# US 2019/0378632 A1 · Plated product and method of manufacturing the same

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- Number: US 2019/0378632 A1
- Document ID: US20190378632A1
- Status: Published application
- Kind: A1
- Application number: 16/410,970
- Filed: 2019-05-13
- Published: 2019-12-12
- Earliest claimed: 2018-06-11
- Assignees: Cheng Uei Precision Industry Co., Ltd.
- Applicants: Cheng Uei Precision Industry Co., Ltd.
- Inventors: CHIU-HSIEN YANG; QI-WEN XIAO; PENG LI
- Web page: https://patentgrep.com/patent/US20190378632A1

## CPC

- H01B 1/02: mainly consisting of metals or alloys
- B32B 15/01: all layers being exclusively metallic {(making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00)}
- B32B 15/018: {one layer being formed of a noble metal or a noble metal alloy}
- B32B 15/04: comprising metal as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042)}
- B32B 15/043: {of metal (B32B15/01 takes precedence)}
- C23C 18/08: characterised by the deposition of metallic material
- C23C 18/165: {Multilayered product (layered product B32B)}
- C23C 18/1651: {Two or more layers only obtained by electroless plating}
- C23C 18/1653: {Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating}
- C23C 18/31: Coating with metals
- C23C 18/32: Coating with nickel, cobalt or mixtures thereof with phosphorus or boron (C23C18/50 takes precedence)
- C23C 18/38: Coating with copper
- C23C 18/42: Coating with noble metals
- C23C 18/54: Contact plating, i.e. electroless electrochemical plating
- C23C 28/021: {including at least one metal alloy layer}
- C23C 28/023: {only coatings of metal elements only}
- C23C 30/00: Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process (C23C26/00, C23C28/00 take precedence)
- C23C 30/005: {on hard metal substrates}
- H01R 13/03: characterised by the material, e.g. plating, or coating materials
- C25D 5/14: two or more layers being of nickel or chromium, e.g. duplex or triplex layers
- Y10T 428/12861: Group VIII or IB metal-base component
- Y10T 428/12868: Group IB metal-base component alternative to platinum group metal-base component [e.g., precious metal, etc.]
- Y10T 428/12875: Platinum group metal-base component
- Y10T 428/12882: Cu-base component alternative to Ag-, Au-, or Ni-base component
- Y10T 428/12889: Au-base component
- Y10T 428/12903: Cu-base component
- Y10T 428/1291: Next to Co-, Cu-, or Ni-base component
- Y10T 428/12931: Co-, Fe-, or Ni-base components, alternative to each other
- Y10T 428/12937: Co- or Ni-base component next to Fe-base component
- Y10T 428/12944: Ni-base component
- Y10T 428/24942: including components having same physical characteristic in differing degree
- Y10T 428/2495: Thickness [relative or absolute]
- Y10T 428/24959: of adhesive layers
- Y10T 428/24967: Absolute thicknesses specified
- Y10T 428/24975: No layer or component greater than 5 mils thick
- Y10T 428/263: Coating layer not in excess of 5 mils thick or equivalent
- Y10T 428/264: Up to 3 mils
- Y10T 428/265: 1 mil or less
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A plated product includes a component and an overall layer plated on a surface of the component. The overall layer includes a copper layer, a nickel layer, a nickel-tungsten layer, an inner golden layer, a palladium layer, an outer golden layer and a rhodium-ruthenium layer. The copper layer is plated on a surface of the component. The nickel layer, the nickel-tungsten layer, the inner golden layer, the palladium layer, the outer golden layer and the rhodium-ruthenium layer are plated on a surface of the copper layer in sequence.

## Claims

### Claim 1

A plated product, comprising:
a component; and
an overall layer plated on a surface of the component, the overall layer including a copper layer, a nickel layer, a nickel-tungsten layer, an inner golden layer, a palladium layer, an outer golden layer and a rhodium-ruthenium layer, the copper layer being plated on a surface of the component, the nickel layer, the nickel-tungsten layer, the inner golden layer, the palladium layer, the outer golden layer and the rhodium-ruthenium layer being plated on a surface of the copper layer in sequence.

### Claim 2 (depends on 1)

The plated product as claimed in claim 1, wherein a total thickness of the overall layer is ranged between 2.4 μm and 17.5 μm.

### Claim 3 (depends on 1)

The plated product as claimed in claim 1, wherein a thickness of the copper layer is ranged between 0.5 μm and 3.5 μm, a thickness of the nickel layer is ranged between 0.5 μm and 2.5 μm, a thickness of the nickel-tungsten layer is ranged between 1 μm and 3.5 μm, a thickness of the inner golden layer is ranged between 0.075 μm and 2.5 μm, a thickness of the palladium layer is ranged between 0.125 μm and 2.0 μm, a thickness of the outer golden layer is ranged between 0.075 μm and 1.0 μm, and a thickness of the rhodium-ruthenium layer is ranged between 0.125 μm and 2.5 μm.

### Claim 4 (depends on 1)

The plated product as claimed in claim 1, wherein the nickel layer is plated on the surface of the copper layer, the nickel-tungsten layer is plated on a surface of the nickel layer, the inner golden layer is plated on a surface of the nickel-tungsten layer, the palladium layer is plated on a surface of the inner golden layer, the outer golden layer is plated on a surface of the palladium layer, and the rhodium-ruthenium layer is plated on a surface of the outer golden layer.

### Claim 5

A plated product, comprising:
a component; and
an overall layer plated on a surface of the component, the overall layer including a copper layer, a nickel layer, a nickel-tungsten layer, an inner golden layer, a palladium layer, an outer golden layer and a rhodium-ruthenium layer, the copper layer being plated on a surface of the component, the nickel layer, the nickel-tungsten layer, the inner golden layer, the palladium layer, the outer golden layer and the rhodium-ruthenium layer being plated on a surface of the copper layer in sequence;
wherein a total thickness of the overall layer is ranged between 2.4 μm and 17.5 μm.

### Claim 6 (depends on 5)

The plated product as claimed in claim 5, wherein a thickness of the copper layer is ranged between 0.5 μm and 3.5 μm, a thickness of the nickel layer is ranged between 0.5 μm and 2.5 μm, a thickness of the nickel-tungsten layer is ranged between 1 μm and 3.5 μm, a thickness of the inner golden layer is ranged between 0.075 μm and 2.5 μm, a thickness of the palladium layer is ranged between 0.125 μm and 2.0 μm, a thickness of the outer golden layer is ranged between 0.075 μm and 1.0 μm, and a thickness of the rhodium-ruthenium layer is ranged between 0.125 μm and 2.5 μm.

### Claim 7 (depends on 5)

The plated product as claimed in claim 5, wherein the nickel layer is plated on the surface of the copper layer, the nickel-tungsten layer is plated on a surface of the nickel layer, the inner golden layer is plated on a surface of the nickel-tungsten layer, the palladium layer is plated on a surface of the inner golden layer, the outer golden layer is plated on a surface of the palladium layer, and the rhodium-ruthenium layer is plated on a surface of the outer golden layer.

### Claim 8

A method of manufacturing a plated product, comprising:
preparing a component;
plating a copper layer on a surface of the component;
plating a nickel layer on a surface of the copper layer;
plating a nickel-tungsten layer on a surface of the nickel layer;
plating an inner golden layer on a surface of the nickel-tungsten layer;
plating a palladium layer on a surface of the inner golden layer;
plating an outer golden layer on a surface of the palladium layer; and
plating a rhodium-ruthenium layer on a surface of the outer golden layer.

### Claim 9 (depends on 8)

The method of manufacturing the plated product as claimed in claim 8, wherein a total thickness of an overall layer which includes the copper layer, the nickel layer, the nickel-tungsten layer, the inner golden layer, the palladium layer, the outer golden layer and the rhodium-ruthenium layer is ranged between 2.4 μm and 17.5 μm.

### Claim 10 (depends on 8)

The method of manufacturing the plated product as claimed in claim 8, wherein a thickness of the copper layer is ranged between 0.5 μm and 3.5 μm, a thickness of the nickel layer is ranged between 0.5 μm and 2.5 μm, a thickness of the nickel-tungsten layer is ranged between 1 μm and 3.5 μm, a thickness of the inner golden layer is ranged between 0.075 μm and 2.5 μm, a thickness of the palladium layer is ranged between 0.125 μm and 2.0 μm, a thickness of the outer golden layer is ranged between 0.075 μm and 1.0 μm, and a thickness of the rhodium-ruthenium layer is ranged between 0.125 μm and 2.5 μm.