# US 2019/0378698 A1 · Wastage determination method and plasma processing apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0378698 A1 - Document ID: US20190378698A1 - Status: Published application - Kind: A1 - Application number: 16/472,339 - Filed: 2017-12-14 - Published: 2019-12-12 - Earliest claimed: 2016-12-26 - Assignees: Tokyo Electron Limited - Applicants: Tokyo Electron Limited - Inventors: Shu KUSANO; Yusuke HIRAYAMA - Web page: https://patentgrep.com/patent/US20190378698A1 ## CPC - H01J 37/32889: {Connection or combination with other apparatus} - G01N 15/06: Investigating concentration of particle suspensions (by weighing G01N5/00; investigating sedimentation of particle suspensions G01N15/04; investigating individual particles G01N15/10) - H10P 50/242: {of Group IV materials} - B08B 7/0035: {by radiant energy, e.g. UV, laser, light beam or the like} - G01N 15/075: by optical means - H01J 2237/335: Cleaning - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B08B: CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL ## Abstract There is provision of a method of determining wastage including: processing a substrate using a plasma generated by multiple gases including fluorine gas; obtaining light emission intensity of each gas of the multiple gases including fluorine gas from the plasma, by an optical emission spectrometer (OES); and calculating a wastage rate of a particular expendable part from the obtained light emission intensity of each gas of the multiple gases including fluorine gas, with reference to a storage section storing a wastage rate of the particular expendable part in association with the light emission intensity of each gas of the multiple gases including fluorine gas. ## Claims ### Claim 1 A method comprising: supplying a fluorine containing gas and an oxygen containing gas into a chamber; forming a plasma from the fluorine containing gas and the oxygen containing gas in the chamber; measuring light emission intensities of fluorine radicals and oxygen radicals in the plasma by an optical emission spectrometer (OES); and determining a wastage rate of an expendable part in the chamber based on the measured light emission intensities of fluorine radicals and oxygen radicals and a look-up table, the look-up table including a relation between light emission intensitites of fluorine radicals and oxygen radicals and a wastage rate of the expendable part. ### Claim 2 (depends on 1) The method according to claim 1, wherein the wastage rate of the expendable part is calculated by Equation (1): V=A×Io+B×If+C×Io×If (1) wherein V is the wastage rate of the expendable part, Io is light emission intensity of oxygen radicals measured by the_OES, If is light emission intensity of fluorine radicals measured by the OES, and A, B, and C are coefficients. ### Claim 3 (depends on 1) The method according to claim 1, further comprising calculating an amount of wastage of the expendable part from the calculated wastage rate; and determining a degree of wastage of the expendable part based on a comparison between the calculated amount of wastage and a first threshold. ### Claim 4 (depends on 3) The method according to claim 3, wherein the amount of wastage is a cumulative value of a product of the calculated wastage rate and a plasma forming time. ### Claim 5 (depends on 1) The method according to claim 1, wherein the expendable part is an adhesive used in the chamber. ### Claim 6 (depends on 5) The method according to claim 5, wherein the adhesive includes any one selected from a group consisting of acrylic material, epoxy resinous material, and silicon based material. ### Claim 7 (depends on 1) The method according to claim 1, wherein the fluorine containing gas is any one selected from a group consisting of CF4, NF3, and SF6. ### Claim 8 (depends on 1) The method according to claim 1, wherein the method is performed after a substrate is unloaded. ### Claim 9 (depends on 1) The method according to claim 1, further comprising calculating an amount of wastage of the expendable part based on the calculated wastage rate; and determining a degree of wastage of the expendable part based on a comparison between the calculated amount of wastage and a first threshold, and based on a comparison between the calculated wastage rate and a second threshold. ### Claim 10 An apparatus comprising: a chamber; a gas inlet configured to supply a fluorine containing gas and an oxygen containing gas into the chamber; a plasma forming unit configured to form a plasma from the fluorine containing gas and the oxygen containing gas supplied into the chamber; an optical emission spectrometer (OES) configured to measure light emission intensitites of fluorine radicals and oxygen radicals in the plasma; an expendable part disposed in the chamber; a storage unit in which a look-up table is stored, the look-up table including a relation between light emission intensitites of fluorine radicals and oxygen radicals and a wastage rate of the expendable part; and a processor configured to determine a wastage rate of the expendable part based on the measured light emission intensitites of fluorine radicals and oxygen radicals and the look-up table. ### Claim 11 (depends on 10) The apparatus according to claim 10, wherein the wastage rate of the expendable part is calculated by Equation (1): V=A×Io+B×If+C×Io×If (1) wherein V is the wastage rate of the expendable part, Io is light emission intensity of oxygen radicals measured by the OES, If is light emission intensity of fluorine radicals measured by the OES, and A, B, and C are coefficients. ### Claim 12 (depends on 10) The apparatus according to claim 10, wherein the processor is configured to calculate an amount of wastage of the expendable part from the calculated wastage rate; and determine a degree of wastage of the expendable part based on a comparison between the calculated amount of wastage and a first threshold. ### Claim 13 (depends on 12) The apparatus according to claim 12, wherein the amount of wastage is a cumulative value of a product of the calculated wastage rate and a plasma forming time. ### Claim 14 (depends on 10) The apparatus according to claim 10, wherein the expendable part is an adhesive used in the chamber. ### Claim 15 (depends on 14) The apparatus according to claim 14, wherein the adhesive includes any one selected from a group consisting of acrylic material, epoxy resinous material, and silicon based material. ### Claim 16 (depends on 10) The apparatus according to claim 10, wherein the fluorine containing gas is any one selected from a group consisting of CF4, NF3, and SF6. ### Claim 17 (depends on 10) The apparatus according to claim 10, wherein the processor is configured to calculate an amount of wastage of the expendable part based on the calculated wastage rate; and determine a degree of wastage of the expendable part based on a comparison between the calculated amount of wastage and a first threshold, and based on a comparison between the calculated wastage rate and a second threshold.