# US 2019/0356296 A1 · Acoustic wave device, radio-frequency front end circuit, and communication device

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- Number: US 2019/0356296 A1
- Document ID: US20190356296A1
- Status: Published application
- Kind: A1
- Application number: 16/529,841
- Filed: 2019-08-02
- Published: 2019-11-21
- Earliest claimed: 2017-02-08
- Assignees: Murata Manufacturing Co., Ltd.
- Applicants: Murata Manufacturing Co., Ltd.
- Inventors: Masakazu MIMURA
- Web page: https://patentgrep.com/patent/US20190356296A1

## CPC

- H03F 3/245: {with semiconductor devices only}
- H03H 9/02818: {Means for compensation or elimination of undesirable effects}
- H03F 3/21: with semiconductor devices only {(H03F3/245 takes precedence)}
- H03H 9/02574: {of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate}
- H03H 9/02637: {Details concerning reflective or coupling arrays}
- H03H 9/02834: {of temperature influence (cut angles H03H9/02543)}
- H03H 9/02858: {of wave front distortion}
- H03H 9/02881: {of diffraction of wave beam}
- H03H 9/145: for networks using surface acoustic waves
- H03H 9/25: Constructional features of resonators using surface acoustic waves {(devices for manipulating acoustic surface waves in general G10K11/36)}
- H03F 2200/451: the amplifier being a radio frequency amplifier
- H03F: AMPLIFIERS
- H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P)

## Abstract

An acoustic wave device utilizes Love waves and includes a piezoelectric substrate (piezoelectric body), an IDT electrode provided on the piezoelectric substrate, and a first dielectric film that is provided on the piezoelectric substrate and covers the IDT electrode. A center region, first and second edge regions, and first and second gap regions are disposed in this order in the IDT electrode. A mass-adding film is provided inside the first dielectric film in the first edge region and the second edge region. When T1 is the film thickness of the portion of the first dielectric film located between the IDT electrode and the mass-adding film and T2 is the film thickness of the portion of the first dielectric film located between the mass-adding film and the surface of the first dielectric film on the opposite side from the piezoelectric substrate, T1/(T1+T2)<about 0.5.

## Claims

### Claim 1

An acoustic wave device comprising:
a piezoelectric body;
an IDT electrode provided on the piezoelectric body; and
a first dielectric film provided on the piezoelectric body and covering the IDT electrode; wherein
the IDT electrode includes a first busbar and a second busbar that face each other, a plurality of first electrode fingers with first ends that are electrically connected to the first busbar, and a plurality of second electrode fingers with first ends that are electrically connected to the second busbar and that are interdigitated with the plurality of first electrode fingers,
when an acoustic wave propagation direction is a first direction and a direction perpendicular or substantially perpendicular to the acoustic wave propagation direction is a second direction, the IDT electrode includes a crossing region that is a portion of the IDT electrode where the first electrode fingers and the second electrode fingers overlap in the first direction;
the crossing region includes a center region located in a central portion of the first electrode fingers and the second electrode fingers in the second direction, a first edge region located outside the center region on the first busbar side in the second direction, and a second edge region located outside the center region on the second busbar side in the second direction,
a first gap region is located outside the first edge region on the first busbar side in the second direction and a second gap region is located outside the second edge region on the second busbar side in the second direction;
Love waves are utilized as acoustic waves;
a mass-adding film is provided inside the first dielectric film in the first edge region and the second edge region; and
when T1 is a film thickness of a portion of the first dielectric film located between the IDT electrode and the mass-adding film and T2 is a film thickness of a portion of the first dielectric film located between the mass-adding film and a surface of the first dielectric film on an opposite side from the piezoelectric body, T1/(T1+T2)<about 0.5.

### Claim 2 (depends on 1)

The acoustic wave device according to claim 1, wherein an acoustic velocity in the first edge region and the second edge region is lower than an acoustic velocity in the center region and an acoustic velocity in the first gap region and the second gap region is higher than the acoustic velocity in the first edge region and the second edge region.

### Claim 3 (depends on 1)

The acoustic wave device according to claim 1, further comprising:
a second dielectric film provided on the first dielectric film; wherein about 0.24≤T1/(T1+T2)≤about 0.49 in the first dielectric film.

### Claim 4 (depends on 3)

The acoustic wave device according to claim 3, wherein about 0.32≤T1/(T1+T2)≤about 0.44 in the first dielectric film.

### Claim 5 (depends on 1)

The acoustic wave device according to claim 1, wherein a main component of the mass-adding film is T.

### Claim 6 (depends on 1)

The acoustic wave device according to claim 1, wherein the first dielectric film includes silicon oxide.

### Claim 7 (depends on 3)

The acoustic wave device according to claim 3, wherein the second dielectric film includes silicon nitride.

### Claim 8 (depends on 1)

The acoustic wave device according to claim 1, further comprising:
a second dielectric film provided on the first dielectric film; wherein
a thickness of the second dielectric film is in a range from about 0.005λ to about 0.015π, where λ is a wavelength defined by an electrode finger pitch of the IDT electrode.

### Claim 9 (depends on 1)

A radio-frequency front end circuit comprising:
the acustic wave device according to claim 1; and
a power amplifier.

### Claim 10 (depends on 9)

A communication device comprising:
the radio-frequency front end circuit according to claim 9; and
an RF signal processing circuit.

### Claim 11 (depends on 1)

The acoustic wave device according to claim 1, wherein the piezoelectric body includes −20° to 40° Y—X LiNbO3.

### Claim 12 (depends on 1)

The acoustic wave device according to claim 1, further comprising at least one reflector located on a side of the IDT electrode in the acoustic wave propagation.

### Claim 13 (depends on 1)

The acoustic wave device according to claim 1, wherein the first edge region extends in the acoustic wave propagation direction.

### Claim 14 (depends on 1)

The acoustic wave device according to claim 1, wherein the first edge region includes an entirety or substantially an entirety of a region defined by extending tip portions of the IDT electrode in the acoustic wave propagation direction.

### Claim 15 (depends on 1)

The acoustic wave device according to claim 1, wherein the second edge region extends in the acoustic wave propagation direction inside the IDT electrode.

### Claim 16 (depends on 1)

The acoustic wave device according to claim 1, wherein the second edge region includes tip portions of the plurality of second electrode fingers, base end portions of the plurality of second electrode fingers, regions between the plurality of first electrode fingers, and regions between the plurality of second electrode fingers.

### Claim 17 (depends on 3)

The acoustic wave device according to claim 3, wherein the first dielectric film includes a silicon oxide and the second dielectric film includes a silicon nitride.

### Claim 18 (depends on 1)

The acoustic wave device according to claim 1, wherein the mass-adding film has a stripe shape that extends in the first direction.

### Claim 19 (depends on 1)

The acoustic wave device according to claim 1, wherein the mass-adding film overlaps the plurality of first electrode fingers and the plurality of second electrode fingers.

### Claim 20 (depends on 1)

The acoustic wave device according to claim 1, wherein the first dielectric film includes a plurality of protruding portions that extend along a shape of the mass-adding film.