# US 2019/0356390 A1 · Optical transmission/reception circuit

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- Number: US 2019/0356390 A1
- Document ID: US20190356390A1
- Status: Published application
- Kind: A1
- Application number: 16/409,723
- Filed: 2019-05-10
- Published: 2019-11-21
- Earliest claimed: 2018-05-18
- Assignees: STMicroelectronics (Grenoble 2) SAS
- Applicants: Stmicroelectronics (Grenoble 2) SAS
- Inventors: Alexandre COULLOMB; Romain COFFY; Jean-Michel RIVIERE
- Web page: https://patentgrep.com/patent/US20190356390A1

## CPC

- H04B 10/40: Transceivers
- H04B 10/501: {Structural aspects}
- H04B 10/691: {Arrangements for optimizing the photodetector in the receiver}
- H10F 55/20: wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
- H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80)
- H10W 90/00: Package configurations
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H04B: TRANSMISSION
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An optoelectronic device includes a substrate and a first optoelectronic chip flush with a surface of the substrate. The device includes a cover that covers the substrate and the first optoelectronic chip. The cover comprises a cavity above a first optical transduction region of the first optoelectronic chip. The device also includes a second optoelectronic chip having a second optical transduction region spaced apart from the first optical transduction region and the cavity continues above the second optical transduction region.

## Claims

### Claim 1

A device comprising:
a substrate including a top surface; and
a first optoelectronic chip positioned in the substrate and having a top surface flush with the top surface of the substrate.

### Claim 2 (depends on 1)

The device of claim 1, comprising a cover covering the substrate and the first optoelectronic chip.

### Claim 3 (depends on 2)

The device of claim 2, wherein the cover has a planar surface mechanically coupled to the top surface of the substrate.

### Claim 4 (depends on 2)

The device of claim 2, wherein the cover comprises an electric connection in contact with the first optoelectronic chip.

### Claim 5 (depends on 2)

The device of claim 2, wherein the cover comprises a cavity above a first optical transduction region of the first optoelectronic chip.

### Claim 6 (depends on 5)

The device of claim 5, wherein the cavity is filled with a transparent material.

### Claim 7 (depends on 5)

The device of claim 5, further comprising a second optoelectronic chip positioned in the substrate and having a top surface flush with the top surface of the substrate wherein the cavity continues above a second optical transduction region of the second optoelectronic chip.

### Claim 8 (depends on 5)

The device of claim 5, wherein the cover comprises a transparent element above the first optical transduction region.

### Claim 9 (depends on 5)

The device of claim 5, further comprising a second optoelectronic chip having a second optical transduction region spaced apart from the first optical transduction region and the cavity continues above the second optical transduction region.

### Claim 10 (depends on 2)

The device of claim 2, wherein the cover comprises a transparent element above a first optical transduction region of the first optoelectronic chip.

### Claim 11 (depends on 9)

The device of claim 9, wherein the transparent element is continued above a second optical transduction region.

### Claim 12 (depends on 10)

The device of claim 10, further comprising a shield partially covering the transparent element above the second transduction region.

### Claim 13

A method of manufacturing an optoelectronic device, the method comprising:
forming a substrate having a cavity extending inwardly from a top surface of the substrate; and
an optoelectronic chip positioned in the cavity of the substrate and having a top surface flush with the top surface of the substrate.

### Claim 14 (depends on 13)

The method of claim 13, comprising overmolding a cover on the substrate.

### Claim 15 (depends on 14)

The method of claim 14, comprising arranging an electric connection in contact with the chip prior to the overmolding.

### Claim 16 (depends on 13)

The method of claim 13, comprising arranging a transparent element on the chip before the overmolding.

### Claim 17

A device comprising:
a substrate;
a first optoelectronic chip positioned in the substrate and having a first optical transduction region;
a second optoelectronic chip positioned in the substrate and having a second optical transduction region; and
a cover covering the substrate and the first and second optoelectronic chips, wherein the cover comprises a cavity directly above the first and second optical transduction regions.

### Claim 18 (depends on 17)

The device of claim 17, wherein the cover comprises an electric connection in contact with the chip.

### Claim 19 (depends on 17)

The device of claim 17, further comprising a transparent element that fills the cavity.

### Claim 20 (depends on 17)

The device of claim 17, further comprising a shield partially covering the transparent element above the second transduction region.