# US 2019/0355652 A1 · Packages with multiple exposed pads > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0355652 A1 - Document ID: US20190355652A1 - Status: Published application - Kind: A1 - Application number: 16/206,640 - Filed: 2018-11-30 - Published: 2019-11-21 - Earliest claimed: 2018-05-15 - Assignees: Texas Instruments Incorporated - Applicants: Texas Instruments Incorporated - Inventors: Hung-Yu CHOU; Bo-Hsun PAN; Yuh-Harng CHIEN; Fu-Hua YU; Steven Alfred KUMMERL; Jie CHEN; Rajen M. MURUGAN - Web page: https://patentgrep.com/patent/US20190355652A1 ## CPC - H10W 70/461: {specially adapted for cooling} - H10W 70/465: {Bumps or wires} - H10W 70/04: of leadframes - H10W 70/411: {Chip-supporting parts, e.g. die pads} - H10W 70/421: {Shapes or dispositions} - H10W 74/016: {using moulds} - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 90/811: {Multiple chips on leadframes} - H10W 70/427: {Bent parts} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract In an example, an apparatus comprises a lead frame that includes a first row of leads, a first pad coupled to the first row of leads, and a second row of leads parallel to the first row of leads. The lead frame also includes a second pad coupled to the second row of leads. The first and second pads are separated by a gap, and each of the first and second pads has a substantially uniform thickness. The apparatus also includes a device coupled to the first and second pads. The first and second pads are exposed to an exterior of the apparatus. ## Claims ### Claim 1 An apparatus comprising: a lead frame including: a first row of leads; a first pad coupled to the first row of leads; a second row of leads parallel to the first row of leads; and a second pad coupled to the second row of leads, the first and second pads separated by a gap, each of the first and second pads having a substantially uniform thickness; and a device coupled to the first and second pads, wherein the first and second pads are exposed to an exterior of the apparatus. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein the device comprises a shunt. ### Claim 3 (depends on 1) The apparatus of claim 1, wherein the first and second rows of leads comprise gullwing leads. ### Claim 4 (depends on 1) The apparatus of claim 1, wherein the lead frame further includes a third pad and a controller mounted on the third pad, the controller coupled to the device and configured to determine a current flowing through the device based on a differential voltage across the device. ### Claim 5 (depends on 1) The apparatus of claim 1, wherein multiple leads in the first row of leads are fused. ### Claim 6 (depends on 1) The apparatus of claim 1, wherein the gap has a width between approximately 1000 microns to 2000 microns. ### Claim 7 An apparatus comprising: a lead frame including: a first lead; a first pad coupled to the first lead and comprising a first recessed area and a first non-recessed area; a second lead; and a second pad coupled to the second lead and comprising a second recessed area and a second non-recessed area, the first and second recessed areas separated by a first gap; and a device coupled to the first and second non-recessed areas, the device separated from the first recessed area by a second gap and the device separated from the second recessed area by a third gap, wherein the first and second pads are exposed to an exterior of the apparatus. ### Claim 8 (depends on 7) The apparatus of claim 7, wherein the first gap has a vertical dimension of between 100 microns and 400 microns. ### Claim 9 (depends on 7) The apparatus of claim 7, wherein the first non-recessed area has a thickness that is approximately twice that of the first recessed area. ### Claim 10 (depends on 7) The apparatus of claim 7, wherein the first and second leads are gullwing leads. ### Claim 11 (depends on 7) The apparatus of claim 7, wherein the device is a shunt. ### Claim 12 (depends on 7) The apparatus of claim 7, wherein the first lead is fused with another lead. ### Claim 13 (depends on 7) The apparatus of claim 7, wherein the first gap has a width between approximately 1000 microns and 2000 microns. ### Claim 14 A method comprising: fabricating a lead frame including first and second leads, a first pad coupled to the first lead and a second pad coupled to the second lead, the first and second pads separated by a gap; coupling a device to the first and second pads; and applying a mold compound to the lead frame and the device, wherein the first and second pads are exposed to an exterior of the mold compound. ### Claim 15 (depends on 14) The method of claim 14, wherein: the first pad has a first recessed area and a first non-recessed area; the second pad has a second recessed area and a second non-recessed area; and coupling the device to the first and second pads comprises soldering the device to the first non-recessed area and causing solder material to flow into the first recessed area. ### Claim 16 (depends on 14) The method of claim 14, wherein fabricating the lead frame comprises using a stamping technique or an etching technique. ### Claim 17 (depends on 14) The method of claim 14, wherein the device comprises a shunt. ### Claim 18 (depends on 14) The method of claim 14, wherein the first and second leads comprise gullwing leads. ### Claim 19 (depends on 14) The method of claim 14, wherein fabricating the lead frame comprises forming the first pad such that it has a substantially uniform thickness. ### Claim 20 (depends on 14) The method of claim 14, wherein the first pad has a recessed area and a non-recessed area, and wherein the recessed area has a thickness approximately half that of the non-recessed area.