200A1 - Status: Published application - Kind: A1 - Application number: 16/542,291 - Filed: 2019-08-15 - Published: 2019-12-12 - Earliest claimed: 2018-03-20 - Assignees: Unimicron Technology Corp. - Applicants: Unimicron Technology Corp. - Inventors: Tzyy-Jang Tseng; Yu-Hua Chen; Chun-Hsien Chien; Wen-Liang Yeh; Ra-Min Tain - Web page: https://patentgrep.com/patent/US20190380200A1 ## CPC - H05K 1/0298: {Multilayer circuits} - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards - H05K 3/306: with lead-in-hole components (H05K3/32 takes precedence) - H05K 3/4602: {characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated} - H05K 2201/09645: Patterning on via walls; Plural lands around one hole - H05K 2201/10015: Non-printed capacitor - H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor - H05K 2203/0191: Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste - H05K 2203/1469: Circuit made after mounting or encapsulation of the components - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract An embedded component structure including a circuit board, an electronic component, a dielectric layer and a connection circuit layer and a manufacturing method thereof is provided. The circuit board has a through hole and includes a core layer, a first circuit layer, and a second circuit layer. The first circuit layer and the second circuit layer are disposed on the core layer. The through hole penetrates the first circuit layer and the core layer. The electronic component including a plurality of connection pads is disposed within the through hole where the dielectric layer is filled in. The Young's modulus of the core layer is greater than the Young's modulus of the dielectric layer. The connection circuit layer covers and contacts a first electrical connection surface of the first circuit layer and at least one of a second electrical connection surface of each of the connection pads. A manufacturing method of an embedded component structure is also provided. ## Claims ### Claim 1 An embedded component structure, comprising: a circuit board having a through hole, and the circuit board comprising: a core layer; a first circuit layer, disposed on the core layer; and a second circuit layer, disposed on the core layer opposite to the first circuit layer, wherein the through hole at least penetrates the first circuit layer and the core layer an electronic component, disposed in the through hole, wherein the electronic component includes a plurality of connection pads exposed to the outside of the through hole; a dielectric material layer, at least filled in the through hole, wherein the Young's modulus of the core layer is greater than the Young's modulus of the dielectric material layer; and a connecting circuit layer, covered and contacted a first electrical connecting surface of the first circuit layer and at least one of a second electrical connecting surface of each of the connection pads, wherein the connecting pads are electrically connected to the first circuit layer by the connecting circuit layer. ### Claim 2 (depends on 1) The embedded component structure of claim 1, wherein the dielectric material layer is further filled between each of the connection pads and the first circuit layer and has a dielectric surface coplanar with the first electrical connection surface, and the connecting circuit layer covers and contacts the first electrical connection surface, the dielectric surface, and the second electrical connection surface. ### Claim 3 (depends on 2) The embedded component structure of claim 2, wherein on a cross section perpendicular to the first electrical connection surface, a cross-sectional thickness of the connecting circuit layer on the first electrical connecting surface, a cross-sectional thickness of the connecting circuit layer on the dielectric surface, and a cross-sectional thickness of the connecting circuit layer on the second electrical connecting surface are substantially the same. ### Claim 4 (depends on 1) The embedded component structure of claim 1, wherein a cross-sectional area of the through hole is larger than a surface area of the second electrical connection surface. ### Claim 5 (depends on 1) The embedded component structure of claim 1, further comprising: a first dielectric layer, disposed on the same side of the first circuit layer as the core layer and covered at least a portion of the first circuit layer and at least a portion of the connection circuit layer, wherein the first dielectric layer includes at least one opening exposing the first circuit layer or the connection circuit layer. ### Claim 6 (depends on 5) The embedded component structure of claim 5, wherein the material of the first dielectric layer includes a solder resist material or a photoimageable dielectric material. ### Claim 7 (depends on 1) The embedded component structure of claim 1, wherein the dielectric material layer includes a cover portion outside the through hole, and the cover portion covers a side of the core layer on which the second circuit layer is disposed and covers at least a portion of the second circuit layer. ### Claim 8 (depends on 7) The embedded component structure of claim 7, wherein the cover portion of the dielectric material layer includes at least one dielectric opening exposing the second circuit layer. ### Claim 9 (depends on 7) The embedded component structure of claim 7, further comprising: a second dielectric layer, covered the cover portion of the dielectric material layer, wherein the second dielectric layer includes at least one opening exposing the second circuit layer. ### Claim 10 (depends on 9) The embedded component structure of claim 9, wherein the material of the second dielectric layer includes a solder resist material or a photoimageable dielectric material. ### Claim 11 (depends on 1) The embedded component structure of claim 1, wherein the first electrical connection surface of the first circuit layer is coplanar with at least one of the second electrical connection surface of each of the connection pads. ### Claim 12 (depends on 1) The embedded component structure of claim 1, wherein the circuit board further comprising: at least one conductive through hole, penetrated the core layer to electrically connect the first circuit layer and the second circuit layer. ### Claim 13 (depends on 12) The embedded component structure of claim 12, wherein the through hole is connected to the at least one conductive through hole. ### Claim 14 A manufacturing method of an embedded component structure, comprising: providing a carrier; placing a circuit board on the carrier, wherein the circuit board includes a through hole, and the circuit board comprising: a core layer; a first circuit layer, disposed on the core layer; and a second circuit layer, disposed on the core layer opposite to the first circuit layer, wherein the through hole at least penetrates the first circuit layer and the core layer; placing an electronic component on the carrier, wherein the electronic component includes a plurality of connection pads, and the connection pads contact the carrier; forming a dielectric material layer on the carrier after the circuit board and the electronic component are placed on the carrier and the electronic component is embedded in the through hole, the dielectric material layer is at least filled in the through hole, and the Young's modulus of the core layer is greater than the Young's modulus of the dielectric material layer; removing the carrier to expose the first circuit layer and the connection pads, wherein a first electrical connection surface of the first circuit layer is coplanar with a second electrical connection surface of each of the connection pads; and forming a connection circuit layer after the carrier is removed, wherein the connection circuit layer covers and contacts the first electrical connection surface and the at least one of the second electrical connection surfaces. ### Claim 15 (depends on 14) The manufacturing method of the embedded component structure of claim 14, wherein the circuit board further comprising: at least one conductive through hole, penetrated the core layer to electrically connect the first circuit layer and the second circuit layer. ### Claim 16 (depends on 15) The manufacturing method of the embedded component structure of claim 15, wherein the through hole is connected to the at least one conductive through hole. ### Claim 17 (depends on 14) The manufacturing method of the embedded component structure of claim 14, further comprising: forming a first dielectric layer after the connection circuit layer is formed, wherein the first dielectric layer covers at least a portion of the first circuit layer and at least a portion of the connection circuit layer. ### Claim 18 (depends on 17) The manufacturing method of the embedded component structure of claim 17, wherein the material of the first dielectric layer includes a solder resist material or a photoimageable dielectric material. ### Claim 19 (depends on 14) The manufacturing method of the embedded component structure of claim 14, further comprising: forming at least one through hole on the circuit board and penetrated the core layer, the first circuit layer, and the second circuit layer after the dielectric material layer is formed; and filling a conductive material into the at least one through hole to form at least one conductive through hole penetrated the core layer, wherein the at least one conductive through hole is electrically connected the first circuit layer and the second circuit layer. ### Claim 20 (depends on 14) The manufacturing method of the embedded component structure of claim 14, wherein the dielectric material layer includes a cover portion outside the through hole, and the cover portion covers a side of the core layer on which the second circuit layer is disposed and covers at least a portion of the second circuit layer. ### Claim 21 (depends on 20) The manufacturing method of the embedded component structure of claim 20, further comprising: forming at least one dielectric opening on the cover portion of the dielectric material layer, wherein the at least one dielectric opening exposes the second circuit layer. ### Claim 22 (depends on 20) The manufacturing method of the embedded component structure of claim 20, further comprising: forming a second dielectric layer to cover the cover portion of the dielectric material layer. ### Claim 23 (depends on 22) The manufacturing method of the embedded component structure of claim 22, further comprising: forming at least one second opening on the second dielectric layer, wherein the at least one second opening exposes the second circuit layer. ### Claim 24 (depends on 22) The manufacturing method of the embedded component structure of claim 22, wherein the material of the second dielectric layer includes a solder resist material or a photoimageable dielectric material.