# US 2019/0355899 A1 · Semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0355899 A1 - Document ID: US20190355899A1 - Status: Published application - Kind: A1 - Application number: 16/413,029 - Filed: 2019-05-15 - Published: 2019-11-21 - Earliest claimed: 2018-05-16 - Assignees: Ablic Inc. - Applicants: ABLIC Inc. - Inventors: Takaaki Hioka - Web page: https://patentgrep.com/patent/US20190355899A1 ## CPC - G01R 33/07: Hall effect devices - H10N 52/101: {Semiconductor Hall-effect devices} - G01R 33/075: {Hall devices configured for spinning current measurements} - G01R 33/077: {Vertical Hall-effect devices} - H10N 52/80: Constructional details - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR ## Abstract A Hall element includes a magnetic sensing portion formed of an impurity diffusion layer of a second conductivity type, and having four ends, and four electrodes provided at the respective four ends. The impurity diffusion layer forming the magnetic sensing portion has a first depth from a surface of the semiconductor substrate, has a first concentration gradient in which a concentration of impurities of the second conductivity type increases in a depth direction from the surface of the semiconductor substrate to a second depth which is shallower than the first depth, and has a second concentration gradient in which the concentration of the impurities of the second conductivity type decreases in the depth direction from the second depth to the first depth. The second depth is half the first depth or less, and the first concentration gradient is steeper than the second concentration gradient. ## Claims ### Claim 1 A semiconductor device, comprising: a semiconductor substrate of a first conductivity type; and a Hall element formed in the semiconductor substrate, the Hall element comprising: a magnetic sensing portion formed of an impurity diffusion layer of a second conductivity type formed in the semiconductor substrate, and having four ends in plan view; and four electrodes provided at the respective four ends in a surface of the magnetic sensing portion, and each formed of an impurity diffusion layer of the second conductivity type having a concentration that is higher than a concentration of the magnetic sensing portion, the impurity diffusion layer which forms the magnetic sensing portion having a first depth from a surface of the semiconductor substrate, having a first concentration gradient in which a concentration of impurities of the second conductivity type increases in a depth direction from the surface of the semiconductor substrate to a second depth which is shallower than the first depth, and having a second concentration gradient in which the concentration of the impurities of the second conductivity type decreases in the depth direction from the second depth to the first depth, the second depth being half the first depth or less, the first concentration gradient being steeper than the second concentration gradient. ### Claim 2 (depends on 1) The semiconductor device according to claim 1, wherein the concentration of the impurities of the second conductivity type in the magnetic sensing portion has a peak between depths of 400 nm and 800 nm from the surface of the semiconductor substrate, the concentration at the peak being from 1×1016 atoms/cm3 to 1×1017 atoms/cm3, the magnetic sensing portion having a depth of from 2 μm to 5 μm. ### Claim 3 (depends on 1) The semiconductor device according to claim 1, wherein the magnetic sensing portion has one of a square shape and a cross shape in plan view. ### Claim 4 (depends on 2) The semiconductor device according to claim 2, wherein the magnetic sensing portion has one of a square shape and a cross shape in plan view. ### Claim 5 (depends on 1) The semiconductor device according to claim 1, further comprising an element isolation diffusion layer of the first conductivity type formed in the semiconductor substrate so as to surround a periphery of the magnetic sensing portion and to be separated from the magnetic sensing portion, the element isolation diffusion layer having a concentration that is higher than a concentration of the semiconductor substrate. ### Claim 6 (depends on 2) The semiconductor device according to claim 2, further comprising an element isolation diffusion layer of the first conductivity type formed in the semiconductor substrate so as to surround a periphery of the magnetic sensing portion and to be separated from the magnetic sensing portion, the element isolation diffusion layer having a concentration that is higher than a concentration of the semiconductor substrate. ### Claim 7 (depends on 3) The semiconductor device according to claim 3, further comprising an element isolation diffusion layer of the first conductivity type formed in the semiconductor substrate so as to surround a periphery of the magnetic sensing portion and to be separated from the magnetic sensing portion, the element isolation diffusion layer having a concentration that is higher than a concentration of the semiconductor substrate. ### Claim 8 (depends on 4) The semiconductor device according to claim 4, further comprising an element isolation diffusion layer of the first conductivity type formed in the semiconductor substrate so as to surround a periphery of the magnetic sensing portion and to be separated from the magnetic sensing portion, the element isolation diffusion layer having a concentration that is higher than a concentration of the semiconductor substrate. ### Claim 9 (depends on 1) The semiconductor device according to claim 1, wherein the surface of the semiconductor substrate and the surface of the magnetic sensing portion are covered with an insulating film except for regions in which the four electrodes are provided. ### Claim 10 (depends on 2) The semiconductor device according to claim 2, wherein the surface of the semiconductor substrate and the surface of the magnetic sensing portion are covered with an insulating film except for regions in which the four electrodes are provided. ### Claim 11 (depends on 3) The semiconductor device according to claim 3, wherein the surface of the semiconductor substrate and the surface of the magnetic sensing portion are covered with an insulating film except for regions in which the four electrodes are provided. ### Claim 12 (depends on 4) The semiconductor device according to claim 4, wherein the surface of the semiconductor substrate and the surface of the magnetic sensing portion are covered with an insulating film except for regions in which the four electrodes are provided.