# US 2019/0355607 A1 · Thermally isolated electronics utilities cavity for a substrate carrier > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0355607 A1 - Document ID: US20190355607A1 - Status: Published application - Kind: A1 - Application number: 15/986,452 - Filed: 2018-05-22 - Published: 2019-11-21 - Earliest claimed: 2018-05-21 - Assignees: Applied Materials, Inc. - Applicants: Applied Materials, Inc. - Inventors: Shreesha Y. RAO; Joseph VINCENT; Wenwei QIAO; John M. WHITE - Web page: https://patentgrep.com/patent/US20190355607A1 ## CPC - H10P 72/0434: {mainly by convection} - H01M 10/658: by thermal insulation or shielding - H01M 50/24: adapted for protecting batteries from their environment, e.g. from corrosion (thermal insulation H01M10/658) - H10P 72/0402: {Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence)} - H10P 72/18: {characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports} - H10P 72/722: {Details of electrostatic chucks} - H10P 72/7624: {characterised by the mechanical construction of the susceptor, stage or support} - H01J 37/32697: {Electrostatic control} - H01J 37/32724: {Temperature} - H01J 2237/002: Cooling arrangements - H01M 2220/30: Batteries in portable systems, e.g. mobile phone, laptop - Y02E 60/10: Energy storage using batteries - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H01M: PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION ## Abstract Described herein is a substrate carrier comprises a plurality of electrostatic chuck panels and a carrier body. The plurality of electrostatic chuck panels is disposed on the carrier body. The carrier body has an electronics utilities cavity, and a thermal insulating material disposed on at least one wall of the electronics utilities cavity. A battery is disposed within the electronics cavity, and is configured to provide a first power supply signal to control electronics. The carrier body may additionally include a first body member having the electrostatic chuck panels disposed thereon, and a second body member separated from the first body member by thermal breaks. The electronics utilities cavity may be housed within the second body member of the carrier body. ## Claims ### Claim 1 A substrate carrier comprising a plurality of electrostatic chuck panels; a carrier body having the electrostatic chuck panels disposed thereon, the carrier body comprising: an electronics utilities cavity; a battery disposed within the electronics cavity and configured to provide a first power supply signal to control electronics; and a thermal insulating material disposed on at least one wall of the electronics utilities cavity. ### Claim 2 (depends on 1) The substrate carrier of claim 1, wherein the thermal insulating material is one of a ceramic material, a yttria-stablized zirconia coating, fiberglass, PEEK, mineral wool, and polyurethane foam. ### Claim 3 (depends on 1) The substrate carrier of claim 1, wherein the thermal insulating material is disposed on each wall of the electronics utilities cavity. ### Claim 4 (depends on 1) The substrate carrier of claim 1, wherein the carrier body further comprises: a first body member; and a second body member, and wherein the electronics utilities cavity is disposed within the second body member and the electrostatic chuck panels are disposed over the first body member. ### Claim 5 (depends on 4) The substrate carrier of claim 4, wherein the carrier body further comprises thermal breaks disposed between the first body member and the second body member. ### Claim 6 (depends on 5) The substrate carrier of claim 5, wherein each of the thermal breaks has a thermal conductivity lower than a thermal conductivity of the first and second body members. ### Claim 7 (depends on 1) The substrate carrier of claim 1, further comprising a high voltage power supply disposed in the electronics utilities cavity, the high voltage power supply is configured to provide a second power supply signal to the plurality of electrostatic chuck panels, wherein the first power supply signal is a lower voltage than the second power supply signal. ### Claim 8 (depends on 7) The substrate carrier of claim 7, wherein the battery is configured to power the high voltage power supply. ### Claim 9 (depends on 1) The substrate carrier of claim 1, wherein the electronics utilities cavity comprises one or more vacuum feedthroughs, and wherein a first lead is coupled to the battery through the one or more vacuum feedthroughs, and is configured to couple the battery with an external power source. ### Claim 10 (depends on 1) The substrate carrier of claim 1 further comprising a second battery disposed within the electronics cavity. ### Claim 11 (depends on 1) The substrate carrier of claim 1, wherein the electronics utilities cavity is configured to maintain an internal volume of the electronics utilities cavity at about 1 ATM. ### Claim 12 A substrate carrier comprising a plurality of electrostatic chuck panels; a carrier body comprising: a first body member having the electrostatic chuck panels disposed thereon; a second body member separated from the first body member by thermal breaks; an electronics utilities cavity disposed within the second body member; a battery disposed within the electronics cavity and configured to provide a first power supply signal to control electronics; and a thermal insulating material disposed on at least one wall of the electronics utilities cavity. ### Claim 13 (depends on 12) The substrate carrier of claim 12, wherein the carrier body is comprised of a first material and the thermal breaks are comprised of a second material having a lower thermal conductivity than the first material. ### Claim 14 (depends on 12) The substrate carrier of claim 12, wherein the thermal breaks and the carrier body are comprised of a common material. ### Claim 15 (depends on 12) The substrate carrier of claim 12, wherein the carrier body further comprises a gas delivery manifold cavity having an upper portion and a lower portion, and wherein one of the thermal breaks comprises an opening providing a passageway between the upper portion and the lower portion of the gas delivery manifold. ### Claim 16 (depends on 12) The substrate carrier of claim 12, further comprising a high voltage power supply disposed in the electronics utilities cavity, the high voltage power supply is configured to provide a second power supply signal to the plurality of electrostatic chuck panels, wherein the first power supply signal is a lower voltage than the second power supply signal, and wherein the battery is configured to power the high voltage power supply. ### Claim 17 (depends on 12) The substrate carrier of claim 12, wherein the electronics utilities cavity comprises one or more vacuum feedthroughs, and wherein a first lead is coupled to the battery through the one or more vacuum, and the first lead is configured to couple the battery with an external power source. ### Claim 18 (depends on 12) The substrate carrier of claim 12, wherein the thermal insulating material is disposed on each wall of the electronics utilities cavity. ### Claim 19 A carrier body for a substrate carrier having a plurality of electrostatic chuck panels, the carrier body comprising: a first body member configured to have the electrostatic chuck panels disposed thereon; a second body member separated from the first body member by thermal breaks; an electronics utilities cavity disposed within the second body member; control electronics disposed within the electronics utilities cavity; a high voltage power supply disposed within the electronics utilities cavity, and configured to supply a second power supply signal; a battery disposed within the electronics cavity, and configured to provide a first power supply signal to the control electronics and the high voltage power supply, the first power supply signal is a lower voltage than the second power supply signal; and a thermal insulating material disposed on at least one wall of the electronics utilities cavity. ### Claim 20 (depends on 19) The carrier body of claim 19, wherein thermal breaks comprise a first material and the first and second body members comprise a second material, the first material comprises a lower thermal conductivity than the second material.