# US 2019/0378804 A1 · Wiring substrate

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2019/0378804 A1
- Document ID: US20190378804A1
- Status: Published application
- Kind: A1
- Application number: 16/423,370
- Filed: 2019-05-28
- Published: 2019-12-12
- Earliest claimed: 2018-06-07
- Assignees: Shinko Electric Industries Co., Ltd.
- Applicants: Shinko Electric Industries Co., Ltd.
- Inventors: Junji SATO; Katsuya FUKASE
- Web page: https://patentgrep.com/patent/US20190378804A1

## CPC

- H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
- H05K 1/02: Details
- H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion}
- H05K 1/181: associated with surface mounted components
- H05K 3/007: {Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K1/187, H05K3/20 and H05K3/4682 take precedence)}
- H10P 72/74: {using temporarily an auxiliary support}
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/685: comprising multiple insulating layers
- H10W 74/016: {using moulds}
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H05K 2201/068: wherein the coefficient of thermal expansion is important
- H05K 2201/10378: Interposers
- H10P 72/7424: {used as a support during the manufacture of self-supporting substrates}
- H10W 72/072: {of bump connectors}
- H10W 72/07207: {Temporary substrates, e.g. removable substrates}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A wiring substrate includes: a wiring member that includes a first surface and a second surface, the wiring member including a plurality of wiring layers between the first surface and the second surface; and a carrier that is bonded to the first surface via an adhesive and that includes a plurality of layers whose coefficients of thermal expansion are different from each other. A pitch of wires included in the plurality of wiring layers is narrower on the second surface side than on the first surface side. When being heated, a direction in which the wiring member tends to warp and a direction in which the carrier tends to warp are opposite.

## Claims

### Claim 1

A wiring substrate comprising:
a wiring member that includes a first surface and a second surface, the wiring member including a plurality of wiring layers between the first surface and the second surface; and
a carrier that is bonded to the first surface via an adhesive and that includes a plurality of layers whose coefficients of thermal expansion are different from each other,
wherein a pitch of wires included in the plurality of wiring layers is narrower on the second surface side than on the first surface side, and
wherein, when being heated, a direction in which the wiring member tends to warp and a direction in which the carrier tends to warp are opposite.

### Claim 2 (depends on 1)

The wiring substrate according to claim 1,
wherein, when being heated, the wiring member tends to warp in a convex shape on the carrier, and
wherein with respect to the layers included in the carrier, the coefficients of thermal expansion decrease in accordance with proximity to the wiring member.

### Claim 3 (depends on 1)

The wiring substrate according to claim 1,
wherein, when being heated, the wiring member tends to warp in a concave shape on the carrier, and
wherein with respect to the layers included in the carrier, the coefficients of thermal expansion increase in accordance with proximity to the wiring member.

### Claim 4 (depends on 1)

The wiring substrate according to claim 1, wherein a number of layers included in the carrier is three or more.