# US 2019/0355906 A1 · Vapor deposition method, and el device manufacturing method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0355906 A1 - Document ID: US20190355906A1 - Status: Published application - Kind: A1 - Application number: 16/462,284 - Filed: 2017-05-19 - Published: 2019-11-21 - Earliest claimed: 2017-05-19 - Assignees: Sharp Kabushiki Kaisha - Applicants: Sharp Kabushiki Kaisha - Inventors: Shinsaku NAKAJIMA; Seiji FUJIWARA - Web page: https://patentgrep.com/patent/US20190355906A1 ## CPC - C23C 14/042: {using masks} - H05B 33/10: Apparatus or processes specially adapted to the manufacture of electroluminescent light sources - H05B 33/14: characterised by the chemical or physical composition or the arrangement of the electroluminescent material {, or by the simultaneous addition of the electroluminescent material in or onto the light source} - H10K 59/40: OLEDs integrated with touch screens - H10K 71/164: {using vacuum deposition} - H10K 71/166: {using selective deposition, e.g. using a mask} - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract A vapor deposition method includes a fixing step for fixing a vapor deposition mask on a mask frame, a lifting step for mounting a substrate on the vapor deposition mask and lifting the mask frame to bring the substrate into contact with a touch plate disposed above the mask frame, and a measurement step for measuring a thickness of the mask frame. The lifting step includes determining a lifting amount of the mask frame on the basis of the thickness of the mask frame measured by the measurement step. ## Claims ### Claim 1 A vapor deposition method comprising: a fixing step for fixing a vapor deposition mask on a mask frame; a lifting step for mounting a substrate on the vapor deposition mask fixed on the mask frame and lifting the mask frame to bring the substrate into contact with a touch plate disposed above the mask frame; and a measurement step for measuring a thickness of the mask frame, wherein the lifting step includes determining a lifting amount of the mask frame on the basis of the thickness of the mask frame measured by the measurement step. ### Claim 2 (depends on 1) The vapor deposition method according to claim 1, wherein the mask frame is formed into a frame shape surrounding an opening, and the vapor deposition mask includes a plurality of divided sheets, each having a strip shape and extending across the opening. ### Claim 3 (depends on 2) The vapor deposition method according to claim 2, wherein the mask frame includes a recessed portion formed between the plurality of divided sheets, and the lifting step includes a gap measurement step for measuring a gap between the substrate and a bottom face of the recessed portion of the mask frame while lifting the mask frame, and a lifting speed reduction step for reducing a lifting speed of the mask frame when the gap measured by the gap measurement step reaches a predetermined threshold value. ### Claim 4 (depends on 1) The vapor deposition method according to claim 1, further comprising: a vapor deposition step for vapor-depositing a luminescent material onto the substrate through the vapor deposition mask fixed to the mask frame lifted by the lifting step; a washing step for removing the vapor deposition mask from the mask frame and washing a portion of the luminescent material adhered to the vapor deposition mask; a polishing step for polishing the mask frame with the vapor deposition mask removed; and a re-welding step for once again welding and fixing the vapor deposition mask washed in the washing step to the mask frame polished in the polishing step, wherein the fixing step includes fixing the vapor deposition mask on the mask frame by welding. ### Claim 5 (depends on 1) The vapor deposition method according to claim 1, further comprising: a vapor deposition step for vapor-depositing a luminescent material onto the substrate through the vapor deposition mask fixed to the mask frame lifted by the lifting step; a removing step for removing the vapor deposition mask used in the vapor deposition step from the mask frame in order to replace the vapor deposition mask; a polishing step for polishing the mask frame with the vapor deposition mask removed; and a replacement step for welding and fixing the vapor deposition mask for replacement to the mask frame polished in the polishing step, wherein the fixing step includes fixing the vapor deposition mask on the mask frame by welding. ### Claim 6 (depends on 1) The vapor deposition method according to claim 1, wherein the measurement step includes measuring a thickness of the mask frame before the vapor deposition mask is fixed. ### Claim 7 (depends on 1) The vapor deposition method according to claim 1, wherein the measurement step includes measuring a thickness of the mask frame after the vapor deposition mask is fixed. ### Claim 8 (depends on 4) The vapor deposition method according to claim 4, wherein the measurement step includes measuring a thickness of the mask frame polished by the polishing step. ### Claim at position 9 9-10 (canceled) ### Claim 11 An EL device manufacturing method comprising: a lifting step for mounting a substrate on a vapor deposition mask fixed on a mask frame and lifting the mask frame to bring the substrate into contact with a touch plate disposed above the mask frame; a measurement step for measuring a thickness of the mask frame; a lifting amount determination step for determining a lifting amount of the mask frame on the basis of the thickness of the mask frame measured by the measurement step; and a vapor deposition step for vapor-depositing a vapor deposition layer for an EL device onto the substrate through the vapor deposition mask fixed to the mask frame lifted by the lifting step. ### Claim 12 A vapor deposition method comprising: a fixing step for fixing a vapor deposition mask on a mask frame; and a lifting step for lifting the mask frame to bring the vapor deposition mask into contact with a substrate disposed above the mask frame, wherein the mask frame is formed into a frame shape surrounding an opening, the vapor deposition mask includes a plurality of divided sheets, each having a strip shape and extending across the opening, the mask frame includes a recessed portion formed between the plurality of divided sheets, and the lifting step includes a gap measurement step for measuring a gap between the substrate and a bottom face of the recessed portion of the mask frame while lifting the mask frame, and a lifting speed reduction step for reducing a lifting speed of the mask frame when the gap measured by the gap measurement step reaches a predetermined threshold value.