# US 2019/0378741 A1 · Chip bonding device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0378741 A1 - Document ID: US20190378741A1 - Status: Published application - Kind: A1 - Application number: 16/489,198 - Filed: 2018-02-27 - Published: 2019-12-12 - Earliest claimed: 2017-02-28 - Assignees: Shanghai Micro Electronics Equipment (Group) Co., Ltd. - Applicants: Shanghai Micro Electronics Equipment (Group) Co., Ltd. - Inventors: Feibiao CHEN; Hai XIA; Yuebin ZHU; Hailin CHENG; Xiaoyu JIANG; Lili ZHAO; Donghao ZHANG - Web page: https://patentgrep.com/patent/US20190378741A1 ## CPC - H10P 72/0446: {Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates} - H10P 72/53: {using optical controlling means} - B65G 47/91: incorporating pneumatic, e.g. suction, grippers - H10P 72/0606: {Position monitoring, e.g. misposition detection or presence detection} - H10P 72/38: {with angular orientation of workpieces} - H10P 72/50: for positioning, orientation or alignment - H10P 72/78: using vacuum or suction, e.g. Bernoulli chucks - H10P 72/0428: {Apparatus for mechanical treatment or grinding or cutting} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B65G: TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS (packaging B65B; handling thin or filamentary materials, e.g. paper sheets or thread, B65H; cranes B66C; portable mobile or lifting or hauling appliances, e.g. hoists, B66D; devices for lifting or lowering goods for loading or unloading purposes, e.g. fork-lift trucks, B66F9/00; emptying bottles, jars, casks, barrels or similar containers, not otherwise provided for, B67C9/00; delivering or transferring liquids B67D; filling or discharging vessels for liquefied, solidified or compressed gases F17C; pipe-line systems for fluids F17D) ## Abstract A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage. ## Claims ### Claim 1 A chip bonding apparatus, comprising a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit; the bonding robotic arm unit comprising a first bonding robotic arm unit and a second bonding robotic arm unit; the first bonding robotic arm unit comprising a first motion stage, a first driver configured to drive the first motion stage, and at least one first bonding robotic arm which is arranged on the first motion stage and configured to suck up a chip from the chip separation unit and deliver the chip to the chip alignment unit; the second bonding robotic arm unit comprising a second motion stage, a second driver configured to drive the second motion stage, and at least one second bonding robotic arm which is arranged on the second motion stage and configured to suck up a chip from the chip alignment unit and deliver the chip to the chip bonding unit. ### Claim 2 (depends on 1) The chip bonding apparatus of claim 1, wherein the first motion stage is implemented as a rotary motion stage, the at least one first bonding robotic arm is arranged circumferentially on the rotary motion stage. ### Claim 3 (depends on 1) The chip bonding apparatus of claim 1, wherein the first motion stage is implemented as a pivotal arm having an output end at which the first bonding robotic arm is mounted. ### Claim 4 (depends on 3) The chip bonding apparatus of claim 3, wherein the pivotal arm is able to pivot in an X-Y plane. ### Claim 5 (depends on 1) The chip bonding apparatus of claim 1, wherein the second motion stage is implemented as a rotary motion stage, the at least one second bonding robotic arm is arranged circumferentially on the rotary motion stage. ### Claim 6 (depends on 1) The chip bonding apparatus of claim 1, wherein the chip alignment unit comprises an alignment measurement system configured to measure a position of a mark on a chip, a third motion stage, a third driver configured to drive the third motion stage and a plurality of measuring suckers arranged on the third motion stage. ### Claim 7 (depends on 6) The chip bonding apparatus of claim 6, wherein the alignment measurement system comprises a chip-down alignment measurement system and/or a chip-up alignment measurement system. ### Claim 8 (depends on 7) The chip bonding apparatus of claim 7, wherein the chip-down alignment measurement system is disposed under the second motion stage and configured to identify a position of a mark on a chip received by one of the at least one second bonding robotic arm from one of the measuring suckers. ### Claim 9 (depends on 7) The chip bonding apparatus of claim 7, wherein the chip-up alignment measurement system is disposed above the third motion stage and configured to identify a position of a mark on a chip on one of the measuring suckers. ### Claim 10 (depends on 6) The chip bonding apparatus of claim 6, wherein the third motion stage is implemented as a rotary motion stage, the measuring suckers are arranged circumferentially on the rotary motion stage. ### Claim 11 (depends on 7) The chip bonding apparatus of claim 7, wherein the chip bonding unit comprises a bonding stage, a bonding tray disposed on the bonding stage and configured to accommodate a bonding substrate, and a bonding measurement system configured to measure a position of the bonding substrate. ### Claim 12 (depends on 11) The chip bonding apparatus of claim 11, further comprising a calibration measurement system configured to measure a reference mark on the third motion stage and a bonding substrate mark on the bonding stage. ### Claim 13 (depends on 12) The chip bonding apparatus of claim 12, wherein only one calibration measurement system is included and disposed between adjacent two of the at least one second bonding robotic arm on the second motion stage; or the calibration measurement system is same as the at least one second bonding robotic arm in number, and the calibration measurement systems and the second bonding robotic arms are disposed alternately on the second motion stage. ### Claim 14 (depends on 13) The chip bonding apparatus of claim 13, wherein the chip-up alignment measurement system is integrated into the calibration measurement system, so that when moving to a position above one of the measuring suckers, the calibration measurement system acts as the chip-up alignment measurement system to identify a position of a mark on a chip on the measuring sucker. ### Claim 15 (depends on 1) The chip bonding apparatus of claim 1, wherein the chip separation unit comprises a workpiece motion stage, a workpiece tray disposed on the workpiece motion stage, a vertical robotic arm configured to separate a chip from the workpiece tray, and a separation measurement system configured to measure a position of the chip. ### Claim 16 (depends on 1) The chip bonding apparatus of claim 1, further comprising, when in a chip-down configuration, a flipping robotic arm configured to flip over a chip together with a mark thereon. ### Claim 17 (depends on 16) The chip bonding apparatus of claim 16, wherein the flipping robotic arm is implemented as a vertical flipping robotic arm that is disposed between the chip separation unit and the first bonding robotic arm and is configured to pick up a chip from the chip separation unit, flip the chip over and deliver it to the first bonding robotic arm. ### Claim 18 (depends on 16) The chip bonding apparatus of claim 16, wherein the flipping robotic arm comprises a pair of pivotal arms both disposed above the chip alignment unit, one of the pivotal arms configured to pick up a chip from the chip alignment unit and deliver it to the other pivotal arm, thereby flipping over the chip, the other pivotal arm configured to deliver the flipped chip to the chip alignment unit.