# US 2019/0355887 A1 · Method for manufacturing an optical module and optical module

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- Number: US 2019/0355887 A1
- Document ID: US20190355887A1
- Status: Published application
- Kind: A1
- Application number: 16/484,189
- Filed: 2018-02-28
- Published: 2019-11-21
- Earliest claimed: 2017-03-15
- Assignees: Mitsumi Electric Co., Ltd.
- Inventors: Makoto KITAZUME; Tadashi ONO; Toshiki KOMIYAMA; Yuki INUGAI
- Web page: https://patentgrep.com/patent/US20190355887A1

## CPC

- H10H 20/851: Wavelength conversion means
- H10H 20/856: Reflecting means
- H10H 20/841: Reflective coatings, e.g. dielectric Bragg reflectors
- H10H 20/8515: {not being in contact with the bodies}
- H10H 20/852: Encapsulations
- H10H 20/853: characterised by their shape
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10W 74/01: Manufacture or treatment
- H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills}
- H10W 74/10: characterised by their shape or disposition
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 74/40: characterised by their materials
- H10W 90/00: Package configurations
- H10H 20/0361: {of wavelength conversion means}
- H10H 20/0362: {of encapsulations}
- H10H 20/0363: {of optical field-shaping means}
- H10H 20/0364: {of interconnections}
- H10W 72/07354: {changes in dispositions}
- H10W 72/347: {Dispositions of multiple die-attach connectors}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method for manufacturing an optical module includes a step of mounting a light emitting device on a board having a plurality of electrodes on its surface in a facedown manner, a step of disposing a resin sheet containing a light conversion material so as to face the surface on which the light emitting device is mounted of the board and filling a space between the resin sheet and the board including the resin sheet and the light emitting device with a first light transmissive resin, a step of covering a surface opposite to a surface of the resin sheet covered with the first light transmissive resin with a second light transmissive resin, a step of forming a groove extending from a top surface of the second light transmissive resin to a predetermined depth of the board, a step of filling the groove with the light reflective resin and covering the top surface of the second light transmissive resin with the light reflective resin, a step of removing the light reflective resin on the second light transmissive resin, and a step of dicing the light emitting device by cutting along the light reflective resin such that an outer lateral surface is covered with the light reflective resin by leaving part of the light reflective resin filled in the groove.

## Claims

### Claim 1

A method for manufacturing an optical module, comprising:
a step of mounting a light emitting device on a board having a plurality of electrodes on its surface in a facedown manner;
a step of disposing a resin sheet containing a light conversion material so as to face a light emitting device mounting surface of the board, and filling a space between the resin sheet and the board including the resin sheet and the light emitting device with a first light transmissive resin;
a step of covering a surface of the resin sheet opposite to a surface of the resin sheet covered with the first light transmissive resin, with a second light transmissive resin;
a step of forming a groove extending from a top surface of the second light transmissive resin to a predetermined depth of the board;
a step of filling the groove with light reflective resin and covering the top surface of the second light transmissive resin with the light reflective resin;
a step of removing the light reflective resin on the second light transmissive resin; and
a step of dicing the light emitting device by cutting along the light reflective resin such that an outer lateral surface is covered with the light reflective resin by leaving part of the light reflective resin filled in the groove.

### Claim 2

A method for manufacturing an optical module, comprising:
a step of mounting a light emitting device on a board having a plurality of electrodes on its surface in a facedown manner;
a step of sealing the surface of the board including lateral faces, a top face, and a lower face of the light emitting device with a first light transmissive resin mixed with a light wavelength conversion material;
a step of covering a top surface of the first light transmissive resin with a second light transmissive resin;
a step of funning a groove extending from a top surface of the second light transmissive resin to a predetermined depth of the board;
a step of filling the groove with light reflective resin and covering the top surface of the second light transmissive resin with the light reflective resin;
a step of removing the light reflective resin on the second light transmissive resin; and
a step of dicing the light emitting device by cutting along the light reflective resin such that outer peripheral lateral surface is covered with the light reflective resin by leaving part of the light reflective resin filled in the groove.

### Claim 3 (depends on 1)

The method for manufacturing the optical module as claimed in claim 1, further comprising:
a step of forming a layer made of an inorganic film on a surface of the groove between the step of forming the groove and the step of filling the groove with the light reflective resin.

### Claim 4

An optical module, comprising:
a board having a plurality of electrodes on its surface;
a light emitting device mounted on the plurality of electrodes of the board in a facedown manner;
a resin sheet containing a light wavelength conversion material provided above the light emitting device;
a first light transmissive resin sealing a space between the board and the resin sheet including a space between the light emitting device and the resin sheet;
a second light transmissive resin covering a face of the resin sheet opposite to the face of the resin sheet sealed with the first light transmissive resin; and
a light reflective resin containing a light reflective material provided to cover an outer peripheral lateral surface along the outer peripheral lateral surface of a stack constituted of the board, the light emitting device, the resin sheet, the first light transmissive resin and the second light transmissive resin.

### Claim 5 (depends on 4)

The optical module as claimed in claim 4, further comprising:
a layer made of an inorganic film between the outer peripheral lateral surface of the stack and the light reflective resin.

### Claim 6

An optical module, comprising:
a board having a plurality of electrodes on its surface;
a light emitting device mounted on the plurality of electrodes of the board in a facedown manner;
a first light transmissive resin mixed with a light wavelength conversion material and sealing the surface of the board including the light emitting device;
a second light transmissive resin covering a top surface of the first light transmissive resin;
a light reflective resin containing a light reflective material provided to cover an outer peripheral lateral surface along the outer peripheral lateral surface of a stack constituted of the board, the light emitting device, the resin sheet, the first light transmissive resin and the second light transmissive resin.

### Claim 7 (depends on 6)

The optical module as claimed in claim 6, further comprising:
a layer made of an inorganic film between the outer peripheral lateral surface of the stack and the light reflective resin.

### Claim 8 (depends on 4)

The optical module as claimed in claim 4,
wherein the board has a rectangular shape in a plan view,
wherein a plurality of light emitting devices is mounted along a lengthwise direction of the rectangular shape,
wherein the plurality of light emitting devices includes a plurality of groups of light emitting devices including a predetermined number of light emitting devices connected in series, and
wherein a back surface of the board includes a plurality of external connection terminals to be electrically connected with a motherboard.

### Claim 9 (depends on 8)

The optical module as claimed in claim 8,
wherein each the plurality of light emitting groups includes two terminals,
wherein one terminal of the each of the plurality of light emitting groups is commonly connected to one of the plurality of external connection terminals, and
wherein the other terminal of the each of the plurality of light emitting groups is connected to different one of the plurality of external connection terminals.

### Claim 10 (depends on 9)

The optical terminal as claimed in claim 9,
wherein the board includes a plurality of layers, and
wherein the other terminal of the each of the plurality of light emitting groups is connected to the different one of the plurality of external connection terminals via interconnections provided in different layers of the board.

### Claim 11

An optical module, comprising:
a board having a rectangular shape in a plan view and including a plurality of electrodes on its top surface and a plurality of external connection terminals on its back surface;
a light emitting device mounted on the plurality of electrodes of the board along a lengthwise direction of the rectangular shape in a facedown manner; and
a light transmissive resin sealing the top surface of the board including the plurality of light emitting devices,
wherein the plurality of light emitting devices includes a plurality of groups of a predetermined number of light emitting devices electrically connected in series.

### Claim 12 (depends on 2)

The method for manufacturing the optical module as claimed in claim 2, further comprising:
a step of forming a layer made of an inorganic film on a surface of the groove between the step of forming the groove and the step of filling the groove with the light reflective resin.

### Claim 13 (depends on 6)

The optical module as claimed in claim 6,
wherein the board has a rectangular shape in a plan view,
wherein a plurality of light emitting devices is mounted along a lengthwise direction of the rectangular shape,
wherein the plurality of light emitting devices includes a plurality of groups of light emitting devices including a predetermined number of light emitting devices connected in series, and
wherein a back surface of the board includes a plurality of external connection terminals to be electrically connected with a motherboard.