# US 2019/0377142 A1 · Fiber-less photonic system in an integrated package

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- Number: US 2019/0377142 A1
- Document ID: US20190377142A1
- Status: Published application
- Kind: A1
- Application number: 16/434,838
- Filed: 2019-06-07
- Published: 2019-12-12
- Earliest claimed: 2018-06-07
- Assignees: University College Cork
- Applicants: University College Cork
- Inventors: Peter O'Brien
- Web page: https://patentgrep.com/patent/US20190377142A1

## CPC

- G02B 6/4239: {Adhesive bonding; Encapsulation with polymer material}
- G02B 6/4292: {the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements}
- G02B 1/005: {made of photonic crystals or photonic band gap materials (photonic band-gap structures or photonic lattices in integrated optics G02B6/1225; photonic band-gap structures or photonic lattices in optical fibres G02B6/02295)}
- G02B 6/3885: {Multicore or multichannel optical connectors, i.e. one single ferrule containing more than one fibre, e.g. ribbon type (optical ribbon cable G02B6/4403, G02B6/448)}
- G02B 6/4249: {comprising arrays of active devices and fibres}
- G02B 6/4253: {by embedding housing components in an adhesive or a polymer material (G02B6/4212 takes precedence)}
- H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)}
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

The invention provides a photonic package system comprising at least two optical alignment pins integrated on a package substrate. A key feature of this invention is the addition of alignment structures within the package. When combined with the use of micro optics it enables a ‘fiber-less’ photonic package system that requires no physical connection between and optical fiber and the photonic package system.

## Claims

### Claim 1

A photonic package system comprising:
a substrate layer;
at least two optical alignment pins integrated on the substrate layer and protruding from the substrate layer;
a photonic device positioned and aligned with respect to the two pins; and
an optical device configured to receive an optical signal and aligned with respect to the two pins.

### Claim 2 (depends on 1)

The photonic system of claim 1 comprising a silicone or soft polymer encapsulation material.

### Claim 3 (depends on 1)

The photonic system of claim 1 comprising a protective encapsulation material such that the optical device and pins are visible.

### Claim 4 (depends on 1)

The photonic system of claim 1 wherein the optical device comprises at least one micro optical lens connected to the photonic device and configured with the function of expanding an optical beam-width between the photonic device and an external separate optical fiber source.

### Claim 5 (depends on 4)

The photonic system of claim 4 wherein the separate optical fibre source comprises two female portions or slots dimensioned to receive the pins in use.

### Claim 6 (depends on 1)

The photonic system of claim 1 wherein the optical device comprises a micro optical lens.

### Claim 7 (depends on 1)

The photonic system of claim 1 wherein the alignment pins protrude in a vertical position from the substrate layer.

### Claim 8 (depends on 1)

The photonic system of claim 1 wherein the alignment pins protrude in a horizontal or angled position with respect to the substrate layer.

### Claim 9 (depends on 1)

The photonic system of claim 1 wherein the substrate comprises at least one of a metal, ceramic, silicon or organic PCB material.

### Claim 10 (depends on 1)

The photonic system of claim 1 comprising a plastic over-moulding configured to provide a hermetic encapsulation.

### Claim 11 (depends on 1)

The photonic system of claim 1 comprising an integrated heatsink.

### Claim 12

A method of making a photonic package system comprising the steps of:
providing a substrate layer;
integrating at least two optical alignment pins on the substrate layer and protruding from the substrate layer;
positioning a photonic device with respect to the two pins; and
aligning an optical device and configured to receive an optical signal with respect to the two alignment pins.