# US 2019/0378641 A1 · Inductor and inductor manufacturing method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0378641 A1 - Document ID: US20190378641A1 - Status: Published application - Kind: A1 - Application number: 16/477,295 - Filed: 2017-09-27 - Published: 2019-12-12 - Earliest claimed: 2017-01-26 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Jeong Il KANG - Web page: https://patentgrep.com/patent/US20190378641A1 ## CPC - H01F 27/02: Casings - H01F 17/04: with magnetic core - H01F 27/2823: {Wires (H01F27/2866 takes precedence)} - H01F 27/2828: {Construction of conductive connections, of leads} - H01F 27/292: {Surface mounted devices} - H01F 27/30: Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support - H01F 27/306: {Fastening or mounting coils or windings on core, casing or other support} - H01F 27/32: Insulating of coils, windings, or parts thereof - H01F 27/327: {Encapsulating or impregnating (encapsulating coil and core H01F27/022)} - H01F 37/00: Fixed inductances not covered by group H01F17/00 - H01F 41/06: Coil winding - H01F 41/127: {Encapsulating or impregnating (encapsulating coil and core H01F41/005)} - H01F 2017/048: {with encapsulating core, e.g. made of resin and magnetic powder} - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ## Abstract An inductor and a method of manufacturing the same are provided. The inductor according to an embodiment of the disclosure includes a winding wire including opposite end portions spaced away from each other and a housing fixing at least a part of a rest of the winding wire. The housing is formed through injection molding including positioning the winding wire inside a mold to expose the opposite end portions, injecting plastic resin into an inner space of the mold, and solidifying the resin. ## Claims ### Claim 1 An inductor, comprising: a winding wire configured to have a specific shape; and a housing configured to expose opposite end portions of the winding wire and to fix at least a part of a rest of the winding wire in the housing, and wherein each of the opposite end portions is a region having a specific length from each of opposite edge sides of the winding wire, and wherein the housing includes a nonmagnetic material having a nonconductive property. ### Claim 2 (depends on 1) The inductor of claim 1, wherein the winding wire is configured to wind a self-bonding conducting wire in the specific shape to expose the opposite end portions of the winding wire. ### Claim 3 (depends on 1) The inductor of claim 1, wherein the opposite end portions of the winding wire are mounted on a printed circuit board to be soldered to the printed circuit board. ### Claim 4 (depends on 3) The inductor of claim 3, wherein the opposite end portions of the winding wire are soldered before being mounted on the printed circuit board. ### Claim 5 (depends on 3) The inductor of claim 3, wherein the opposite end portions of the winding wire are bent in a mounting direction of the printed circuit board the opposite end portions of the winding wire protrude toward a direction different from the mounting direction of the printed circuit board. ### Claim 6 (depends on 1) The inductor of claim 1, further comprising: a dummy pin, wherein the dummy pin is installed in at least one groove formed at a corner region of the housing where the opposite end portions of the winding wire are not disposed such that the inductor is fixed to a printed circuit board. ### Claim 7 (depends on 1) The inductor of claim 1, wherein the winding wire includes a sheath made of a material having a first melting point, wherein the housing is made of a material having a second melting point and the second melting point is less than the first melting point, and wherein injection molding is performed at a temperature above the second melting point and below the first melting point. ### Claim 8 (depends on 1) The inductor of claim 1, further comprising: a magnetic core configured to be fixed to the housing to be spaced away from the opposite end portions of the winding wire. ### Claim 9 A method of manufacturing an inductor, the method comprising: forming a winding wire by winding a conducting wire to have a specific shape; and forming a housing fixing at least a part of a rest of the winding wire except for opposite end portions of the winding wire in the housing, wherein each of the opposite end portions is a region having a specific length from each of opposite edge sides of the winding wire, wherein the forming of the housing includes: seating the at least a part of the rest of the winding wire in a mold to expose the opposite end portions of the winding wire; and performing injection molding using the mold, which includes the winding wire. ### Claim 10 (depends on 9) The method of claim 9, wherein the forming of the winding wire includes: winding a self-bonding wire using a frame having the specific shape; and separating the winding wire from the frame having the specific shape. ### Claim 11 (depends on 9) The method of claim 9, further comprising: bending the opposite end portions of the winding wire in a mounting direction of a printed circuit board to be seated in a plurality of grooves formed in the housing; and bonding the opposite end portions of the winding wire seated in the plurality of grooves to the housing, when the opposite end portions of the winding wire protrude from the housing toward a direction different from the mounting direction of the printed circuit board. ### Claim 12 (depends on 9) The method of claim 9, further comprising: soldering the opposite end portions of the winding wire before being mounted on a printed circuit board. ### Claim 13 (depends on 9) The method of claim 9, wherein the forming of the housing includes: positioning the at least a part of the rest of the winding wire inside the mold; injecting resin, which is molten at a temperature less than a melting point of a sheath of the winding wire, into an inner space of the mold; and solidifying the molten resin. ### Claim 14 (depends on 9) The method of claim 9, further comprising: installing at least one dummy pin in at least one groove formed at a corner region where the opposite end portions of the winding wire are not disposed. ### Claim 15 (depends on 9) The method of claim 9, further comprising: covering at least a part of the housing using a magnetic core to be spaced away from the opposite end portions of the winding wire.