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US 2019/0360115 A1Published application
Method for manufacturing copper composite electrode with a flake structure on the surface
AssigneeNational Chung Hsing University
InventorsChing-Chou WU, Ming-Yuan LEE
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Abstract
A method for manufacturing a copper composite electrode, including contacting a conductive substrate including copper with a phosphate solution for oxidation to produce a copper phosphate structure on a surface of the conductive substrate, thus acquiring a copper phosphate composite electrode.
Claims11
A method for manufacturing a copper composite electrode with a flake structure on the surface, the method comprising:
- a) preparing a conductive substrate comprising a copper surface;
- b) placing the conductive substrate comprising the copper surface in a phosphate solution having pH values of 4.0˜6.0 allows copper to contact with the phosphate solution for oxidation, wherein:
- the oxidation adopts electro-oxidation, chemical oxidation, or a combination thereof, when chemical oxidation is adopted, an oxidant is added and when electro-oxidation is adopted, voltages of −0.1 V˜0.1 V are applied;
- and
- c) forming a copper phosphate having a flake structure on the surface of the conductive substrate to acquire a copper phosphate composite electrode.
2 more elements
Dependencies are inferred from the claim text.