# US 2019/0355683 A1 · Interconnections for a substrate associated with a backside reveal > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0355683 A1 - Document ID: US20190355683A1 - Status: Published application - Kind: A1 - Application number: 16/528,354 - Filed: 2019-07-31 - Published: 2019-11-21 - Earliest claimed: 2013-10-09 - Assignees: Invensas Corporation - Applicants: Invensas Corporation - Inventors: Cyprian Emeka Uzoh - Web page: https://patentgrep.com/patent/US20190355683A1 ## CPC - H10W 90/00: Package configurations - H10W 20/023: {the interconnections being through-semiconductor vias} - H10W 20/0249: {wherein the through-semiconductor via protrudes from backsides of the chips, wafers or substrates during the manufacture} - H10W 20/20: Interconnections within wafers or substrates, e.g. through-silicon vias [TSV] - H10W 72/019: {of bond pads} - H10W 70/63: Vias, e.g. via plugs - H10W 70/65: Shapes or dispositions of interconnections - H10W 72/012: {of bump connectors, dummy bumps or thermal bumps} - H10W 72/01208: {using permanent auxiliary members, e.g. using solder flow barriers, spacers or alignment marks} - H10W 72/234: {Cross-sectional shape, i.e. in side view} - H10W 72/244: {relative to underlying supporting features, e.g. bond pads, RDLs or vias} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 72/29: Bond pads specially adapted therefor - H10W 72/325: {Die-attach connectors having a filler embedded in a matrix} - H10W 72/351: {Materials of die-attach connectors} - H10W 72/59: Bond pads specially adapted therefor - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 72/922: {Bond pads being integral with underlying chip-level interconnections} - H10W 72/923: {Bond pads having multiple stacked layers} - H10W 72/925: {Bond pads having a filler embedded in a matrix} - H10W 72/942: {relative to underlying supporting features, e.g. bond pads, RDLs or vias} - H10W 72/951: {Materials of bond pads} - H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu} - H10W 72/953: {not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids} - H10W 72/983: {Reinforcing structures, e.g. collars} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - Y10T 29/49165: by forming conductive walled aperture in base - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract An apparatus relating generally to a substrate is disclosed. In this apparatus, a post extends from the substrate. The post includes a conductor member. An upper portion of the post extends above an upper surface of the substrate. An exterior surface of the post associated with the upper portion is in contact with a dielectric layer. The dielectric layer is disposed on the upper surface of the substrate and adjacent to the post to provide a dielectric collar for the post. An exterior surface of the dielectric collar is in contact with a conductor layer. The conductor layer is disposed adjacent to the dielectric collar to provide a metal collar for the post, where a top surface of each of the conductor member, the dielectric collar and the metal collar have formed thereon a bond structure for interconnection of the metal collar and the conductor member. ## Claims ### Claim 1 An apparatus, comprising: a post having a conductor member extending from a substrate; an upper portion of the post extending above an upper surface of the substrate; a dielectric material structure on an exterior surface portion of the post; a conductor layer in contact with an exterior surface portion of the dielectric material structure; the conductor layer located above the substrate; and a surface portion of each of the conductor member, the dielectric material structure and the conductive layer for contact with a conductive structure to provide electrical continuity between the conductor layer and the conductor member by bridging the surface portion of the dielectric material structure. ### Claim 2 (depends on 1) The apparatus according to claim 1, wherein the conductive structure is a solder mass. ### Claim 3 (depends on 1) The apparatus according to claim 1, wherein the dielectric material structure includes a collar. ### Claim 4 (depends on 1) The apparatus according to claim 1, wherein the dielectric material structure includes more than one dielectric layer. ### Claim 5 (depends on 1) The apparatus according to claim 1, wherein the post is of a through substrate layer via. ### Claim 6 (depends on 1) The apparatus according to claim 1, wherein: the conductive structure is a solder mass; the substrate is a first substrate; and the solder mass is connected between the first substrate and a second substrate for electrical continuity. ### Claim 7 An apparatus, comprising: a post having a conductor member extending from a substrate; an upper portion of the post extending above an upper surface of the substrate; a dielectric material structure in contact with an exterior surface portion of the post; a conductor layer in contact with a portion of the dielectric material structure; the conductor layer located above the substrate; and a surface portion of each of the conductor member, the dielectric material structure and the conductor layer aligned to provide a recess for receipt of a conductive structure, the conductive structure to provide electrical continuity between the conductor layer and the conductor member by bridging the surface portion of the dielectric material structure. ### Claim 8 (depends on 7) The apparatus according to claim 7, wherein the conductive structure is a solder mass. ### Claim 9 (depends on 7) The apparatus according to claim 7, wherein the dielectric material structure includes a collar. ### Claim 10 (depends on 7) The apparatus according to claim 7, wherein the surface portion of the conductor member and the conductor layer are vertically offset from one another. ### Claim 11 (depends on 10) The apparatus according to claim 10, wherein the substrate is a first substrate, and wherein the conductive structure is connected to a second substrate. ### Claim 12 (depends on 11) The apparatus according to claim 11, wherein the dielectric material structure includes more than one dielectric layer. ### Claim 13 (depends on 11) The apparatus according to claim 11, wherein the conductive structure is a solder mass. ### Claim 14 (depends on 7) The apparatus according to claim 7, wherein a portion of the conductor layer is below a top surface of the conductor member. ### Claim 15 (depends on 7) The apparatus according to claim 7, wherein the conductor layer is a metallic redistribution layer. ### Claim 16 (depends on 7) The apparatus according to claim 7, wherein the post is of a through substrate layer via. ### Claim 17 (depends on 7) The apparatus according to claim 7, wherein: the conductive structure is a solder mass; the substrate is a first substrate; and the solder mass is connected between the first substrate and a second substrate for electrical continuity. ### Claim 18 An apparatus, comprising: a post comprising a conductor member extending from a substrate; an upper portion of the post extending above an upper surface of the substrate; a dielectric layer in contact with an exterior surface of the post associated with the upper portion; and the dielectric layer located on the upper surface of the substrate and adjacent to and above the post to provide a dielectric material structure for the post and to define in part a recess over the upper portion of the post. ### Claim 19 (depends on 18) The apparatus according to claim 18, further comprising: a conductor layer above the substrate and on the dielectric layer; and wherein an upper portion of the conductor layer is located above a top surface of the post associated with a bottom surface of the recess. ### Claim 20 (depends on 18) The apparatus according to claim 18, further comprising: a solder mass in the recess; wherein the substrate is a first substrate; and wherein the solder mass is connected to a second substrate.