# US 2019/0378701 A1 · Deposition guard plate and sputtering device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0378701 A1 - Document ID: US20190378701A1 - Status: Published application - Kind: A1 - Application number: 16/431,416 - Filed: 2019-06-04 - Published: 2019-12-12 - Earliest claimed: 2018-06-06 - Assignees: Ulvac, Inc. - Applicants: Ulvac, Inc. - Inventors: Yoshinori Fujii; Shinya Nakamura; Kazuyoshi Hashimoto - Web page: https://patentgrep.com/patent/US20190378701A1 ## CPC - H01J 37/3488: {Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus} - C23C 14/34: Sputtering - C23C 14/50: Substrate holders - C23C 14/564: {Means for minimising impurities in the coating chamber such as dust, moisture, residual gases} - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) ## Abstract A sputtering device includes a vacuum chamber, a target, a substrate stage, and a deposition guard plate. The target is located in the vacuum chamber. The substrate stage is located in the vacuum char and includes a seat surface on which a substrate is placed. The substrate includes an outer circumferential portion extending beyond the seat surface. The deposition guard plate is located in the vacuum chamber and includes an annular inclined surface extending around the substrate stage. The annular inclined surface is faced toward the target and is a circumferential surface of a truncated cone including an inner edge opposing a rear surface of the outer circumferential portion. An angle between the annular inclined surface and a plane including the seat surface is greater than or equal to 10° and less than or equal to 50°. ## Claims ### Claim 1 A deposition guard plate comprising: an annular inclined surface extending around a substrate stage, the substrate stage including a seat surface on which a substrate is placed, wherein the deposition guard plate is arranged in a vacuum chamber accommodating a target and the substrate stage, the substrate includes an outer circumferential portion extending beyond the seat surface of the substrate stage, the annular inclined surface is faced toward the target and is a circumferential surface of a truncated cone including an inner edge opposing a rear surface of the outer circumferential portion of the substrate, and an angle between the annular inclined surface and a plane including the seat surface is greater than or equal to 10° and less than or equal to 50°. ### Claim 2 (depends on 1) The deposition guard plate according to claim 1, wherein a distance between the inner edge and an outer edge of the annular inclined surface in a radial direction of the annular inclined surface is greater than or equal to 20 mm. ### Claim 3 (depends on 1) The deposition guard plate according to claim 1, further comprising a circumferential wall that gradually rises upward in a vertical direction from an outer edge of the annular inclined surface. ### Claim 4 A deposition guard plate arranged in a vacuum chamber, the deposition guard plate comprising: a first deposition guard plate that surrounds a substrate stage located in the vacuum chamber and includes an annular inclined surface inclined diagonally downward from an inner edge to an outer edge of the first deposition guard plate; and a second deposition guard plate located above the first deposition guard plate to expose the annular inclined surface. ### Claim 5 (depends on 4) The deposition guard plate according to claim 4, wherein the first deposition guard plate includes a circumferential wall rising upward from the outer edge of the annular inclined surface, and the second deposition guard plate includes an umbrella portion that exposes the annular inclined surface and covers the circumferential wall from above. ### Claim 6 A sputtering device, comprising: a vacuum chamber: a target located in the vacuum chamber; a substrate stage located in the vacuum chamber and including a seat surface on which a substrate is placed, wherein the substrate includes an outer circumferential portion extending beyond the seat surface; and a deposition guard plate located in the vacuum chamber and including an annular inclined surface extending around the substrate stage, wherein the annular inclined surface is faced toward the target and is a circumferential surface of a truncated cone including an inner edge opposing a rear surface of the outer circumferential portion of the substrate, and an angle between the annular inclined surface and a plane including the seat surface is greater than or equal to 10° and less than or equal to 50°. ### Claim 7 (depends on 6) The sputtering device according to claim 6, wherein a distance between the inner edge and an outer edge of the annular inclined surface in a radial direction of the annular inclined surface is greater than or equal to 20 mm. ### Claim 8 (depends on 6) The sputtering device according to claim 6, wherein the deposition guard plate further includes a circumferential wall that gradually rises upward in a vertical direction from an outer edge of the annular inclined surface. ### Claim 9 (depends on 6) The sputtering device according to claim 6, wherein the substrate stage is an electrostatic chuck that attracts the substrate with an electrostatic force, the deposition guard plate is a metal plate, and the sputtering device further comprises an insulation ring that opposes a rear surface of the outer circumferential portion and is arranged in a gap between the substrate stage and the deposition guard plate in a radial direction of the annular inclined surface.