# US 2019/0378802 A1 · Electronic component module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0378802 A1 - Document ID: US20190378802A1 - Status: Published application - Kind: A1 - Application number: 16/428,596 - Filed: 2019-05-31 - Published: 2019-12-12 - Earliest claimed: 2018-06-08 - Assignees: Taiyo Yuden Co., Ltd. - Applicants: Taiyo Yuden Co., Ltd. - Inventors: Taiji ITO - Web page: https://patentgrep.com/patent/US20190378802A1 ## CPC - H05K 9/0026: {integrally formed from metal sheet} - H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)} - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 3/34: by soldering - H05K 5/0095: {hermetically-sealed} - H05K 9/0037: {Housings with compartments containing a PCB, e.g. partitioning walls} - H05K 9/0084: {comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H10W 72/0198: {batch processes} - H10W 74/01: Manufacture or treatment - H05K 2201/10371: Shields or metal cases - H10W 44/248: {for antennas} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An electronic component module includes: electronic components mounted on a substrate, each of the electronic components having terminals located on a side, upper, and/or lower surface thereof; and a shield that is located on the substrate, has side plates surrounding the electronic components, and is supplied with a ground potential, wherein in an electronic component closest to one side plate of the side plates among one or more electronic components, in each of which at least one terminal of the terminals is located on the side and/or upper surface, a terminal a first distance of which to the one side plate is shortest among the at least one terminal is a first terminal supplied with the ground potential, and a second distance each of second terminals not supplied with the ground potential to the one side plate is greater than the first distance. ## Claims ### Claim 1 An electronic component module comprising: a substrate; electronic components mounted on the substrate, each of the electronic components having terminals located on a side surface, an upper surface, and/or a lower surface thereof; and a shield located on the substrate so as to cover the electronic components, the shield having an upper plate and one or more side plates, the shield being supplied with a ground potential, the upper plate being located above the electronic components, the one or more side plates extending from the upper plate toward the substrate and surrounding the electronic components, wherein in an electronic component closest to one side plate of the one or more side plates among one or more electronic components, in each of which at least one terminal of the terminals is located on the side surface and/or the upper surface, of the electronic components, a terminal a first distance of which to the one side plate is shortest among the at least one terminal is a first terminal to which the ground potential is supplied, and a second distance of one or more second terminals, to which the ground potential is not supplied, of the at least one terminal to the one side plate is greater than the first distance. ### Claim 2 (depends on 1) The electronic component module according to claim 1, wherein in each of at least first two electronic components in an order of closest to the one side plate among the one or more electronic components, a terminal the first distance of which to the one side plate is shortest among the at least one terminal is the first terminal, and the second distance of each of the one or more second terminals to the one side plate is greater than the first distance. ### Claim 3 (depends on 1) The electronic component module according to claim 1, wherein distances between at least two electronic components including the electronic component closest to the one side plate of the one or more electronic components and the one side plate are approximately equal to each other, in each of the at least two electronic components, a terminal the first distance of which to the one side plate is shortest among the at least one terminal is the first terminal, and the second distance of each of the one or more second terminals to the one side plate is greater than the first distance. ### Claim 4 (depends on 1) The electronic component module according to claim 1, wherein the first distance is less than a distance between the substrate and the upper plate. ### Claim 5 (depends on 1) The electronic component module according to claim 1, wherein each of the electronic components is a discrete component that is a capacitor, an inductor, or a resistor. ### Claim 6 (depends on 1) The electronic component module according to claim 1, wherein the first terminals and the second terminals are exposed to both end portions of the electronic components. ### Claim 7 (depends on 1) The electronic component module according to claim 1, wherein the electronic components are included in an electronic circuit that transmits a high-frequency signal to an antenna or receives a high-frequency signal from the antenna. ### Claim 8 (depends on 1) The electronic component module according to claim 1, wherein the one side plate and the electronic component closest to the one side plate face each other across an air gap. ### Claim 9 (depends on 1) The electronic component module according to claim 1, further comprising an insulating layer located on the substrate so as to seal the electronic components, wherein the shield is located on a surface of the insulating layer. ### Claim 10 (depends on 9) The electronic component module according to claim 9, further comprising a land located on the substrate, the land being bonded with the first terminal, wherein the one side plate is in contact with a side surface of the land. ### Claim 11 (depends on 1) The electronic component module according to claim 1, wherein the shield is fixed to the substrate only by three fixing portions, a side plate other than the three fixing portions and the substrate are located away from each other, and the one side plate is the side plate other than the three fixing portions. ### Claim 12 (depends on 1) The electronic component module according to claim 1, wherein a planar shape of the shield is a substantially rectangular shape, and one of the three fixing portions is located in a middle part of a first side of the substantially rectangular shape, and other two of the three fixing portions are located in both ends of a second side facing the first side. ### Claim 13 An electronic component module comprising: a substrate having a rectangular shape; ground lands located on the substrate and arranged along a first side surface of the substrate; connection members located on the ground lands; electronic components of which ground terminals are connected to the ground lands through the connection members; a sealing layer located on the substrate so as to cover the electronic components, a side surface of the sealing layer being formed by cutting; and a shield that is in contact with a part to which at least one of the ground lands, the connection members, and the ground terminals is exposed from the sealing layer, and covers a periphery of the sealing layer. ### Claim 14 (depends on 13) The electronic component module according to claim 13, wherein the electronic components are chip components, and the connection members are solder.