# US 2019/0378748 A1 · Method and apparatus for multiple direct transfers of semiconductor devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0378748 A1 - Document ID: US20190378748A1 - Status: Published application - Kind: A1 - Application number: 16/551,131 - Filed: 2019-08-26 - Published: 2019-12-12 - Earliest claimed: 2018-05-12 - Assignees: Rohinni, LLC - Applicants: Rohinni, LLC - Inventors: Cody Peterson; Andrew Huska - Web page: https://patentgrep.com/patent/US20190378748A1 ## CPC - H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes} - H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape} - H10P 72/7614: {characterised by a plurality of individual support members, e.g. support posts or protrusions} - H10P 72/7428: {used to support diced chips prior to mounting} - H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer} - H10W 72/0198: {batch processes} - H10W 72/0711: {Apparatus therefor} - H10W 72/07141: {Means for applying energy, e.g. ovens or lasers} - H10W 72/07173: {Means for moving chips, wafers or other parts, e.g. conveyor belts} - H10W 72/07178: {Means for aligning} - H10W 72/07188: {Apparatus chuck} - H10W 72/07223: {Active alignment, e.g. using optical alignment using marks or sensors} - H10W 72/07235: {Applying EM radiation, e.g. induction heating or using a laser} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An apparatus for a direct transfer of a semiconductor device die from a wafer tape to a substrate. A first frame holds the wafer tape and a second frame secures the substrate. The second frame holds the substrate such that a transfer surface is disposed facing the semiconductor device die on a first side of the wafer tape. Two or more needles are disposed adjacent a second side of the wafer tape opposite the first side. A length of the two or more needles extends in a direction toward the wafer tape. A needle actuator actuates the two or more needles into a die transfer position at which at least one needle of the two or more needles presses on the second side of the wafer tape to press a semiconductor device die of the one or more semiconductor device die into contact with the transfer surface of the substrate. ## Claims ### Claim 1 An apparatus for executing a direct transfer of one or more semiconductor device die from a wafer tape to a substrate, the apparatus comprising: a product substrate frame to secure the substrate, the product substrate frame having a first side and a second side; a die substrate frame to secure the wafer tape holding multiple semiconductor device die, the die substrate frame being disposed adjacent to the first side of the product substrate frame; a transfer mechanism disposed adjacent to the die substrate frame to transfer a semiconductor device die from the wafer tape when the wafer tape is secured in the die substrate frame, the transfer mechanism including a plurality of transfer pins; and a guide to position the plurality of transfer pins at specific locations in a matrix configuration, the guide maintaining the matrix configuration of the plurality of transfer pins throughout a transfer operation. ### Claim 2 (depends on 1) The apparatus according to claim 1, wherein the plurality of transfer pins are arranged in fixed positions relative to each other. ### Claim 3 (depends on 2) The apparatus according to claim 2, wherein each of the plurality of transfer pins are substantially uniform in size and shape. ### Claim 4 (depends on 1) The apparatus according to claim 1, wherein the transfer mechanism moves continuously while completing the transfer operation. ### Claim 5 (depends on 1) The apparatus according to claim 1, wherein at least two of the product substrate, the die substrate, and the transfer mechanism move in a continuous motion across the die substrate. ### Claim 6 (depends on 1) The apparatus according to claim 1, wherein the transfer mechanism actuates at least a first transfer pin of the plurality of transfer pins to hold the semiconductor device die in a substantially fixed position as at least a second transfer pin of the plurality of transfer pins transfers the semiconductor device die from the die substrate. ### Claim 7 (depends on 6) The apparatus according to claim 6, wherein the transfer mechanism is configured to actuate at least one of the plurality of transfer pins based at least in part on a position of the transfer mechanism. ### Claim 8 An apparatus, comprising: a transfer mechanism to transfer an electrically-actuatable element directly from a wafer tape to a transfer location on a circuit trace, wherein the transfer mechanism includes: a plurality of transfer pins, a transfer pin actuator configured to move the plurality of transfer pins toward and away from the transfer location, and a guide to position the plurality of transfer pins at specific locations in a matrix configuration, the guide maintaining the matrix configuration of the plurality of transfer pins throughout a transfer operation. ### Claim 9 (depends on 8) The apparatus according to claim 8, wherein the transfer pin actuator is configured to actuate the plurality of transfer pins sequentially, synchronously, or a combination thereof. ### Claim 10 (depends on 8) The apparatus according to claim 8, wherein the plurality of transfer pins are independently actuatable from each other. ### Claim 11 (depends on 8) The apparatus according to claim 8, wherein the plurality of transfer pins are arranged in fixed positions relative to each other. ### Claim 12 (depends on 8) The apparatus according to claim 8, wherein the transfer pin actuator includes an electromechanical actuator and the transfer pin actuator includes one or more return springs. ### Claim 13 (depends on 8) The apparatus according to claim 8, wherein the transfer pin actuator is configured to actuate at least one of the plurality of transfer pins to stabilize the circuit trace for transferring the electrically-actuatable element to the circuit trace. ### Claim 14 (depends on 8) The apparatus according to claim 8, wherein the apparatus is configured to accommodate the transfer of the electrically-actuatable element, which is a micro-sized unpackaged LED, a height of the micro-sized unpackaged LED ranging between 12.5 microns and 200 microns, between 25 microns and 100 microns, or between 50 microns to 80 microns. ### Claim 15 An apparatus for executing a direct transfer of one or more semiconductor device die from a wafer tape to a product substrate, the apparatus comprising: a plurality of transfer pins; a transfer pin actuator configured to actuate the plurality of transfer pins into a die transfer position at which at least one transfer pin of the plurality of transfer pins presses at least one semiconductor device die thereby transferring the at least one semiconductor device die from the wafer tape to the product substrate; and a guide to position the plurality of transfer pins at designated locations in a matrix configuration. ### Claim 16 (depends on 15) The apparatus according to claim 15, wherein the guide maintains the matrix configuration of the plurality of transfer pins throughout a transfer operation. ### Claim 17 (depends on 15) The apparatus according to claim 15, wherein the guide includes a plurality of openings that correspond with the plurality of transfer pins such that one transfer pin of the plurality of transfer pins corresponds with one opening of the plurality of openings. ### Claim 18 (depends on 15) The apparatus according to claim 15, wherein the plurality of transfer pins includes at least one of a dissimilar material, a dissimilar size, or a dissimilar shape than one or more other transfer pins of the plurality of transfer pins. ### Claim 19 (depends on 15) The apparatus according to claim 15, wherein the transfer pin actuator is further configured to actuate individual transfer pins of the plurality of transfer pins independently from one another. ### Claim 20 (depends on 15) The apparatus according to claim 15, wherein the transfer pin actuator is configured to actuate more than one transfer pin, but fewer than all, of the plurality of transfer pins at a same time or substantially the same time.