# US 2019/0378779 A1 · Module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0378779 A1 - Document ID: US20190378779A1 - Status: Published application - Kind: A1 - Application number: 16/550,454 - Filed: 2019-08-26 - Published: 2019-12-12 - Earliest claimed: 2017-02-28 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Akihiro FUJII; Toru KOMATSU - Web page: https://patentgrep.com/patent/US20190378779A1 ## CPC - H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control - H05K 7/20: Modifications to facilitate cooling, ventilating, or heating - H05K 9/00: Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an antenna H01Q17/00) - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 70/611: {for connecting multiple chips together} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/40: characterised by their materials - H10W 90/00: Package configurations - H10W 99/00: Subject matter not provided for in other groups of this subclass - H10W 40/778: {in encapsulations} - H10W 70/657: {on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A module that has excellent heat dissipation performance and enables height reduction easily is provided. The module includes a wiring substrate, a plurality of components mounted on the top surface of the wiring substrate, a plurality of heat dissipation members, a sealing resin layer laminated on the top surface of the wiring substrate, and a shield film that covers surfaces of the sealing resin layer. The heat dissipation member is formed into a strip-shaped sheet. In addition, both end portions of the heat dissipation member are in contact with the top surface of the wiring substrate and also with the components disposed between the both end portions. The heat dissipation member thereby forms a heat dissipation path that transmits heat generated by the component to the wiring substrate. ## Claims ### Claim 1 A module comprising: a wiring substrate; a first component mounted on a major surface of the wiring substrate; a sheet-like heat dissipation member that is disposed so as to have a contact portion in contact with the first component and a non-contact portion not in contact with the first component; and a sealing resin layer configured to cover the first component and the major surface of the wiring substrate, wherein the heat dissipation member has a structure that allows resin of the sealing resin layer to enter a region between the non-contact portion and the first component, and the heat dissipation member constitutes at least part of a heat dissipation path through which heat generated by the first component is transmitted to the wiring substrate. ### Claim 2 (depends on 1) The module according to claim 1, wherein the sheet-like heat dissipation member comprises a strip having a width narrower than a width of the first component. ### Claim 3 (depends on 1) The module according to claim 1, further comprising: a second component mounted on the major surface of the wiring substrate, wherein the second component is a component that generates less heat than the first component, and the non-contact portion of the heat dissipation member has a portion in contact with the second component. ### Claim 4 (depends on 1) The module according to claim 1, wherein the non-contact portion of the heat dissipation member has a portion in contact with the major surface of the wiring substrate. ### Claim 5 (depends on 1) The module according to claim 1, further comprising: a shield layer configured to cover a surface of the sealing resin layer, wherein the non-contact portion of the heat dissipation member has a portion in contact with the shield layer. ### Claim 6 (depends on 2) The module according to claim 2, further comprising: a second component mounted on the major surface of the wiring substrate, wherein the second component is a component that generates less heat than the first component, and the non-contact portion of the heat dissipation member has a portion in contact with the second component. ### Claim 7 (depends on 2) The module according to claim 2, wherein the non-contact portion of the heat dissipation member has a portion in contact with the major surface of the wiring substrate. ### Claim 8 (depends on 3) The module according to of claim 3, wherein the non-contact portion of the heat dissipation member has a portion in contact with the major surface of the wiring substrate. ### Claim 9 (depends on 2) The module according to claim 2, further comprising: a shield layer configured to cover a surface of the sealing resin layer, wherein the non-contact portion of the heat dissipation member has a portion in contact with the shield layer. ### Claim 10 (depends on 3) The module according to claim 3, further comprising: a shield layer configured to cover a surface of the sealing resin layer, wherein the non-contact portion of the heat dissipation member has a portion in contact with the shield layer. ### Claim 11 (depends on 4) The module according to claim 4, further comprising: a shield layer configured to cover a surface of the sealing resin layer, wherein the non-contact portion of the heat dissipation member has a portion in contact with the shield layer.