# US 2019/0355884 A1 · Molded surface mount device led display module

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- Number: US 2019/0355884 A1
- Document ID: US20190355884A1
- Status: Published application
- Kind: A1
- Application number: 15/984,017
- Filed: 2018-05-18
- Published: 2019-11-21
- Earliest claimed: 2018-05-18
- Assignees: Sct Technology, Ltd.
- Applicants: Sct Technology, Ltd.
- Inventors: Chang Hung PAN; Heng LIU; Eric LI; Shihfeng SHAO
- Web page: https://patentgrep.com/patent/US20190355884A1

## CPC

- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10W 90/00: Package configurations
- H05K 1/181: associated with surface mounted components
- H10H 20/8506: {Containers}
- H10H 20/853: characterised by their shape
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout}
- H05K 2201/0108: Transparent
- H05K 2201/0129: Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
- H05K 2201/0162: Silicon containing polymer, e.g. silicone
- H05K 2201/10106: Light emitting diode [LED]
- H05K 2201/10128: Display
- H05K 2203/1316: Moulded encapsulation of mounted components
- H05K 2203/1322: Encapsulation comprising more than one layer
- H10H 20/0362: {of encapsulations}
- H10H 20/855: Optical field-shaping means, e.g. lenses
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

A light emitting diode (LED) display module includes an array of surface-mount devices (SMDs) arranged in rows and columns on a substrate. Each SMD has red, green, and blue LED chips connected to the substrate and a first transparent resin portion molded around the LED chips; a black resin portion molded around each SMD in a manner to fill spaces between SMDs so as to block light emitted from a sidewall of each SMD; and a second transparent resin portion molded on the first transparent resin portion and the black resin portion.

## Claims

### Claim 1

A light emitting diode (LED) display module, comprising:
an array of surface-mount devices (SMDs) arranged in rows and columns on a substrate, each SMD comprising red, green, and blue LED chips connected to the substrate, and a first transparent resin portion molded around the LED chips;
a black resin portion molded around each SMD in a manner to fill spaces between SMDs so as to block light emitted from a sidewall of each SMD; and
a second transparent resin portion molded on the first transparent resin portion and the black resin portion.

### Claim 2 (depends on 1)

The LED display module of claim 1, wherein the substrate comprises a printed circuit board (PCB).

### Claim 3 (depends on 1)

The LED display module of claim 1, wherein the first transparent resin portion is made from a resin, an epoxy, or a silicone.

### Claim 4 (depends on 1)

The LED display module of claim 1, wherein the second transparent resin portion is made of the same material as that of the first transparent resin portion.

### Claim 5 (depends on 1)

The LED display module of claim 1, wherein the black resin portion is made of a mixture of black pigment and a resin, an epoxy, or a silicone.

### Claim 6 (depends on 1)

The LED display module of claim 1, wherein the first transparent resin portion has flat top and side surfaces.

### Claim 7 (depends on 2)

The LED display module of claim 2, wherein each SMD is electrically connected to pads on the PCB to respond to electrical signals from a controller.

### Claim 8 (depends on 1)

The LED display module of claim 1, wherein the red, green and blue LED chips are arranged in a linear shape.

### Claim 9 (depends on 1)

The LED display module of claim 1, wherein the second transparent resin portion has a thickness ranging from 100 μm to 700 μm.

### Claim 10 (depends on 1)

The LED display module of claim 1, wherein the second transparent resin portion has a surface having on or more portions that is flat, in a concave shape, or in a convex shape.

### Claim 11

A light emitting diode (LED) display module, comprising:
an array of surface-mount devices (SMDs) arranged in a matrix on a substrate, each SMD comprising red, green and blue LED chips, a black side wall defining a cavity, and a first transparent resin portion molded in the cavity; and
a second transparent resin portion molded on the first transparent resin portion and molded around each SMD in a manner to fill spaces between SMDs.

### Claim 12 (depends on 11)

The LED display module of claim 11, wherein the second transparent resin portion has flat top and side surfaces.

### Claim 13 (depends on 11)

The LED display module of claim 11, wherein the substrate comprises a printed circuit board (PCB).

### Claim 14 (depends on 11)

The LED display module of claim 11, wherein each SMD has a circular optical window so as to reduce color shift.

### Claim 15 (depends on 11)

The LED display module of claim 11, wherein the second transparent resin portion is made of the same material as that of the first transparent resin portion.

### Claim 16 (depends on 11)

The LED display module of claim 11, wherein the black sidewall is made of a mixture of black pigment and a resin, an epoxy, or a silicone.

### Claim 17 (depends on 11)

The LED display module of claim 11, wherein the second transparent resin portion has a surface having on or more portions that is flat, in a concave shape, or in a convex shape.

### Claim 18

A method for fabricating a light emitting diode (LED) display module, the method comprising:
providing an array of surface-mount devices (SMDs) arranged in a matrix on a substrate, each SMD comprising red, green and blue LED chips connected to the substrate and a first transparent resin portion molded around the LED chips;
forming a black resin portion molded around each SMD in a manner to fill spaces between SMDs so as to block light emitted from a sidewall of each SMD; and
forming a second transparent resin portion on the first transparent resin portion and the black resin portion.