# US 2019/0376889 A1 · Sensor wiring substrate, sensor package, and sensor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0376889 A1 - Document ID: US20190376889A1 - Status: Published application - Kind: A1 - Application number: 16/463,554 - Filed: 2017-11-17 - Published: 2019-12-12 - Earliest claimed: 2016-11-28 - Assignees: KYOCERA Corporation - Applicants: KYOCERA Corporation - Inventors: Yuusuke TAKEI; Ryuuji MORI - Web page: https://patentgrep.com/patent/US20190376889A1 ## CPC - G01N 21/3504: for analysing gases, e.g. multi-gas analysis - G01N 29/2418: {using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics (photoacoustic cells G01N21/1702; measuring characteristics of vibrations by using radiation-sensitive means G01H9/00; acousto-optical conversion techniques for short-range imaging G01S15/8965; sound-producing devices using laser bundle G10K15/046)} - G01N 21/00: Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light (G01N3/00 - G01N19/00 take precedence) - G01N 21/37: using pneumatic detection {(opto-acoustic detection G01N21/1702)} - G01N 29/02: Analysing fluids (using acoustic emission techniques G01N29/14 {; constructional or flow details for analysing fluids G01N29/222; optoacoustic fluid cells G01N29/2425}) - G01N 29/022: {Fluid sensors based on microsensors, e.g. quartz crystal-microbalance [QCM], surface acoustic wave [SAW] devices, tuning forks, cantilevers, flexural plate wave [FPW] devices (microdevices per se B81B)} - G01N 29/222: {Constructional or flow details for analysing fluids (optoacoustic fluid cells G01N29/2425)} - G01N 29/24: Probes {(transducers for acoustic waves B06B, G10K; for measuring G01H)} - G01N 29/2425: {optoacoustic fluid cells therefor} - G01N 29/2431: {using other means for acoustic excitation, e.g. heat, microwaves, electron beams (sound producing devices not otherwise provided for G10K15/04)} - G01N 29/32: Arrangements for suppressing undesired influences, e.g. temperature or pressure variations {, compensating for signal noise} - H04R 1/005: {using digitally weighted transducing elements} - H10W 76/47: Solid or gel fillings - G01N 2291/021: Gases - G01N 2291/101: one transducer - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) - H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The present invention relates to a sensor wiring substrate in which a decrease in detection accuracy is suppressed, a sensor package, and a sensor device. A gas sensor wiring substrate includes a substrate having a first accommodation recessed portion for accommodating a microphone element and a second accommodation recessed portion for accommodating an infrared light emitting element, and connection wiring. In the gas sensor wiring substrate, thermal resistance of a heat transfer path between a bottom surface of the first accommodation recessed portion and a bottom surface of the second accommodation recessed portion is greater than thermal resistance in any position of an imaginal heat transfer path in case of a depth of the first accommodation recessed portion identical with a depth of the second accommodation recessed portion. For example, the depth of the second accommodation recessed portion is deeper than the depth of the first accommodation recessed portion. ## Claims ### Claim 1 A sensor wiring substrate comprising: a plate-like substrate comprising a plurality of dielectric layers that are laminated, and a first accommodation recessed portion for accommodating an acoustic element and a second accommodation recessed portion for accommodating an infrared light emitting element that are disposed on a first surface, wherein thermal resistance of a heat transfer path between a bottom surface of the first accommodation recessed portion and a bottom surface of the second accommodation recessed portion is greater than thermal resistance in any position of an imaginal heat transfer path in a case of a depth of the first accommodation recessed portion identical with a depth of the second accommodation recessed portion; and connection wiring comprising a first connection terminal disposed in the first accommodation recessed portion for electrically connecting to the acoustic element, a second connection terminal disposed in the second accommodation recessed portion for electrically connecting to the infrared light emitting element, external connection terminals for electrically connecting to an external circuit, and internal wiring electrically connecting the first connection terminal and the second connection terminal to the external connection terminals, respectively. ### Claim 2 (depends on 1) The sensor wiring substrate according to claim 1, wherein the depth of the first accommodation recessed portion is different from the depth of the second accommodation recessed portion. ### Claim 3 (depends on 2) The sensor wiring substrate according to claim 2, wherein the depth of the second accommodation recessed portion is deeper than the depth of the first accommodation recessed portion. ### Claim 4 (depends on 2) The sensor wiring substrate according to claim 2, further comprising a first heat transfer member: which has thermal conductivity higher than that of each of the plurality of dielectric layers; which is embedded between the first accommodation recessed portion and the second accommodation recessed portion of the substrate; and a portion of which is exposed to at least one of a second surface of the substrate opposite to the first surface and a side surface of the substrate. ### Claim 5 (depends on 2) The sensor wiring substrate according to claim 2, further comprising a second heat transfer member: which has thermal conductivity higher than that of each of the plurality of dielectric layers; which is embedded at least one of between the second accommodation recessed portion and a second surface of the substrate opposite to the first surface, and between the second accommodation recessed portion and a side surface of the substrate; and a portion of which is exposed to at least one of the side surface of the substrate and the second surface of the substrate. ### Claim 6 (depends on 1) The sensor wiring substrate according to claim 1, further comprising a low heat conduction portion having thermal conductivity lower than that of each of the plurality of dielectric layers, and disposed between the first accommodation recessed portion and the second accommodation recessed portion of the substrate. ### Claim 7 (depends on 6) The sensor wiring substrate according to claim 6, wherein in a cross-sectional view, the low heat conduction portion comprises: one end portion located between the first surface of the substrate and the bottom surface of the second accommodation recessed portion, and an other end portion extending to a second surface opposite to the first surface of the substrate. ### Claim 8 (depends on 6) The sensor wiring substrate according to claim 6, wherein the low heat conduction portion is disposed from the first surface to a second surface opposite to the first surface. ### Claim 9 (depends on 6, 7, 8) The sensor wiring substrate according to any one of claims 6 to 8, wherein the low heat conduction portion is further disposed between the second accommodation recessed portion and a side surface of the substrate. ### Claim 10 (depends on 6) The sensor wiring substrate according to claim 6, wherein the low heat conduction portion comprises a void portion. ### Claim 11 (depends on 1) A sensor package comprising: the sensor wiring substrate according to claim 1; and a cover body covering the first surface of the substrate with a space between the cover body and the first surface, wherein a gaseous substance for detection is to be introduced into the space. ### Claim 12 (depends on 11) The sensor package according to claim 11, further comprising: a first lid that closes an opening of the first accommodation recessed portion and is transparent to infrared light; and a detection gas that is sealed in the first accommodation recessed portion, and absorbs the infrared light and generates a sound wave. ### Claim 13 (depends on 11) The sensor package according to claim 11, further comprising a second lid that closes an opening of the second accommodation recessed portion and is transparent to the infrared light. ### Claim 14 (depends on 13) The sensor package according to claim 13, further comprising a band pass filter disposed on the second lid and being transparent only to infrared light having a wavelength range absorbed by the gaseous substance to be detected, and by the detection gas. ### Claim 15 (depends on 13) The sensor package according to claim 13, further comprising an aperture member which is disposed on the second lid and comprises an aperture smaller than the opening of the second accommodation recessed portion. ### Claim 16 (depends on 11) The sensor package according to claim 11, further comprising a reflection member which is disposed on an inner surface of the cover body and reflects infrared light emitted from the infrared light emitting element. ### Claim 17 (depends on 11) A sensor device comprising: the sensor package according to claim 11; the acoustic element in the first accommodation recessed portion; and the infrared light emitting element in the second accommodation recessed portion.