# US 2019/0357347 A1 · Electromagnetic shielding structure of solid state drive

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- Number: US 2019/0357347 A1
- Document ID: US20190357347A1
- Status: Published application
- Kind: A1
- Application number: 16/389,990
- Filed: 2019-04-21
- Published: 2019-11-21
- Earliest claimed: 2018-05-16
- Assignees: Mega electronics Co., Ltd.; Sunsystem Co., Ltd.
- Applicants: Mega electronics Co., Ltd.; Sunsystem Co., Ltd.
- Inventors: Jong Myung KIM
- Web page: https://patentgrep.com/patent/US20190357347A1

## CPC

- H05K 9/0024: {Shield cases mounted on a PCB, e.g. cans or caps or conformal shields}
- H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)}
- H05K 1/0222: {for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence}
- H05K 1/0225: {Single or multiple openings in a shielding, ground or power plane (H05K1/0227 takes precedence)}
- H05K 9/0081: {Electromagnetic shielding materials, e.g. EMI, RFI shielding (H05K9/0003 takes precedence)}
- H10W 42/273: {the arrangements being between laterally adjacent chips, e.g. walls between chips}
- H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation}
- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- H05K 2201/0715: provided by an outer layer of PCB
- H05K 2201/09609: Via grid, i.e. two-dimensional array of vias or holes in a single plane
- H05K 2203/1311: Foil encapsulation, e.g. of mounted components
- H05K 2203/1316: Moulded encapsulation of mounted components
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/732: {between stacked chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Disclosed is an electromagnetic shielding structure of a solid state driver (SSD), and particularly an electromagnetic shielding structure of an SSD, in which an electromagnetic shielding structure of a closed shield can type is achieved based on an electromagnetic shielding structure that employs an electromagnetic shielding coating layer electrically connected to a ground via hole formed in a printed circuit board (PCB) and a lower electromagnetic shielding layer formed inside the PCB and electrically connected to the electromagnetic shielding coating layer through the ground via hole, thereby improving electromagnetic shielding performance.

## Claims

### Claim 1

An electromagnetic shielding structure of a solid state drive (SSD) comprising a printed circuit board (PCB), a plurality of memories mounted to the PCB, a controller, and a plurality of active and passive elements, the electromagnetic shielding structure comprising:
a molding resin layer formed on the PCB and covering and surrounding the plurality of memories, the controller, and the plurality of active and passive elements;
an electromagnetic shielding coating layer coated on a surface of the molding resin layer and electrically connected to a ground via hole continuously formed along an edge portion of the PCB; and
a lower electromagnetic shielding layer formed inside the PCB and electrically connected to the electromagnetic shielding coating layer through the ground via hole.

### Claim 2 (depends on 1)

The electromagnetic shielding structure of the SSD according to claim 1, wherein the lower electromagnetic shielding layer comprises a lower shielding metal thin film formed inside the PCB throughout an entire surface and shaped like a plate, a lower shielding resin thin film coated on top and bottom surfaces of the lower shielding metal thin film and formed with a plurality of lower shielding openings equidistantly spaced apart from each other exposing the lower shielding metal thin film, and a lower shielding metal pad filled in each of the plurality of lower shielding openings and formed to be in contact with the lower shielding metal thin film.