# US 2019/0378696 A1 · Apparatus for suppressing parasitic plasma in plasma enhanced chemical vapor deposition chamber

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- Number: US 2019/0378696 A1
- Document ID: US20190378696A1
- Status: Published application
- Kind: A1
- Application number: 16/429,368
- Filed: 2019-06-03
- Published: 2019-12-12
- Earliest claimed: 2018-06-08
- Assignees: Applied Materials, Inc.
- Applicants: Applied Materials, Inc.
- Inventors: Sai Susmita ADDEPALLI; Satish KATAMBLI; Mayur Govind KULKARNI; Hanish Kumar PANAVALAPPIL KUMARANKUTTY; Vinay K. PRABHAKAR; Edward P. HAMMOND, IV; Juan Carlos ROCHA
- Web page: https://patentgrep.com/patent/US20190378696A1

## CPC

- H01J 37/32651: {Shields, e.g. dark space shields, Faraday shields}
- C23C 16/4586: {Elements in the interior of the support, e.g. electrodes, heating or cooling devices}
- C23C 16/46: characterised by the method used for heating the substrate (C23C16/48, C23C16/50 take precedence)
- C23C 16/50: using electric discharges {(generation and control of plasma in discharge tubes for surface treatment H01J37/32, H01J37/34)}
- C23C 16/5096: {Flat-bed apparatus}
- H01J 37/3244: {Gas supply means}
- H01J 37/32715: {Workpiece holder}
- H01J 37/32724: {Temperature}
- H01J 2237/002: Cooling arrangements
- H01J 2237/3321: CVD [Chemical Vapor Deposition]
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)

## Abstract

Embodiments of the present disclosure generally relate to a metal shield to be used in a PECVD chamber. The metal shield includes a substrate support portion and a shaft portion. The shaft portion includes a tubular wall having a wall thickness. The tubular wall has a supply channel of a coolant channel and a return channel of the coolant channel embedded therein. Each of the supply channel and the return channel is a helix in the tubular wall. The helical supply channel and the helical return channel have the same direction of rotation and are parallel to each other. The supply channel and the return channel are interleaved in the tubular wall. With the supply channel and return channel interleaved in the metal shield, the thermal gradient in the metal shield is reduced.

## Claims

### Claim 1

A metal shield, comprising:
a metal plate;
a metal hollow tube comprising a tubular wall; and
a coolant channel formed in the metal plate and tubular wall of the metal hollow tube, the coolant channel comprising:
a supply channel having a planar spiral pattern in the metal plate and a helical pattern in the tubular wall of the metal hollow tube; and
a return channel having a planar spiral pattern in the metal plate and a helical pattern in the tubular wall of the metal hollow tube, the supply channel and the return channel being interleaved in the metal plate and the tubular wall.

### Claim 2 (depends on 1)

The metal shield of claim 1, wherein the metal shield is fabricated from aluminum, molybdenum, titanium, beryllium, copper, stainless steel, or nickel.

### Claim 3 (depends on 2)

The metal shield of claim 2, wherein the metal shield is fabricated from aluminum.

### Claim 4 (depends on 1)

The metal shield of claim 1, wherein the metal plate and the metal hollow tube are a single piece of material.

### Claim 5 (depends on 1)

The metal shield of claim 1, further comprising a plurality of minimum contact features formed in a surface of the metal plate.

### Claim 6 (depends on 5)

The metal shield of claim 5, wherein the plurality of minimum contact features comprises a plurality of sapphire balls partially embedded in the metal plate.

### Claim 7

A substrate support assembly, comprising:
a heater plate;
a thermal insulating plate having a surface facing the heater plate;
a first plurality of reduced contact features formed on the surface of the thermal insulating plate, the heater plate being in contact with the first plurality of reduced contact features;
a metal shield comprising a metal plate and a metal hollow tube having a metal tubular wall, the metal plate including a surface facing the thermal insulating plate; and
a second plurality of reduced contact features formed on the surface of the metal plate, the thermal insulating plate being in contact with the second plurality of reduced contact features.

### Claim 8 (depends on 7)

The substrate support assembly of claim 7, wherein the heater plate is fabricated from a ceramic material.

### Claim 9 (depends on 8)

The substrate support assembly of claim 8, wherein the thermal insulating plate is fabricated from a ceramic material.

### Claim 10 (depends on 9)

The substrate support assembly of claim 9, wherein the thermal insulating plate is fabricated from aluminum oxide or aluminum nitride.

### Claim 11 (depends on 7)

The substrate support assembly of claim 7, wherein the metal shield is fabricated from aluminum.

### Claim 12 (depends on 7)

The substrate support assembly of claim 7, further comprising a coolant channel formed in the metal plate and the tubular wall of the metal hollow tube, wherein the coolant channel comprises:
a supply channel having a planar spiral pattern in the metal plate and a helical pattern in the tubular wall of the metal hollow tube; and
a return channel having a planar spiral pattern in the metal plate and a helical pattern in the tubular wall of the metal hollow tube, the supply channel and the return channel being interleaved in the metal plate and the tubular wall.

### Claim 13

A process chamber, comprising:
a chamber wall;
a bottom;
a gas distribution plate; and
a substrate support assembly, comprising:
a heater plate;
a thermal insulating plate having a surface facing the heater plate;
a first plurality of reduced contact features formed on the surface of the thermal insulating plate, the heater plate being in contact with the first plurality of reduced contact features;
a metal shield comprising a metal plate and a metal hollow tube having a metal tubular wall, the metal plate including a surface facing the thermal insulating plate; and
a second plurality of reduced contact features formed on the surface of the metal plate, the thermal insulating plate being in contact with the second plurality of reduced contact features.

### Claim 14 (depends on 13)

The process chamber of claim 13, wherein the heater plate is fabricated from a ceramic material.

### Claim 15 (depends on 14)

The process chamber of claim 14, further comprising a heating element embedded in the heater plate.

### Claim 16 (depends on 13)

The process chamber of claim 13, wherein the thermal insulating plate is fabricated from a ceramic material.

### Claim 17 (depends on 13)

The process chamber of claim 13, wherein the thermal insulating plate is fabricated from aluminum oxide or aluminum nitride.

### Claim 18 (depends on 13)

The process chamber of claim 13, wherein the metal shield is fabricated from aluminum.

### Claim 19 (depends on 13)

The process chamber of claim 13, wherein the second plurality of reduced contact features comprises a plurality of sapphire balls partially embedded in the metal plate.

### Claim 20 (depends on 13)

The process chamber of claim 13, further comprising a coolant channel formed in the metal plate and the tubular wall of the metal hollow tube, wherein the coolant channel comprises:
a supply channel having a planar spiral pattern in the metal plate and a helical pattern in the tubular wall of the metal hollow tube; and
a return channel having a planar spiral pattern in the metal plate and a helical pattern in the tubular wall of the metal hollow tube, the supply channel and the return channel being interleaved in the metal plate and the tubular wall.