# US 2019/0379295 A1 · Main circuit wiring member and power conversion device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0379295 A1 - Document ID: US20190379295A1 - Status: Published application - Kind: A1 - Application number: 16/474,285 - Filed: 2017-03-02 - Published: 2019-12-12 - Earliest claimed: 2017-03-02 - Assignees: Mitsubishi Electric Corporation - Applicants: Mitsubishi Electric Corporation - Inventors: Yukio NAKASHIMA - Web page: https://patentgrep.com/patent/US20190379295A1 ## CPC - H02M 7/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections} - H02G 5/005: {Laminated bus-bars} - H02M 1/32: Means for protecting converters other than automatic disconnection - H02M 7/5387: in a bridge configuration - H05K 7/02: Arrangements of circuit components or wiring on supporting structure - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) - H02G: INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A main circuit wiring member for electrically connecting a supply source of direct-current power and a semiconductor element module to each other or semiconductor element modules to each other, includes a first conductor covered with an insulating film and configured to allow a first potential to be applied thereto, a second conductor covered with the insulating film and configured to allow a second potential to be applied thereto, the second potential being lower than the first potential, and an insulating member that has intermediate-potential layer conductors sandwiched therein and is arranged between the first conductor and the second conductor. ## Claims ### Claim 1 A main circuit wiring member for electrically connecting a supply source of direct-current power and a semiconductor element module to each other or semiconductor element modules to each other, comprising: a first conductor covered with a conductor-insulating member and configured to allow a first potential to be applied thereto; a second conductor covered with a conductor-insulating member and configured to allow a second potential to be applied thereto, the second potential being lower than the first potential; and a conductor-to-conductor insulating member having a plurality of intermediate-potential layer conductors sandwiched therein, and arranged between the first conductor and the second conductor. ### Claim 2 (depends on 1) The main circuit wiring member according to claim 1, wherein the conductor-to-conductor insulating member is divided into two in an array direction of conductors by one of the intermediate-potential layer conductors. ### Claim 3 (depends on 1) The main circuit wiring member according to claim 1, wherein the conductor-to-conductor insulating member is divided into three in an array direction of conductors by two of the intermediate-potential layer conductors. ### Claim 4 (depends on 1) The main circuit wiring member according to claim 1, wherein a material of the intermediate-potential layer conductors is carbon. ### Claim 5 (depends on 1) The main circuit wiring member according to claim 1, wherein a material of the conductor-to-conductor insulating member is silicon-based rubber. ### Claim 6 A power conversion device configured by using a main circuit wiring member for electrically connecting a supply source of direct-current power and a semiconductor element module to each other or semiconductor element modules to each other, wherein the main circuit wiring member includes a first conductor covered with a conductor-insulating member and configured to allow a first potential to be applied thereto, a second conductor covered with a conductor-insulating member and configured to allow a second potential to be applied thereto, the second potential being lower than the first potential, and a conductor-to-conductor insulating member having one or a plurality of intermediate-potential layer conductors sandwiched therein, and arranged between the first conductor and the second conductor, and the intermediate-potential layer conductors are floating potentials. ### Claim 7 (depends on 2) The main circuit wiring member according to claim 2, wherein a material of the intermediate-potential layer conductors is carbon. ### Claim 8 (depends on 3) The main circuit wiring member according to claim 3, wherein a material of the intermediate-potential layer conductors is carbon. ### Claim 9 (depends on 2) The main circuit wiring member according to claim 2, wherein a material of the conductor-to-conductor insulating member is silicon-based rubber. ### Claim 10 (depends on 3) The main circuit wiring member according to claim 3, wherein a material of the conductor-to-conductor insulating member is silicon-based rubber. ### Claim 11 (depends on 4) The main circuit wiring member according to claim 4, wherein a material of the conductor-to-conductor insulating member is silicon-based rubber. ### Claim 12 (depends on 7) The main circuit wiring member according to claim 7, wherein a material of the conductor-to-conductor insulating member is silicon-based rubber. ### Claim 13 (depends on 8) The main circuit wiring member according to claim 8, wherein a material of the conductor-to-conductor insulating member is silicon-based rubber.