# US 2019/0375769 A1 · Organosilicon compound and method for producing same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0375769 A1 - Document ID: US20190375769A1 - Status: Published application - Kind: A1 - Application number: 16/487,264 - Filed: 2017-05-16 - Published: 2019-12-12 - Earliest claimed: 2017-03-09 - Assignees: Shin-Etsu Chemical Co., Ltd. - Applicants: Shin-Etsu Chemical Co., Ltd. - Inventors: Tetsuro YAMADA; Munenao HIROKAMI; Taiki KATAYAMA - Web page: https://patentgrep.com/patent/US20190375769A1 ## CPC - C08G 77/392: containing sulfur - C07F 7/1804: {Compounds having Si-O-C linkages (Si-O-acyl linkages C07F7/1896)} - C07F 7/1892: {by reactions not provided for in C07F7/1876 - C07F7/1888} - C08G 77/28: sulfur-containing groups - C08G 77/50: by carbon linkages - C08K 5/098: Metal salts of carboxylic acids - C08K 5/5465: containing at least one C=N bond - C09D 7/63: organic - C09D 183/08: containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen - C09D 183/14: in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms (C09D183/10 takes precedence) - C09J 183/08: containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen - C09J 183/14: in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms (C09J183/10 takes precedence) - C08G 77/20: containing silicon bound to unsaturated aliphatic groups - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C07F: ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM (metal-containing porphyrins C07D487/22) - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) ## Abstract Provided is an organosilicon compound characterized by containing at least one group represented by structural formula (1) in one molecule and having a main chain comprising a silicon-containing organic group. This organosilicon compound exhibits satisfactorily fast curability, and excellent yellowing resistance, heat resistance, storage stability, and safety. (In the formula, each R1 independently represents an unsubstituted or substituted C1-10 alkyl group, or an unsubstituted or substituted C6-10 aryl group, each R2 independently represents an unsubstituted or substituted C1-10 alkyl group, or an unsubstituted or substituted C6-10 aryl group, and each R3 independently represents a hydrogen atom or an unsubstituted or substituted C1-10 alkyl group. m is a number from 1-3, and n is an integer of 2 or greater. A dashed line represents a bond.) ## Claims ### Claim 1 An organosilicon compound having a backbone composed of a silicon-containing organic group and containing per molecule at least one group having the structural formula (1): wherein R1 is each independently a substituted or unsubstituted C1-C10 alkyl group or a substituted or unsubstituted C6-C10 aryl group, R2 is each independently a substituted or unsubstituted C1-C10 alkyl group or a substituted or unsubstituted C6-C10 aryl group, R3 is each independently hydrogen or a substituted or unsubstituted C1-C10 alkyl group, m is a number of 1 to 3, n is an integer of at least 2, and the broken line represents a valence bond. ### Claim 2 (depends on 1) The organosilicon compound of claim 1, having the structural formula (2): wherein R1, R2, m and n are as defined above, and Z is a divalent silicon-containing organic group. ### Claim 3 (depends on 2) The organosilicon compound of claim 2 wherein Z has a linear structure. ### Claim 4 (depends on 2) The organosilicon compound of claim 2 wherein Z has the formula (3): wherein R4 is each independently hydrogen, a substituted or unsubstituted C1-C10 alkyl group, or a substituted or unsubstituted C6-C10 aryl group, p is a number of at least 0, and the broken line represents a valence bond. ### Claim 5 (depends on 1) A method for preparing the organosilicon compound of claim 1, comprising the step of reacting a silicon-containing compound having at least one alkenyl group per molecule with a compound having mercapto and alkoxysilyl groups represented by the formula (4): wherein R1, R2, and m are as defined above. ### Claim 6 (depends on 5) The method of claim 5 wherein the silicon-containing compound having at least one alkenyl group per molecule is represented by the formula (5): wherein Z is a divalent silicon-containing organic group and r is an integer of at least 0. ### Claim 7 (depends on 6) The method of claim 6 wherein Z has the formula (3): wherein R4 is each independently hydrogen, a substituted or unsubstituted C1-C10 alkyl group, or a substituted or unsubstituted C6-C10 aryl group, p is a number of at least 0, and the broken line represents a valence bond. ### Claim 8 (depends on 1) A curable composition comprising (A) the organosilicon compound of claim 1 and (B) a curing catalyst. ### Claim 9 (depends on 8) The curable composition of claim 8 wherein the curing catalyst (B) is an amine compound. ### Claim 10 (depends on 8) A cured product obtained from curing of the curable composition of claim 8. ### Claim 11 (depends on 1) A coating composition comprising (A) the organosilicon compound of claim 1 and (B) a curing catalyst. ### Claim 12 (depends on 11) The coating composition of claim 11 wherein the curing catalyst (B) is an amine compound. ### Claim 13 (depends on 11) An article having a coating layer obtained from curing of the coating composition of claim 11. ### Claim 14 (depends on 1) An adhesive composition comprising (A) the organosilicon compound of claim 1 and (B) a curing catalyst. ### Claim 15 (depends on 14) The adhesive composition of claim 14 wherein the curing catalyst (B) is an amine compound. ### Claim 16 (depends on 14) An article having an adhesive layer obtained from curing of the adhesive composition of claim 14.