# US 2019/0355602 A1 · Die component supply device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0355602 A1 - Document ID: US20190355602A1 - Status: Published application - Kind: A1 - Application number: 16/462,292 - Filed: 2016-12-06 - Published: 2019-11-21 - Earliest claimed: 2016-12-06 - Assignees: Fuji Corporation - Applicants: Fuji Corporation - Inventors: Masashi HAYAKAWA - Web page: https://patentgrep.com/patent/US20190355602A1 ## CPC - H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape} - H10P 72/0616: {Monitoring of warpages, curvatures, damages, defects or the like} - G01N 21/9505: {Wafer internal defects, e.g. microcracks} - H05K 13/043: {Feeding one by one by other means than belts} - H05K 13/0813: {Controlling of single components prior to mounting, e.g. orientation, component geometry (H05K13/0812 takes precedence)} - H05K 13/084: {Product tracking, e.g. of substrates during the manufacturing process; Component traceability} - H10P 54/00: Cutting or separating of wafers, substrates or parts of devices - H10P 72/00: Handling or holding of wafers, substrates or devices during manufacture or treatment thereof - H10P 72/0446: {Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates} - H10P 72/0606: {Position monitoring, e.g. misposition detection or presence detection} - H10P 72/50: for positioning, orientation or alignment - H10P 72/53: {using optical controlling means} - H10P 72/76: using mechanical means, e.g. clamps or pinches - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A die component supply device includes a wafer holding section; a suction nozzle configured to pick up the die components one by one from the component holding sheet; an imaging camera configured to image the die component, which is a pickup target of the suction nozzle, together with the surrounding condition, before being picked up to obtain component image data; a driving section configured to move the suction nozzle and the imaging camera with respect to the wafer holding section; and a data processing memory section configured to collectively store multiple pieces of component image data obtained for each multiple die component or multiple pieces of component characteristic data obtained by performing image processing on the multiple pieces of component image data in wafer characteristic data. ## Claims ### Claim at position 1 -10. (canceled) ### Claim 11 A die component supply device comprising: a wafer holding section having an elastic component holding sheet configured to hold multiple die components formed by dicing a semiconductor wafer on an upper face of the component holding sheet and a support ring configured to support a peripheral edge of the component holding sheet; a suction nozzle configured to pick up the die components one by one from the component holding sheet; an imaging camera configured to image the die component, together with the surrounding condition before being picked up, to obtain component image data, the die component being a pickup target of the suction nozzle; a driving section configured to move the suction nozzle and the imaging camera with respect to the wafer holding section; and a data processing memory section configured to collectively store, in wafer characteristic data, multiple pieces of the component image data obtained for each of the multiple die components or multiple pieces of component characteristics data obtained by performing image processing on each of the multiple pieces of component image data. ### Claim 12 (depends on 11) The die component supply device according to claim 11, wherein the data processing memory section collectively stores the multiple pieces of component characteristic data in the wafer characteristic data, and the component characteristic data includes at least one item of a position of the die component, a size of the die component, and a separation distance between the adjacent die components, which are represented by using a coordinate system set in the wafer holding section. ### Claim 13 (depends on 11) The die component supply device according to claim 11, further comprising; a push-up pot configured to push up the die component together with the component holding sheet from a holding height to a pickup height, wherein the imaging camera images the die component at the holding height, and the suction nozzle picks up the die component at the pickup height. ### Claim 14 (depends on 13) The die component supply device according to claim 13, wherein the data processing memory section stores information on at least one of the push-up position and the push-up height of the push-up pot set for each of the die components in association with the component image data, or includes the information in the component characteristic data. ### Claim 15 (depends on 11) The die component supply device according to claim 11, further comprising: an inspection execution section configured to execute a predetermined inspection by using the stored wafer characteristic data. ### Claim 16 (depends on 15) The die component supply device according to claim 15, wherein the inspection execution section graphically displays an inspection result of the executed inspection in association with shape of the wafer holding section. ### Claim 17 (depends on 15) The die component supply device according to claim 15, wherein the inspection execution section outputs an inspection result of the executed inspection to at least one of an upstream-side device and a downstream-side device. ### Claim 18 (depends on 15) The die component supply device according to claim 15, wherein the inspection execution section compares a wafer map representing dispositions of the multiple die components on the upper face of the component holding sheet with the wafer characteristic data to inspect whether the picked up die component is suitable. ### Claim 19 (depends on 15) The die component supply device according to claim 15, wherein, based on the wafer characteristic data, the inspection execution section obtains a separation distance between the adjacent die components to inspect at least one of the possibility of the picked up die component being misrecognized, the possibility of the die component being damaged, and the expanded state of the component holding sheet is acceptable. ### Claim 20 (depends on 15) The die component supply device according to claim 15, wherein based on the wafer characteristic data, the inspection execution section obtains variations in sizes of the multiple die components to inspect whether the dicing state of the semiconductor wafer is acceptable.