# US 2019/0355669 A1 · Circuit apparatus

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- Number: US 2019/0355669 A1
- Document ID: US20190355669A1
- Status: Published application
- Kind: A1
- Application number: 16/284,140
- Filed: 2019-02-25
- Published: 2019-11-21
- Earliest claimed: 2018-05-17
- Assignees: Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation
- Applicants: Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation
- Inventors: Minoru Takizawa
- Web page: https://patentgrep.com/patent/US20190355669A1

## CPC

- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 74/114: {by a substrate and the encapsulations}
- H01Q 1/526: {Electromagnetic shields}
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/657: {on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers}
- H10W 70/685: comprising multiple insulating layers
- H10W 90/00: Package configurations
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H01Q 9/0407: {Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40)}
- H01Q 9/0421: {with a shorting wall or a shorting pin at one end of the element (H01Q9/0414 takes precedence)}
- H10W 44/248: {for antennas}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)

## Abstract

A circuit apparatus according to an embodiment includes: a wiring substrate having a wiring; a first electronic component provided on the wiring substrate; a second electronic component provided on the wiring substrate, the second electronic component having a height higher than a height of the first electronic component; a sealing member provided on the wiring substrate, the sealing member covering the first electronic component and the second electronic component, a first distance between a first surface of the sealing member above the first electronic component and the wiring substrate being shorter than a second distance between a second surface of the sealing member above the second electronic component and the wiring substrate; and a conductive member provided on the sealing member, the conductive member exposing the second surface, a third distance between a third surface of the conductive member provided above the first electronic component and the wiring substrate being equal to the second distance, and a film thickness of the conductive member at the third surface being thicker than a film thickness of the conductive member at a fourth surface provided between the third surface and the second surface.

## Claims

### Claim 1

A circuit apparatus comprising:
a wiring substrate having a wiring;
a first electronic component provided on the wiring substrate;
a second electronic component provided on the wiring substrate, the second electronic component having a height higher than a height of the first electronic component;
a sealing member provided on the wiring substrate, the sealing member covering the first electronic component and the second electronic component, a first distance between a first surface of the sealing member above the first electronic component and the wiring substrate being shorter than a second distance between a second surface of the sealing member above the second electronic component and the wiring substrate; and
a conductive member provided on the sealing member, the conductive member exposing the second surface, a third distance between a third surface of the conductive member provided above the first electronic component and the wiring substrate being equal to the second distance, and a film thickness of the conductive member at the third surface being thicker than a film thickness of the conductive member at a fourth surface provided between the third surface and the second surface.

### Claim 2 (depends on 1)

The circuit apparatus according to claim 1, wherein the film thickness of the conductive member has a portion continuously changed between the second surface and the third surface.

### Claim 3 (depends on 1)

The circuit apparatus according to claim 1, wherein an area of the second surface exposed is smaller than an area of an upper face of the second electronic component.

### Claim 4 (depends on 1)

The circuit apparatus according to claim 1, wherein the conductive member is provided to surround the second surface.

### Claim 5 (depends on 1)

The circuit apparatus according to claim 1, wherein the conductive member includes silver.

### Claim 6 (depends on 1)

The circuit apparatus according to claim 1, wherein the film thickness of the conductive member above the first electronic component is 1 μm or more and 30 μm or less.

### Claim 7 (depends on 1)

The circuit apparatus according to claim 1, wherein the conductive member is a shield connected to the wiring.

### Claim 8 (depends on 1)

The circuit apparatus according to claim 1, wherein the conductive member is an antenna conductor connected to the first electronic component or the second electronic component through a connection member provided inside the sealing member.

### Claim 9 (depends on 1)

The circuit apparatus according to claim 1, wherein the first electronic component includes a crystal oscillator.

### Claim 10 (depends on 1)

The circuit apparatus according to claim 1, wherein the second electronic component includes an amplification device.