# US 2019/0357364 A1 · Component Carrier With Only Partially Filled Thermal Through-Hole > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0357364 A1 - Document ID: US20190357364A1 - Status: Published application - Kind: A1 - Application number: 15/981,996 - Filed: 2018-05-17 - Published: 2019-11-21 - Earliest claimed: 2018-05-17 - Assignees: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft - Applicants: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft - Inventors: Ferdinand Lutschounig; Sabine Liebfahrt; Gernot Grober; Florian Matt - Web page: https://patentgrep.com/patent/US20190357364A1 ## CPC - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 1/0206: {by printed thermal vias} - H05K 3/429: {Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers} - H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)} - H05K 1/112: {directly combined with via connections} - H05K 1/113: {Via provided in pad; Pad over filled via} - H05K 1/116: {Lands, clearance holes or other lay-out details concerning the surrounding of a via} - H05K 3/423: {characterised by electroplating method} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A component carrier includes at least one electrically conductive layer structure and at least one electrically insulating layer structure, a through-hole extending through the at least one electrically insulating layer structure, and highly thermally conductive material filling only part of the through-hole so that a recess is formed which is not filled with the highly thermally conductive material and which extends at least from an outer face of the at least one electrically insulating layer structure into the through-hole. Where a diameter, B, of the recess at a level of the outer face of the at least one electrically insulating layer structure and a width, A, of a web of the highly thermally conductive material at the level of the outer face of the at least one electrically insulating layer structure fulfill the conditions B>A and A>B/20. ## Claims ### Claim 1 A component carrier, wherein the component carrier comprises: at least one electrically conductive layer structure and at least one electrically insulating layer structure; a through-hole extending through the at least one electrically insulating layer structure; highly thermally conductive material filling only part of the through-hole so that a recess is formed which is not filled with the highly thermally conductive material and which extends at least from an outer face of the at least one electrically insulating layer structure into the through-hole; wherein a diameter, B, of the recess at a level of the outer face of the at least one electrically insulating layer structure and a width, A, of a web of the highly thermally conductive material at the level of the outer face of the at least one electrically insulating layer structure fulfill the condition B>A. ### Claim 2 (depends on 1) The component carrier according to claim 1, comprising one of the features: wherein A>B/20; wherein a ratio between a vertical height, D, and a maximum horizontal thickness, C, of the through-hole is in a range between 1 and 15; wherein the through-hole is substantially circular cylindrically; wherein a thickness of the at least one electrically insulating layer structure through which the through-hole extends is larger than 400 μm; wherein a value of the thermal conductivity of the highly thermally conductive material is at least 50 W/mK; wherein the highly thermally conductive material comprises or consists of copper; wherein the highly thermally conductive material comprises or consists of electrically insulating material. ### Claim 3 (depends on 1) The component carrier according to claim 1, wherein a further recess is formed in the highly thermally conductive material opposing the recess, wherein the further recess is not filled with the highly thermally conductive material and extends at least from another outer face of the at least one electrically insulating layer structure into the through-hole. ### Claim 4 (depends on 3) The component carrier according to claim 3, wherein a diameter, E, of the further recess at a level of the other outer face of the at least one electrically insulating layer structure and a width, F, of another web of the highly thermally conductive material at the level of the other outer face of the at least one electrically insulating layer structure fulfill the conditions E>F and F>E/20. ### Claim 5 (depends on 4) The component carrier according to claim 4, wherein B substantially equals E and/or A substantially equals F. ### Claim 6 (depends on 3) The component carrier according to claim 3, wherein the highly thermally conductive material together with the recess and with the further recess form a symmetric structure with respect to a horizontal plane extending through a center of the at least one electrically insulating layer structure through which the through-hole extends. ### Claim 7 (depends on 3) The component carrier according to claim 3, wherein a cross section of the highly thermally conductive material together with the recess and the further recess along a vertical plane is a substantially H-shaped structure. ### Claim 8 (depends on 3) The component carrier according to claim 3, wherein a ratio between a vertical distance, G, between an innermost end of the recess and an innermost end of the further recess on the one hand and a height, D, of the through-hole on the other hand is in a range between 30% and 95%. ### Claim 9 (depends on 1) The component carrier according to claim 1, wherein at least one of the group consisting of the recess and the further recess is filled with a dielectric material. ### Claim 10 (depends on 1) The component carrier according to claim 1, comprising at least one further electrically insulating layer structure connected to an exterior surface of at least one of the at least one electrically insulating layer structure, the at least one electrically conductive layer structure, and further highly thermally conductive material, wherein the at least one further electrically insulating layer structure fills at least one of the recess and the further recess. ### Claim 11 (depends on 10) The component carrier according to claim 10, wherein an area of a main surface of the at least one further electrically insulating layer structure facing at least one of the recess and the further recess is larger by 0.1% to 500%, than a hypothetic area of said main surface in the absence of the recess or the further recess. ### Claim 12 (depends on 1) The component carrier according to claim 1, comprising one of the following features: comprising at least one further electrically insulating layer structure connected to an exterior surface of at least one of the at least one electrically insulating layer structure, the at least one electrically conductive layer structure, and further highly thermally conductive material, wherein the at least one further electrically insulating layer structure is planar; wherein a maximum horizontal thickness, C, of the through-hole is at least 100 μm; wherein a maximum depth of at least one of the recess and the further recess is at least 100 μm. ### Claim 13 (depends on 1) The component carrier according to claim 1, wherein the highly thermally conductive material has a further web at the level of the outer face of the at least one electrically insulating layer structure, wherein the further web is arranged opposing the web in a horizontal direction so that the recess is located between the web and the further web. ### Claim 14 (depends on 13) The component carrier according to claim 13, wherein the further web has a width, I, at the level of the outer face of the at least one electrically insulating layer structure fulfilling the conditions B>I and I>B/20. ### Claim 15 (depends on 13) The component carrier according to claim 13, wherein the web and the further web are arranged symmetric with respect to a vertical plane extending through a central axis of the through-hole. ### Claim 16 (depends on 1) The component carrier according to claim 1, wherein the highly thermally conductive material in the through-hole is continuously connected via the web with further highly thermally conductive material covering at least part of a main surface of the at least one electrically insulating layer structure, wherein the further highly thermally conductive material is shaped as a layer which is interrupted by the recess. ### Claim 17 (depends on 3) The component carrier according to claim 3, wherein the recess is connected with the further recess, wherein at least one of the recess and the further recess is at least partially filled with electrically conductive material. ### Claim 18 (depends on 1) The component carrier according to claim 1, comprising at least one of the following features: the at least one electrically conductive layer structure comprises at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten, any of the mentioned materials being optionally coated with supra-conductive material such as graphene; the at least one electrically insulating layer structure comprises at least one of the group consisting of resin, reinforced or non-reinforced resin, epoxy resin or Bismaleimide-Triazine resin, FR-4, FR-5, cyanate ester, polyphenylene derivate, glass, prepreg material, polyimide, polyamide, liquid crystal polymer, epoxy-based Build-Up Film, polytetrafluoroethylene, a ceramic, and a metal oxide; the component carrier comprises at least one embedded and/or at least one surface mounted component, wherein the at least one component is selected from a group consisting of an electronic component, an electrically non-conductive and/or electrically conductive inlay, a heat transfer unit, an energy harvesting unit, an active electronic component, a passive electronic component, an electronic chip, a storage device, a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a voltage converter, a cryptographic component, a transmitter and/or receiver, an electromechanical transducer, an actuator, a microelectromechanical system, a microprocessor, a capacitor, a resistor, an inductance, an accumulator, a switch, a camera, an antenna, a magnetic element, a light guiding element, a further component carrier and a logic chip; the component carrier is shaped as a plate; component carrier is configured as a printed circuit board, or an IC substrate. ### Claim 19 A method of manufacturing a component carrier, wherein the method comprises: forming a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure; forming a through-hole extending through the at least one electrically insulating layer structure; filling only part of the through-hole with highly thermally conductive material so that a recess is formed which is not filled with the highly thermally conductive material, wherein the recess extends at least from an outer face of the at least one electrically insulating layer structure into the through-hole; wherein the filling is carried out so that a diameter, B, of the recess at a level of the outer face of the at least one electrically insulating layer structure and a width, A, of a web of the highly thermally conductive material at the level of the outer face of the at least one electrically insulating layer structure fulfill the condition B>A. ### Claim 20 (depends on 19) The method according to claim 19, comprising one of the following features: wherein A>B/20; wherein the method comprises forming the through-hole by mechanically drilling through the at least one electrically insulating layer structure; wherein the method comprises filling the through-hole only partially with the highly thermally conductive material by carrying out a plurality of plating procedures, wherein the plating procedures are terminated as soon as the conditions B>A and A>B/20 are fulfilled.