# US 2019/0357388 A1 · Cooling device and electronic apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0357388 A1 - Document ID: US20190357388A1 - Status: Published application - Kind: A1 - Application number: 16/396,812 - Filed: 2019-04-29 - Published: 2019-11-21 - Earliest claimed: 2018-05-18 - Assignees: Fujitsu Limited - Applicants: Fujitsu Limited - Inventors: Yoichi SATO - Web page: https://patentgrep.com/patent/US20190357388A1 ## CPC - H05K 7/20409: {Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing} - H05K 7/20727: {within server blades for removing heat from heat source} - F28F 3/04: the means being integral with the element - G06F 1/20: Cooling means - H05K 7/20163: {the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels} - H10W 40/43: by flowing gases, e.g. forced air cooling - F28D 2021/0029: {Heat sinks} - F28F 2215/04: Assemblies of fins having different features, e.g. with different fin densities - H10W 40/226: {characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461)} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) ## Abstract A cooling device includes a heat reception base configured to receive heat transmitted from an electronic component. The cooling device also include a fin base configured to face the heat reception base. The fin base is also configured to form a ventilation path through which air flows between the fin base and the heat reception base. A heat conductor coupled with the heat reception base and the fin base is also included. The cooling device also includes a plurality of radiation fins configured to extend from the fin base to a side opposite to the heat reception base. The fin base includes an air outlet configured to communicate with a gap between the radiation fins adjacent to each other. ## Claims ### Claim 1 A cooling device comprising: a heat reception base configured to receive heat transmitted from an electronic component; a fin base configured to face the heat reception base, and to form a ventilation path through which air flows between the fin base and the heat reception base; a heat conductor coupled with the heat reception base and the fin base; and a plurality of radiation fins configured to extend from the fin base to a side opposite to the heat reception base, the fin base includes an air outlet configured to communicate with a gap between the radiation fins adjacent to each other. ### Claim 2 (depends on 1) The cooling device according to claim 1, wherein the air outlet is coupled with the ventilation path and the gap between the radiation fins adjacent to each other. ### Claim 3 (depends on 1) The cooling device according to claim 1, wherein a plurality of air outlets are arranged in the gap between the radiation fins adjacent to each other. ### Claim 4 (depends on 3) The cooling device according to claim 3, wherein, in the gap between the radiation fins adjacent to each other, the plurality of air outlets are arranged at least on both sides and an intermediate portion in a width direction of the radiation fin. ### Claim 5 (depends on 3) The cooling device according to claim 3, wherein, in the gap between the radiation fins adjacent to each other, the plurality of air outlets are arranged at equal intervals in a width direction of the radiation fins. ### Claim 6 (depends on 1) The cooling device according to claim 1, wherein the air outlet is an elongated hole, and wherein the radiation fins intersect the air outlet as viewed in a thickness direction of the fin base. ### Claim 7 (depends on 1) The cooling device according to claim 1, wherein the heat conductor and the radiation fins overlap each other as viewed in a thickness direction of the fin base. ### Claim 8 (depends on 1) The cooling device according to claim 1, wherein a plurality of heat conductors are arranged between the heat reception base and the fin base. ### Claim 9 (depends on 1) The cooling device according to claim 1, wherein the heat conductor is arranged between the air outlets adjacent to each other as viewed in a thickness direction of the fin base. ### Claim 10 (depends on 9) The cooling device according to claim 9, wherein the plurality of heat conductors are arranged between the air outlets adjacent to each other as viewed in the thickness direction of the fin base. ### Claim 11 (depends on 1) The cooling device according to claim 1, further comprising: a partition wall configured to include an intake port, and to partition the ventilation path. ### Claim 12 (depends on 11) The cooling device according to claim 11, further comprising: a fin storage configured to include an exhaust port, and to accommodate the radiation fin. ### Claim 13 (depends on 12) The cooling device according to claim 12, wherein the exhaust port is disposed on a side opposite to the intake port with respect to the fin storage. ### Claim 14 (depends on 1) The cooling device according to claim 1, further comprising: a high static pressure air generator configured to supply air to the ventilation path. ### Claim 15 (depends on 1) The cooling device according to claim 1, wherein the heat reception base, the fin base, the heat conductor, and the plurality of radiation fins have thermal conductivity. ### Claim 16 An electronic apparatus comprising: an electronic component: and a cooling device configured to include: a heat reception base configured to receive heat transmitted from the electronic component, a fin base configured to face the heat reception base, and to form a ventilation path through which air flows between the fin base and the heat reception base, a heat conductor coupled with the heat reception base and the fin base, and a plurality of radiation fins configured to extend from the fin base to a side opposite to the heat reception base, the fin base includes an air outlet configured to communicate with a gap between the radiation fins adjacent to each other. ### Claim 17 An electronic component cooling device comprising: a heat receiving portion; a plurality of heat conduction portions extending from a surface of the heat receiving portion; a fin portion including a plurality of air outlets, the fin portion provided on a side of the plurality of heat conduction portions that is opposite the heat receiving portion; a plurality of radiation fins extending from a side of the fin portion that is opposite the plurality of heat conduction portions; and a case that encloses the heat receiving portion, the plurality of heat conduction portions, the fin portion, and the plurality of radiation fins, the case including a cooling air intake pipe provided on a side of the case that is perpendicular to the heat receiving portion and an exhaust pipe provided on a side of the case opposite the cooling air intake pipe. ### Claim 18 (depends on 17) The device of claim 17, wherein the cooling air intake pipe is provided at a lower end of the case. ### Claim 19 (depends on 17) The device of claim 17, wherein the exhaust pipe is provided at an upper end of the case. ### Claim 20 (depends on 17) The device of claim 17 further comprising a high static pressure air generator configured to supply air to the cooling air intake pipe.