# US 2019/0355645 A1 · Semiconductor packages relating to thermal redistribution patterns > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0355645 A1 - Document ID: US20190355645A1 - Status: Published application - Kind: A1 - Application number: 16/529,548 - Filed: 2019-08-01 - Published: 2019-11-21 - Earliest claimed: 2017-11-15 - Assignees: SK hynix Inc. - Applicants: SK hynix Inc. - Inventors: Dae Woong LEE - Web page: https://patentgrep.com/patent/US20190355645A1 ## CPC - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates} - H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)} - H10W 72/30: Die-attach connectors - H10W 90/00: Package configurations - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor package may include a first semiconductor chip, a second semiconductor chip, and a thermal redistribution pattern which are disposed on a package substrate. The thermal redistribution pattern may include a first end portion disposed in a high temperature region adjacent to the first semiconductor chip, a second end portion disposed in a low temperature region adjacent to the second semiconductor chip, and an extension portion connecting the first end portion to the second end portion. ## Claims ### Claim 1 A semiconductor package comprising: a first semiconductor chip and a second semiconductor chip disposed side by side on a package substrate; and a thermal redistribution pattern including a first end portion, a second end portion and an extension portion, the first end portion disposed over a high temperature region adjacent to the first semiconductor chip, the second end portion disposed over a low temperature region adjacent to the second semiconductor chip, and the extension portion extending horizontally over the package substrate between the first end portion and the second end portion and passing by the second semiconductor chip to detour the second semiconductor chip. ### Claim 2 (depends on 1) The semiconductor package of claim 1, wherein the first end portion of the thermal redistribution pattern is spaced apart from the first semiconductor chip. ### Claim 3 (depends on 2) The semiconductor package of claim 2, wherein a side surface of the first end portion of the thermal redistribution pattern faces a side surface of the first semiconductor chip. ### Claim 4 (depends on 1) The semiconductor package of claim 1, wherein a side surface of the first end portion of the thermal redistribution pattern is in contact with a side surface of the first semiconductor chip. ### Claim 5 (depends on 1) The semiconductor package of claim 1, further comprising a molding layer which is formed on the package substrate to cover the thermal redistribution pattern, wherein the molding layer fills a gap between the extension portion of the thermal redistribution pattern and the package substrate to surround the extension portion. ### Claim 6 (depends on 5) The semiconductor package of claim 5, wherein the thermal redistribution pattern has a thermal conductivity which is higher than a thermal conductivity of the molding layer. ### Claim 7 (depends on 6) The semiconductor package of claim 6, wherein the thermal redistribution pattern includes a metal material containing copper. ### Claim 8 (depends on 7) The semiconductor package of claim 7, wherein the molding layer electrically insulates the extension portion of the thermal redistribution patterns from the package substrate. ### Claim 9 (depends on 1) The semiconductor package of claim 1, wherein the high temperature region includes the first semiconductor chip and the low temperature region does not include a semiconductor chip. ### Claim 10 (depends on 1) The semiconductor package of claim 1, wherein the first end portion of the thermal redistribution pattern has a width which is greater than a width of the extension portion of the thermal redistribution pattern. ### Claim 11 (depends on 10) The semiconductor package of claim 10, wherein the thermal redistribution pattern further includes a joint portion disposed between the first end portion and the extension portion; and wherein a width of the joint portion of the thermal redistribution pattern is reduced in a direction from the first end portion to the extension portion. ### Claim 12 (depends on 11) The semiconductor package of claim 11, wherein the thermal redistribution pattern further includes a joint portion disposed between the first end portion and the extension portion, and wherein a width of the joint portion of the thermal redistribution pattern is substantially uniform. ### Claim 13 (depends on 12) The semiconductor package of claim 12, wherein the width of the joint portion of the thermal redistribution pattern is substantially equal to the width of the extension portion and less than the width of the first end portion. ### Claim 14 (depends on 1) The semiconductor package of claim 1, wherein the first end portion of the thermal redistribution pattern has a closed loop shape surrounding the first semiconductor chip. ### Claim 15 (depends on 1) The semiconductor package of claim 1, wherein electric power consumed by the first semiconductor chip is greater than electric power consumed by the second semiconductor chip. ### Claim 16 (depends on 1) The semiconductor package of claim 1, wherein a distance between the low temperature region and the first semiconductor chip is greater than a distance between the second semiconductor chip and the first semiconductor chip. ### Claim 17 (depends on 1) The semiconductor package of claim 1, wherein a thickness of the thermal redistribution pattern is substantially equal to or less than a thickness of the thickest one of either the first or second semiconductor chips. ### Claim 18 (depends on 1) The semiconductor package of claim 1, wherein the low temperature region is located in a corner region of the semiconductor package that is located farthest from the first semiconductor chip. ### Claim 19 A semiconductor package comprising: a first semiconductor chip and a second semiconductor chip disposed side by side on a package substrate; and a thermal redistribution pattern including a first end portion, a second end portion and a plurality of sub-extension portions, the first end portion disposed over a high temperature region adjacent to the first semiconductor chip, the second end portion disposed over a low temperature region adjacent to the second semiconductor chip, the plurality of sub-extension portions arrayed along a path with extending horizontally over the package between the first end portion and the second end portion, the plurality of sub-extension portions arrayed to pass by the second semiconductor chip to detour the second semiconductor chip, and the plurality of sub-extension portions spaced part from each other. ### Claim 20 A semiconductor package comprising: a first semiconductor chip and a second semiconductor chip disposed side by side on a package substrate; and a thermal redistribution pattern including a first end portion, a second end portion and an extension portion, the first end portion disposed adjacent to the first semiconductor chip, the second end portion disposed adjacent to the second semiconductor chip, the extension portion connected to the first end portion and the second end portion, and configured to reduce a bottleneck phenomenon of heat transmission when transferring heat from the first end portion to the second end portion, and the extension portion extending horizontally over the package substrate and passing by the second semiconductor chip to detour the second semiconductor chip.