# US 2019/0377259 A1 · Molding apparatus for molding composition on substrate with mold, and article manufacturing method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0377259 A1 - Document ID: US20190377259A1 - Status: Published application - Kind: A1 - Application number: 16/419,920 - Filed: 2019-05-22 - Published: 2019-12-12 - Earliest claimed: 2018-06-11 - Assignees: Canon Kabushiki Kaisha - Applicants: Canon Kabushiki Kaisha - Inventors: Atsushi Kimura - Web page: https://patentgrep.com/patent/US20190377259A1 ## CPC - G03F 7/0002: {Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping} - B29C 59/00: Surface shaping {of articles}, e.g. embossing; Apparatus therefor {(in-mould printing B29C37/0025; by using liquids B29C71/0009; by using gases without chemical reaction B29C71/009; for decorating in general B44; abrasive blasting B24C; chemical aspects C08J7/00)} - B29C 59/002: {Component parts, details or accessories; Auxiliary operations} - B29C 59/02: by mechanical means, e.g. pressing {(B29C59/007 takes precedence; embossing expanded porous articles B29C44/5627)} - B29C 59/022: {characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor} - B29C 59/026: {of layered or coated substantially flat surfaces} - B29C 59/04: using rollers or endless belts - B29C 59/046: {for layered or coated substantially flat surfaces} - B29C 59/16: by wave energy or particle radiation {, e.g. infrared heating (B29C59/007 takes precedence)} - G03F 7/161: {using a previously coated surface, e.g. by stamping or by transfer lamination} - G03F 7/70483: {Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring} - G03F 7/70491: {Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes} - G03F 7/70616: {Monitoring the printed patterns} - G03F 7/7065: {Defects, e.g. optical inspection of patterned layer for defects} - G03F 7/70808: {Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus} - G03F 7/7085: {Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load} - G03F 7/70908: {Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus} - G03F 7/70916: {Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps} - G03F 9/7049: {Technique, e.g. interferometric} - G03F 9/7069: {Alignment mark illumination, e.g. darkfield, dual focus} - G03F 9/7076: {Mark details, e.g. phase grating mark, temporary mark} - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) ## Abstract A molding apparatus that molds a composition on a substrate with a mold includes a mold holding unit configured to hold the mold, a substrate holding unit configured to hold the substrate, a first elastic member configured to apply a first elastic force to the mold holding unit in a direction away from the substrate holding unit, and a control unit configured to cause the mold holding unit to move in the direction away from the substrate holding unit in a case where the control unit determines that an abnormality has occurred. ## Claims ### Claim 1 A molding apparatus that molds a composition on a substrate with a mold, the molding apparatus comprising: a mold holding unit configured to hold the mold; a substrate holding unit configured to hold the substrate; a first elastic member configured to apply a first elastic force to the mold holding unit in a direction away from the substrate holding unit; and a control unit configured to cause the mold holding unit to move in the direction away from the substrate holding unit in a case where the control unit determines that an abnormality has occurred. ### Claim 2 (depends on 1) The molding apparatus according to claim 1, wherein the control unit determines that the abnormality has occurred based on information used for controlling the mold holding unit. ### Claim 3 (depends on 2) The molding apparatus according to claim 2, further comprising a first measurement unit configured to measure a position of the mold holding unit, wherein the information used for controlling the mold holding unit includes a difference between the position of the mold holding unit measured by the first measurement unit and a target position of the mold holding unit. ### Claim 4 (depends on 1) The molding apparatus according to claim 1, wherein the control unit determines that the abnormality has occurred based on a distance between the substrate holding unit and the mold holding unit. ### Claim 5 (depends on 1) The molding apparatus according to claim 1, wherein the control unit determines that the abnormality has occurred in a case where a position of the mold holding unit in the direction exceeds a position apart from the position of the mold holding unit by a certain distance when the mold held by the mold holding unit contacts the composition on the substrate held by the substrate holding unit. ### Claim 6 (depends on 5) The molding apparatus according to claim 5, wherein the certain distance is determined based on a deformation amount of the mold in the direction. ### Claim 7 (depends on 1) The molding apparatus according to claim 1, wherein the control unit is configured to apply a first force to the mold holding unit in a direction in which the mold holding unit approaches the substrate holding unit, in a case where the control unit determines that the abnormality has occurred, and wherein a magnitude of the first force is smaller than a magnitude of the first elastic force. ### Claim 8 (depends on 1) The molding apparatus according to claim 1, further comprising a second elastic member configured to apply a second elastic force to the substrate holding unit in a direction away from the mold holding unit, wherein the control unit causes the substrate holding unit to move in the direction away from the mold holding unit in a case where the control unit determines that the abnormality has occurred. ### Claim 9 (depends on 8) The molding apparatus according to claim 8, wherein the control unit determines that the abnormality has occurred based on information used for controlling the substrate holding unit. ### Claim 10 (depends on 9) The molding apparatus according to claim 9, further comprising a second measurement unit configured to measure a position of the substrate holding unit, wherein the information used for controlling the substrate holding unit includes a difference between the position of the substrate holding unit measured by the second measurement unit and a target position of the substrate holding unit. ### Claim 11 (depends on 1) The molding apparatus according to claim 1, further comprising a pressure adjustment unit configured to adjust a pressure in a space formed between the mold holding unit and the mold held by the mold holding unit, wherein the control unit determines that the abnormality has occurred based on information used for controlling the pressure adjustment unit. ### Claim 12 A molding apparatus that molds a composition on a substrate with a mold, the molding apparatus comprising: a mold holding unit configured to hold the mold; a substrate holding unit configured to hold the substrate; an elastic member configured to apply an elastic force to the substrate holding unit in a direction away from the mold holding unit; and a control unit configured to cause the substrate holding unit to move in the direction away from the mold holding unit in a case where the control unit determines that an abnormality has occurred. ### Claim 13 (depends on 12) The molding apparatus according to claim 12, wherein the control unit determines that the abnormality has occurred based on information used for controlling the substrate holding unit. ### Claim 14 (depends on 1) The molding apparatus according to claim 1, wherein the molding apparatus brings a pattern of the mold into contact with the composition to form a pattern of the composition. ### Claim 15 (depends on 1) The molding apparatus according to claim 1, wherein the molding apparatus brings a planar portion of the mold into contact with the composition to make the composition flat. ### Claim 16 An article manufacturing method comprising: forming a composition on a substrate with use of a molding apparatus configured to mold the composition on the substrate with a mold; processing the substrate on which the composition is formed; and manufacturing an article using the processed substrate, wherein the molding apparatus comprises: a mold holding unit configured to hold the mold; a substrate holding unit configured to hold the substrate; a first elastic member configured to apply a first elastic force to the mold holding unit in a direction away from the substrate holding unit; and a control unit configured to cause the mold holding unit to move in the direction away from the substrate holding unit in a case where the control unit determines that an abnormality has occurred.