# US 2019/0376676 A1 · Housing for light source > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0376676 A1 - Document ID: US20190376676A1 - Status: Published application - Kind: A1 - Application number: 16/439,308 - Filed: 2019-06-12 - Published: 2019-12-12 - Earliest claimed: 2018-06-12 - Assignees: STMicroelectronics (Research & Development) Limited; STMicroelectronics (Grenoble 2) SAS - Applicants: Stmicroelectronics (Research & Development) Limited; Stmicroelectronics (Grenoble 2) SAS - Inventors: Joseph HANNAN; Stuart ROBERTSON; Romain COFFY; Jean-Michel RIVIERE - Web page: https://patentgrep.com/patent/US20190376676A1 ## CPC - F21V 3/00: Globes; Bowls; Cover glasses (with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506) - F21K 9/20: Light sources comprising attachment means - F21V 23/002: {Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm} - F21V 23/006: {the substrate being distinct from the light source holder} - F21V 23/04: the elements being switches (safety devices F21V25/00) - F21V 23/06: the elements being coupling devices {, e.g. connectors} - H01S 5/02257: using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing - H01S 5/06825: {Protecting the laser, e.g. during switch-on/off, detection of malfunctioning or degradation} - H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings - H10W 72/30: Die-attach connectors - F21Y 2115/30: Semiconductor lasers - H01S 5/02216: Butterfly-type, i.e. with electrode pins extending horizontally from the housings - H01S 5/042: Electrical excitation {; Circuits therefor (monolithically integrated laser drive components H01S5/0261)} - H10H 20/85: Packages - H10H 20/855: Optical field-shaping means, e.g. lenses - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 76/60: Seals - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED ## Abstract The disclosure concerns a housing for a light source mounted on a substrate, the housing comprising: a molded body having an opening permitting the passage of a light beam generated by the light source; one or more surfaces for receiving a diffuser; and first and second conducting pins traversing the molded body, each pin abutting one of said surfaces. ## Claims ### Claim 1 A housing for a light source mounted on a substrate, the housing comprising: a molded body having an opening configured to permit passage of a light beam generated by the light source; one or more surfaces configured to receive a diffuser; and first and second conducting pins extending through the molded body, surfaces of the first and second conducting pins exposed atone of the one or more surfaces. ### Claim 2 (depends on 1) The housing of claim 1, wherein at least one pin chosen among the first and second conducting pins has a uniform cross-section along its length. ### Claim 3 (depends on 1) The housing of claim 1, wherein the molded body is formed of at least one material chose among plastic and resin, and wherein the first and second conducting pins are formed of a metal. ### Claim 4 (depends on 1) The housing of claim 1, further comprising the diffuser fixed to the one or more surfaces of the molded body, wherein the diffuser comprises a partially transparent zone permitting transmission of a light beam and a conductive coating comprising one or more conductive tracks electrically connecting the first and second conductive pins. ### Claim 5 (depends on 4) The housing of claim 4, wherein the conductive coating comprises at least one material chose among copper, tungsten, and gold. ### Claim 6 (depends on 4) The housing of claim 4, wherein the conducting coating comprises ITO (Indium Tin Oxide). ### Claim 7 An electronic device, comprising: a substrate having a first surface; a light source coupled to the first surface, the light source configured to generate a light beam; a diffuser; and a housing coupled to the first surface and covering the light source, the housing including: a through opening configured to permit passage of the light beam; a receiving surface, the diffuser coupled to the receiving surface; and first and second conductive pins extending through the housing, wherein the diffuser is coupled to the first and second conductive pins. ### Claim 8 (depends on 7) The electronic device of claim 7, further comprising first and second contacts coupled to ends of first and second conductive pins, respectively, wherein the first and second contacts couple the first and second conductive pins to the diffuser. ### Claim 9 (depends on 7) The electronic device of claim 7, wherein the housing includes a recess, wherein the receiving surface is formed at a bottom surface of the recess. ### Claim 10 (depends on 7) The electronic device of claim 7, further comprising a circuit coupled to the first and second conductive pins. ### Claim 11 (depends on 10) The electronic device of claim 10, wherein the circuit is located in the substrate. ### Claim 12 (depends on 10) The electronic device of claim 10, wherein the circuit is configured to supply a supply voltage to the light source through the first and second conducting pins. ### Claim 13 (depends on 7) The electronic device of claim 7, further comprising a circuit configured to supply a supply voltage to the light source through a switch that is controlled by an activation signal provided by the first and second conducting pins. ### Claim 14 (depends on 7) The electronic device of claim 7, further comprising a circuit configured to detect a detachment of the diffuser from the housing based on a voltage drop across the first and second conducting pins and to deactivate the light source when detachment of the diffuser is detected. ### Claim 15 A method, comprising: coupling first and second conductive pins to first and second contacts, respectively, on a surface of a substrate, the substrate including a diffuser verification circuit, wherein the first and second pins are electrically coupled to the diffuser verification circuit; and molding a housing around the first and second conductive pins. ### Claim 16 (depends on 15) The method of claim 15, further comprising: coupling a light source to the surface of the substrate; and coupling a diffuser to a surface of the housing and to the first and second conductive pins, the diffuser covering a through opening in the housing and the light source. ### Claim 17 (depends on 15) The method of claim 15, further comprising: prior to coupling the diffuser, forming conductive coating layers on surfaces of the first and second conductive pins, wherein coupling the diffuser comprises coupling the diffuser to the conductive coating layers. ### Claim 18 A method, comprising: molding a housing on a surface of a substrate, the housing including first and second through holes that exposes first and second contacts on the surface of the housing, the substrate including a diffuser verification circuit that is coupled to the first and second contacts; and inserting first and second conductive pins into the first and second through holes, respectively, such that the first and second pins are electrically coupled to the first and second contacts, respectively. ### Claim 19 (depends on 18) The method of claim 18, further comprising: coupling a light source to the surface of the substrate; and coupling a diffuser to a surface of the housing and to the first and second conductive pins, the diffuser covering a through opening in the housing and the light source. ### Claim 20 (depends on 18) The method of claim 18, further comprising: prior to coupling the diffuser, forming conductive coating layers on surfaces of the first and second conductive pins, wherein coupling the diffuser comprises coupling the diffuser to the contacts.