# US 2019/0378772 A1 · Wiring substrate, electronic device, and electronic module

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- Number: US 2019/0378772 A1
- Document ID: US20190378772A1
- Status: Published application
- Kind: A1
- Application number: 16/487,201
- Filed: 2018-02-20
- Published: 2019-12-12
- Earliest claimed: 2017-02-21
- Assignees: KYOCERA Corporation
- Applicants: KYOCERA Corporation
- Inventors: Hiroshi KAWAGOE
- Web page: https://patentgrep.com/patent/US20190378772A1

## CPC

- H10W 70/68: Shapes or dispositions thereof
- H05K 1/02: Details
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 76/12: characterised by their shape
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10W 70/635: {Through-vias}
- H10W 70/682: {comprising holes having chips therein}
- H10W 70/692: Ceramics or glasses
- H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

A wiring substrate includes an insulating substrate being square in plan view, the insulating substrate including one main surface with a recess, and the other main surface opposite to the one main surface, and external electrodes located on the other main surface of the insulating substrate. The external electrodes are arranged in a row in a peripheral section of the insulating substrate. In plan view, an area of one of the external electrodes located at a center of each side of the insulating substrate is larger than an area of one of the external electrodes located at an edge of the each side.

## Claims

### Claim 1

A wiring substrate comprising:
an insulating substrate comprising one main surface with a recess, and an other main surface opposite to the one main surface, the insulating substrate being square in plan view of the one main surface; and
a plurality of external electrodes located in a row in a peripheral section of the other main surface of the insulating substrate, wherein
in plan view of the other main surface, an area of one of the external electrodes located at a center of each side of the insulating substrate is larger than an area of one of the external electrodes located at an edge of the each side.

### Claim 2 (depends on 1)

The wiring substrate according to claim 1, wherein
the external electrodes are arranged into a band-shape.

### Claim 3 (depends on 1)

The wiring substrate according to claim 1, wherein
in plan view of the other main surface, areas of the external electrodes become gradually larger from the edge toward the center of the each side of the insulating substrate.

### Claim 4 (depends on 1)

The wiring substrate according to claim 1, wherein
the recess is square in plan view of the one main surface.

### Claim 5 (depends on 1)

The wiring substrate according to claim 1, wherein
the recess is circular in plan view of the one main surface.

### Claim 6 (depends on 1)

An electronic device comprising:
the wiring substrate according to claim 1; and
an electronic component mounted on the wiring substrate.

### Claim 7 (depends on 6)

An electronic module comprising:
a module substrate comprising a connection pad; and
the electronic device according to claim 6 connected to the connection pad via a solder.

### Claim 8 (depends on 2)

The wiring substrate according to claim 2, wherein
in plan view of the other main surface, areas of the external electrodes become gradually larger from the edge toward the center of the each side of the insulating substrate.

### Claim 9 (depends on 2)

The wiring substrate according to claim 2, wherein
the recess is square in plan view of the one main surface.

### Claim 10 (depends on 3)

The wiring substrate according to claim 3, wherein
the recess is square in plan view of the one main surface.

### Claim 11 (depends on 8)

The wiring substrate according to claim 8, wherein
the recess is square in plan view of the one main surface.

### Claim 12 (depends on 2)

The wiring substrate according to claim 2, wherein
the recess is circular in plan view of the one main surface.

### Claim 13 (depends on 3)

The wiring substrate according to claim 3, wherein
the recess is circular in plan view of the one main surface.

### Claim 14 (depends on 8)

The wiring substrate according to claim 8, wherein
the recess is circular in plan view of the one main surface.