# US 2019/0356033 A1 · Reduced dispersion dielectric waveguides

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- Number: US 2019/0356033 A1
- Document ID: US20190356033A1
- Status: Published application
- Kind: A1
- Application number: 16/014,036
- Filed: 2018-06-21
- Published: 2019-11-21
- Earliest claimed: 2018-05-18
- Assignees: Intel Corporation
- Applicants: Intel Corporation
- Inventors: Georgios Dogiamis; Adel A. Elsherbini; Telesphor Kamgaing; Henning Braunisch; Johanna M. Swan
- Web page: https://patentgrep.com/patent/US20190356033A1

## CPC

- H01P 3/16: Dielectric waveguides, i.e. without a longitudinal conductor
- H01P 3/123: with a complex or stepped cross-section, e.g. ridged or grooved waveguides (H01P3/14 takes precedence)
- H01P 3/165: {Non-radiating dielectric waveguides}
- H01P 11/006: {Manufacturing dielectric waveguides}
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 90/00: Package configurations
- H04B 10/2581: Multimode transmission
- H10W 44/216: {Waveguides, e.g. strip lines}
- H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H04B: TRANSMISSION

## Abstract

Disclosed herein are various designs for dielectric waveguides, as well as methods of manufacturing such waveguides. One type of dielectric waveguides described herein includes waveguides with one or more cavities in the dielectric waveguide material. Another type of dielectric waveguides described herein includes waveguides with a conductive ridge in the dielectric waveguide material. Dielectric waveguides described herein may be dispersion reduced dielectric waveguides, compared to conventional dielectric waveguides, and may be designed to adjust the difference in the group delay between the lower frequencies and the higher frequencies of a chosen bandwidth.

## Claims

### Claim 1

A dielectric waveguide, comprising:
a dielectric waveguide material;
one or more cavities in at least a portion of the dielectric waveguide material; and
a conductive coating around the dielectric waveguide material and the one or more cavities.

### Claim 2 (depends on 1)

The dielectric waveguide according to claim 1, wherein a portion of the conductive coating forms a wall of at least one of the one or more cavities.

### Claim 3 (depends on 2)

The dielectric waveguide according to claim 2, wherein the wall formed by the portion of the conductive coating is curved.

### Claim 4 (depends on 2)

The dielectric waveguide according to claim 2, wherein the wall formed by the portion of the conductive coating is substantially straight.

### Claim 5 (depends on 2)

The dielectric waveguide according to claim 2, wherein:
the wall is a first wall, and
a portion of the dielectric waveguide material forms a second wall of the at least one of the one or more cavities, wherein the second wall includes one or more slanted faces that enclose the at least one of the one or more cavities.

### Claim 6 (depends on 2)

The dielectric waveguide according to claim 2, wherein:
the wall is a first wall, and
a portion of the dielectric waveguide material forms a second wall of the at least one of the one or more cavities, wherein the second wall forms a curved surface that encloses the at least one of the one or more cavities.

### Claim 7 (depends on 1)

The dielectric waveguide according to claim 1, wherein one or more edges of the dielectric waveguide material that interface the conductive coating are rounded edges.

### Claim 8 (depends on 1)

The dielectric waveguide according to claim 1, wherein one or more edges of the dielectric waveguide material are rounded edges.

### Claim 9 (depends on 1)

The dielectric waveguide according to claim 1, wherein the one or more cavities are at least partially filled with a solid dielectric fill material, wherein a dielectric constant of the dielectric waveguide material is higher than a dielectric constant of the solid dielectric fill material.

### Claim 10 (depends on 9)

The dielectric waveguide according to claim 9, wherein the solid dielectric fill material includes a plastic.

### Claim 11 (depends on 1)

The dielectric waveguide according to claim 1, wherein the one or more cavities are at least partially filled with a fluid dielectric fill material, wherein a dielectric constant of the dielectric waveguide material is higher than a dielectric constant of the fluid dielectric fill material.

### Claim 12 (depends on 1)

The dielectric waveguide according to claim 1, wherein the one or more cavities are at least partially filled with air.

### Claim 13 (depends on 1)

The dielectric waveguide according to claim 1, wherein the one or more cavities include at least a first cavity and a second cavity, and wherein a portion of the dielectric waveguide material separates the first cavity from the second cavity.

### Claim 14 (depends on 1)

The dielectric waveguide according to claim 1, wherein a ratio of a volume of the one or more cavities to a volume of the dielectric waveguide material is between about 0.2 and 2.

### Claim 15 (depends on 1)

The dielectric waveguide according to claim 1, wherein the dielectric waveguide is configured to support propagation of a wave in a hybrid mode.

### Claim 16 (depends on 1)

The dielectric waveguide according to claim 1, further comprising an additional electromagnetic shield material encompassing the dielectric waveguide material and the one or more cavities.

### Claim 17 (depends on 1)

The dielectric waveguide according to claim 1, wherein the dielectric waveguide is part of a multi-lane cable.

### Claim 18

An integrated circuit (IC) structure, comprising:
a dielectric waveguide, wherein the dielectric waveguide includes a ridge formed of a conductive material, and a dielectric waveguide material at least partially enclosing the ridge; and
a package substrate,
wherein the dielectric waveguide is at least partially in or on the package substrate.

### Claim 19 (depends on 18)

The IC structure according to claim 18, wherein the dielectric waveguide is embedded in the package substrate or is at least partially in a recess of the package substrate.

### Claim 20 (depends on 18)

The IC structure according to claim 18, further comprising:
a first die coupled to the package substrate; and
a second die coupled to the package substrate,
wherein the dielectric waveguide provides a path for communication between the first die and the second die.

### Claim 21 (depends on 20)

The IC structure according to claim 20, wherein the first die includes a first wave launcher proximate to a first end of the dielectric waveguide, the second die includes a second wave launcher proximate to a second end of the dielectric waveguide, and the first end of the dielectric waveguide is opposite to the second end of the dielectric waveguide.

### Claim 22

A method of manufacturing a dielectric waveguide, the method comprising:
forming a base structure of a dielectric waveguide material;
providing a conductive coating to enclose at least a portion of the dielectric waveguide material; and
forming one or more cavities encompassed by one or more of the dielectric waveguide material and the conductive coating.

### Claim 23 (depends on 22)

The method according to claim 22, wherein forming the one or more cavities includes etching the one or more cavities.

### Claim 24

A computing device, comprising:
a substrate; and
an integrated circuit (IC) structure coupled to the substrate, wherein the IC structure includes a dielectric waveguide that comprises:
a dielectric waveguide material, and
one or more cavities in the dielectric waveguide material.

### Claim 25 (depends on 24)

The computing device according to claim 24, wherein the computing device further includes one or more communication chips and an electromagnetic wave launcher.