Heat dissipation plate and method for manufacturing the same
AssigneeCooler Master Co., Ltd.
InventorsWei-Lung CHAN, Wen-Ti CHENG
Life of this patent
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Abstract
A method for manufacturing a heat dissipation device that includes stamping a composite plate including a welding material to form a first plate having a plurality of angled grooves, depositing powder in the plurality of angled grooves of the first plate, contacting the first plate to a second plate, and welding the first plate and the second plate together, and sintering powder to obtain a capillary structure.
Claims11
A method for manufacturing a heat dissipation device, comprising:
- stamping a composite plate including a welding material to form a first plate having a plurality of angled grooves;
- depositing powder in the plurality of angled grooves of the first plate;
- contacting the first plate to a second plate;
- and
- welding the first plate and the second plate together, and sintering powder to obtain a capillary structure.
A method for manufacturing a heat dissipation device, comprising:
- stamping a non-composite plate not including a welding material to form a first plate having a plurality of angled grooves;
- depositing powder in the plurality of angled grooves of the first plate;
- sintering the powder to obtain a capillary structure;
- contacting the first plate to a second plate;
- and
- welding the first plate and the second plate together.
A method of manufacturing a heat dissipating device, comprising:
- placing capillary structures on a first plate and a second plate;
- treating the first plate and the second plate for roll bonding the first plate and second plate;
- roll bonding the first plate and second plate to each other to obtain the heat dissipating device;
- and
- performing a blow molding process to form one or more angled channels in the heat dissipating device.
A method of manufacturing a heat dissipating device, comprising:
- roll bonding a first plate and a second plate to each other to obtain the heat dissipating device;
- performing a blow molding process to form one or more angled channels in the heat dissipating device;
- cutting the heat dissipating device to forming openings of the one or more angled channels;
- placing a capillary structure in the one or more angled channels through the openings;
- and
- sealing the openings using a roll bonding process.
Dependencies are inferred from the claim text.