# US 2019/0355931 A1 · Organic Device Having Protective Film and Method of Manufacturing the Same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0355931 A1 - Document ID: US20190355931A1 - Status: Published application - Kind: A1 - Application number: 16/416,576 - Filed: 2019-05-20 - Published: 2019-11-21 - Earliest claimed: 2018-05-21 - Assignees: Korea Advanced Institute of Science and Technology - Applicants: Korea Advanced Institute of Science and Technology - Inventors: Kyung Cheol Choi; Yong Min Jeon - Web page: https://patentgrep.com/patent/US20190355931A1 ## CPC - H10K 50/841: {Self-supporting sealing arrangements} - H10K 50/844: Encapsulations - H10K 71/00: Manufacture or treatment specially adapted for the organic devices covered by this subclass - H10K 71/16: using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering - H10K 71/441: {in the presence of solvent vapors, e.g. solvent vapour annealing} - H10K 50/8426: {Peripheral sealing arrangements, e.g. adhesives, sealants} - H10K 2102/00: Constructional details relating to the organic devices covered by this subclass - H10K 2102/351: {Thickness} - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract The present invention provides a method of manufacturing an organic device having a protective film, the method including: providing bonding layers (adhesives) on one surface of a first substrate and one surface of a second substrate; providing an organic device on the other surface of the first substrate; and providing the second substrate on the organic device such that the bonding layer (adhesive) provided on the second substrate is in contact with the organic device. Since the organic device having the protective film according to the present invention may be attached to other materials through the bonding layer (adhesive), it is not necessary to apply heat in order to attach the organic device to other materials, and as a result, it is possible to attach the organic device to various materials having various shapes regardless of types and shapes of materials. Further, according to the organic device having the protective film according to the present invention, since the protective film is formed as the substrate having the bonding layer (adhesive) 220 is attached to the organic device 300, no heat is applied to the organic device 300 during the process of forming the protective film, and as a result, it is possible to minimize deformation of the organic device 300 by minimizing physical and chemical stress to be applied to the organic device 300. According to the organic device having the protective film according to the present invention, the two protective film layers for protecting the organic device are manufactured through the same process, and as a result, it is possible to innovatively reduce the process time required to manufacture the organic device having the protective film in comparison with the process in the related art. ## Claims ### Claim 1 A method of manufacturing an organic device having a protective film, the method comprising: providing bonding layers (adhesives) on one surface of a first substrate and one surface of a second substrate; providing an organic device on the other surface of the first substrate; and providing the second substrate on the organic device such that the bonding layer (adhesive) provided on the second substrate is in contact with the organic device. ### Claim 2 (depends on 1) The method of claim 1, further comprising: providing encapsulation film layers (barriers) on the other surface of the first substrate and the other surface of the second substrate before the providing of the organic device on the other surface of the first substrate. ### Claim 3 (depends on 2) The method of claim 2, wherein the encapsulation film layer includes an inorganic thin film layer. ### Claim 4 (depends on 3) The method of claim 3, wherein the encapsulation film layer further includes an organic thin film layer. ### Claim 5 (depends on 4) The method of claim 4, the organic thin film layer is formed between the two the inorganic thin film layers. ### Claim 6 (depends on 3) The method of claim 3, wherein the inorganic thin film layer is made of any one of Al2O3, ZnO, ZrO2, TiO2, MgO, WO3, ZnS, Y2O3, HfO2, SiO2, SiNx, and AlN. ### Claim 7 (depends on 3) The method of claim 3, wherein a thickness of the inorganic thin film layer is 1 nm to 1 μm. ### Claim 8 (depends on 2) The method of claim 2, wherein the encapsulation film layer is provided by using chemical vapor deposition, sputtering, ion beam deposition, or electron beam deposition. ### Claim 9 (depends on 1) The method of claim 1, further comprising: providing a release paper layer such that the release paper layer is in contact with the bonding layer after the providing of the bonding layers on one surface of the first substrate and one surface of the second substrate. ### Claim 10 (depends on 1) The method of claim 1, wherein the organic device is an organic light emitting device. ### Claim 11 (depends on 1) The method of claim 1, wherein the substrate is a polymer substrate. ### Claim 12 (depends on 1) The method of claim 1, wherein a thickness of the substrate is 1 μm to 500 μm. ### Claim 13 (depends on 1) The method of claim 1, wherein the organic device is provided through a thermal evaporation process. ### Claim 14 An organic device having a protective film comprising: bonding layers (adhesives) which are provided on one surface of a first substrate and one surface of a second substrate; and an organic device which is provided on the other surface of the first substrate, wherein the second substrate is provided such that the bonding layer of the second substrate is in contact with the organic device. ### Claim 15 (depends on 14) The organic device of claim 14, wherein after encapsulation film layers (barriers) are provided on the other surface of the first substrate and the other surface of the second substrate, the organic device is provided such that the organic device is in contact with the encapsulation film layer provided on the first substrate. ### Claim 16 (depends on 14) The organic device of claim 14, wherein the organic device is an organic light emitting device.