# US 2019/0355656 A1 · Semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0355656 A1 - Document ID: US20190355656A1 - Status: Published application - Kind: A1 - Application number: 16/527,543 - Filed: 2019-07-31 - Published: 2019-11-21 - Earliest claimed: 2017-03-22 - Assignees: Denso Corporation - Applicants: Denso Corporation - Inventors: Eiji HAYASHI; Ryoji UWATAKI; Tomomi OKUMURA - Web page: https://patentgrep.com/patent/US20190355656A1 ## CPC - H10W 40/778: {in encapsulations} - H10W 70/65: Shapes or dispositions of interconnections - H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps - H10W 70/421: {Shapes or dispositions} - H10W 70/461: {specially adapted for cooling} - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 72/851: {Dispositions of multiple connectors or interconnections} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/01: Manufacture or treatment - H10W 74/127: {characterised by arrangements for sealing or adhesion} - H10W 72/01308: {using permanent auxiliary members, e.g. using alignment marks} - H10W 72/07351: {characterised by changes in properties of the die-attach connectors during connecting} - H10W 72/07354: {changes in dispositions} - H10W 72/30: Die-attach connectors - H10W 72/347: {Dispositions of multiple die-attach connectors} - H10W 72/352: {comprising metals or metalloids, e.g. solders} - H10W 72/381: {Auxiliary members} - H10W 72/387: {Flow barriers} - H10W 72/59: Bond pads specially adapted therefor - H10W 72/931: {Shapes of bond pads} - H10W 72/9415: {relative to the surface, e.g. recessed, protruding} - H10W 72/944: {Dispositions of multiple bond pads} - H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu} - H10W 74/114: {by a substrate and the encapsulations} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The present disclosure describes a semiconductor device including: a semiconductor chip having an electrode; a conductive member including a metal base and having a mounting portion and a peripheral portion surrounding the mounting portion; a solder that is provided between the electrode and the mounting portion; and a sealing resin body that integrally seals the semiconductor chip, at least the face opposed to the electrode in the conductive member, and the solder. ## Claims ### Claim 1 A semiconductor device comprising: a semiconductor chip having an electrode; a conductive member including a metal base and having, on a face opposed to the electrode, a mounting portion for the semiconductor chip and a peripheral portion surrounding the mounting portion; a solder that is provided between the electrode and the mounting portion to connect the electrode and the conductive member; and a sealing resin body that integrally seals the semiconductor chip, at least the face opposed to the electrode in the conductive member, and the solder, wherein: the conductive member has, as the peripheral portion, an adhesive portion and a non-adhesive portion; the sealing resin body adheres to the adhesive portion; the non-adhesive portion is placed between the mounting portion and the adhesive portion; the solder does not connect with the non-adhesive portion; and the non-adhesive portion has lower adhesion to the sealing resin body than the adhesive portion; the adhesive portion includes a roughened portion having a continuously uneven surface; the conductive member includes a film on a surface of the metal base; the film is provided to an entire area of the adhesive portion and at least a part of the non-adhesive portion close to the adhesive portion; and a protrusion on the film is higher at the adhesive portion than at the non-adhesive portion. ### Claim 2 (depends on 1) The semiconductor device according to claim 1, wherein: the semiconductor chip has a first electrode, which is the electrode, on a first face side in a thickness direction, and a second electrode on a second face side opposite to the first face side; the semiconductor device further comprises a second conductive member that is disposed, causing the semiconductor chip to be sandwiched between the first conductive member as the conductive member and the second conductive member in the thickness direction, the second conductive member being electrically connected to the second electrode; the sealing resin body integrally seals a face of the second conductive member, the face facing the first conductive member; the first conductive member has, as the peripheral portion, the non-adhesive portion and a first adhesive portion that is the adhesive portion and; and the second conductive member has, on a face opposed to the first conductive member of the second conductive member, a second adhesive portion to which the sealing resin body adheres and which overlaps at least a part of the non-adhesive portion in a plan view in the thickness direction. ### Claim 3 (depends on 2) The semiconductor device according to claim 2, wherein: the second adhesive portion overlaps an entire area of the non-adhesive portion in the thickness direction. ### Claim 4 (depends on 2) The semiconductor device according to claim 2, wherein: the second adhesive portion overlaps only a part in a peripheral direction of the non-adhesive portion surrounding the mounting portion. ### Claim 5 (depends on 2) The semiconductor device according to claim 2, wherein: the second adhesive portion includes a roughened portion having a continuously uneven surface. ### Claim 6 (depends on 1) The semiconductor device according to claim 1, wherein: a width of the non-adhesive portion is 0.2 mm or more. ### Claim 7 (depends on 1) The semiconductor device according to claim 1, wherein: a width of the non-adhesive portion is 0.5 mm or less. ### Claim 8 A semiconductor device comprising: a semiconductor chip having an electrode; a conductive member including a metal base and having, on a face opposed to the electrode, a mounting portion for the semiconductor chip and a peripheral portion surrounding the mounting portion; a solder that is provided between the electrode and the mounting portion to connect the electrode and the conductive member; and a sealing resin body that integrally seals the semiconductor chip, at least the face opposed to the electrode in the conductive member, and the solder, wherein: the conductive member has, as the peripheral portion, an adhesive portion and a non-adhesive portion; the sealing resin body adheres to the adhesive portion; the non-adhesive portion is placed between the mounting portion and the adhesive portion; the solder does not connect with the non-adhesive portion; and the non-adhesive portion has lower adhesion to the sealing resin body than the adhesive portion; the adhesive portion includes a roughened portion having a continuously uneven surface; the conductive member includes a film on a surface of the metal base; the film has a metal thin film on the surface of the metal base, and an uneven oxide film that is an oxide of metal and that has a continuously uneven surface, the metal being a main component of the metal thin film; and the uneven oxide film is provided to an entire area of the adhesive portion and at least a part of the non-adhesive portion close to the adhesive portion. ### Claim 9 (depends on 8) The semiconductor device according to claim 8, wherein: a protrusion on the uneven oxide film is higher at the adhesive portion than at the non-adhesive portion. ### Claim 10 (depends on 8) The semiconductor device according to claim 8, wherein: the semiconductor chip has a first electrode, which is the electrode, on a first face side in a thickness direction, and a second electrode on a second face side opposite to the first face side; the semiconductor device further comprises a second conductive member that is disposed, causing the semiconductor chip to be sandwiched between the first conductive member as the conductive member and the second conductive member in the thickness direction, the second conductive member being electrically connected to the second electrode; the sealing resin body integrally seals a face of the second conductive member, the face facing the first conductive member; the first conductive member has, as the peripheral portion, the non-adhesive portion and a first adhesive portion that is the adhesive portion and; and the second conductive member has, on a face opposed to the first conductive member of the second conductive member, a second adhesive portion to which the sealing resin body adheres and which overlaps at least a part of the non-adhesive portion in a plan view in the thickness direction. ### Claim 11 (depends on 10) The semiconductor device according to claim 10, wherein: the second adhesive portion overlaps an entire area of the non-adhesive portion in the thickness direction. ### Claim 12 (depends on 10) The semiconductor device according to claim 10, wherein: the second adhesive portion overlaps only a part in a peripheral direction of the non-adhesive portion surrounding the mounting portion. ### Claim 13 (depends on 10) The semiconductor device according to claim 10, wherein: the second adhesive portion includes a roughened portion having a continuously uneven surface. ### Claim 14 (depends on 8) The semiconductor device according to claim 8, wherein: a width of the non-adhesive portion is 0.2 mm or more. ### Claim 15 (depends on 8) The semiconductor device according to claim 8, wherein: a width of the non-adhesive portion is 0.5 mm or less. ### Claim 16 A semiconductor device comprising: a semiconductor chip having an electrode; a conductive member including a metal base and having, on a face opposed to the electrode, a mounting portion for the semiconductor chip and a peripheral portion surrounding the mounting portion; a solder that is provided between the electrode and the mounting portion to connect the electrode and the conductive member; and a sealing resin body that integrally seals the semiconductor chip, at least the face opposed to the electrode in the conductive member, and the solder, wherein: the conductive member has, as the peripheral portion, an adhesive portion and a non-adhesive portion; the sealing resin body adheres to the adhesive portion; the non-adhesive portion is placed between the mounting portion and the adhesive portion; the solder does not connect with the non-adhesive portion; and the non-adhesive portion has lower adhesion to the sealing resin body than the adhesive portion; and only at the adhesive portion of the peripheral portion includes a resin layer to increase the adhesion to the sealing resin body. ### Claim 17 (depends on 16) The semiconductor device according to claim 16, wherein: the semiconductor chip has a first electrode, which is the electrode, on a first face side in a thickness direction, and a second electrode on a second face side opposite to the first face side; the semiconductor device further comprises a second conductive member that is disposed, causing the semiconductor chip to be sandwiched between the first conductive member as the conductive member and the second conductive member in the thickness direction, the second conductive member being electrically connected to the second electrode; the sealing resin body integrally seals a face of the second conductive member, the face facing the first conductive member; the first conductive member has, as the peripheral portion, the non-adhesive portion and a first adhesive portion that is the adhesive portion and; and the second conductive member has, on a face opposed to the first conductive member of the second conductive member, a second adhesive portion to which the sealing resin body adheres and which overlaps at least a part of the non-adhesive portion in a plan view in the thickness direction. ### Claim 18 (depends on 17) The semiconductor device according to claim 17, wherein: the second adhesive portion overlaps an entire area of the non-adhesive portion in the thickness direction. ### Claim 19 (depends on 17) The semiconductor device according to claim 17, wherein: the second adhesive portion overlaps only a part in a peripheral direction of the non-adhesive portion surrounding the mounting portion. ### Claim 20 (depends on 17) The semiconductor device according to claim 17, wherein: the second adhesive portion includes a roughened portion having a continuously uneven surface. ### Claim 21 (depends on 16) The semiconductor device according to claim 16, wherein: a width of the non-adhesive portion is 0.2 mm or more. ### Claim 22 (depends on 16) The semiconductor device according to claim 16, wherein: a width of the non-adhesive portion is 0.5 mm or less. ### Claim 23 A semiconductor device comprising: a semiconductor chip having an electrode; a conductive member including a metal base and having, on a face opposed to the electrode, a mounting portion for the semiconductor chip and a peripheral portion surrounding the mounting portion; a solder that is provided between the electrode and the mounting portion to connect the electrode and the conductive member; and a sealing resin body that integrally seals the semiconductor chip, at least the face opposed to the electrode in the conductive member, and the solder, wherein: the conductive member has, as the peripheral portion, an adhesive portion and a non-adhesive portion; the sealing resin body adheres to the adhesive portion; the non-adhesive portion is placed between the mounting portion and the adhesive portion; the solder does not connect with the non-adhesive portion; the non-adhesive portion has lower adhesion to the sealing resin body than the adhesive portion; the semiconductor chip has a first electrode, which is the electrode, on a first face side in a thickness direction, and a second electrode on a second face side opposite to the first face side; the semiconductor device further comprises a second conductive member that is disposed, causing the semiconductor chip to be sandwiched between the first conductive member as the conductive member and the second conductive member in the thickness direction, the second conductive member being electrically connected to the second electrode; the sealing resin body integrally seals a face of the second conductive member, the face facing the first conductive member; the first conductive member has, as the peripheral portion, the non-adhesive portion and a first adhesive portion that is the adhesive portion and; and the second conductive member has, on a face opposed to the first conductive member of the second conductive member, a second adhesive portion to which the sealing resin body adheres and which overlaps at least a part of the non-adhesive portion in a plan view in the thickness direction. ### Claim 24 (depends on 23) The semiconductor device according to claim 23, wherein: the first adhesive portion includes a roughened portion having a continuously uneven surface. ### Claim 25 (depends on 24) The semiconductor device according to claim 24, wherein: the conductive member includes a film on a surface of the metal base; the film has a metal thin film on the surface of the metal base, and an uneven oxide film that is an oxide of metal and that has a continuously uneven surface, the metal being a main component of the metal thin film; the uneven oxide film is provided to an entire area of the first adhesive portion and at least a part of the non-adhesive portion close to the first adhesive portion; and a protrusion on the uneven oxide film is higher at the first adhesive portion than at the non-adhesive portion. ### Claim 26 (depends on 23) The semiconductor device according to claim 23, wherein: only at the first adhesive portion of the peripheral portion includes a resin layer to increase the adhesion to the sealing resin body. ### Claim 27 (depends on 23) The semiconductor device according to claim 23, wherein: the second adhesive portion overlaps an entire area of the non-adhesive portion in the thickness direction. ### Claim 28 (depends on 23) The semiconductor device according to claim 23, wherein: the second adhesive portion overlaps only a part in a peripheral direction of the non-adhesive portion surrounding the mounting portion. ### Claim 29 (depends on 23) The semiconductor device according to claim 23, wherein: the second adhesive portion includes a roughened portion having a continuously uneven surface. ### Claim 30 (depends on 23) The semiconductor device according to claim 23, wherein: a width of the non-adhesive portion is 0.2 mm or more. ### Claim 31 (depends on 23) The semiconductor device according to claim 23, wherein: a width of the non-adhesive portion is 0.5 mm or less.