# US 2019/0355594 A1 · Substrate processing apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0355594 A1 - Document ID: US20190355594A1 - Status: Published application - Kind: A1 - Application number: 16/410,378 - Filed: 2019-05-13 - Published: 2019-11-21 - Earliest claimed: 2018-05-18 - Assignees: Ebara Corporation - Applicants: Ebara Corporation - Inventors: Hidetatsu ISOKAWA; Koji MAEDA; Xu HAIYANG; Shun EHARA - Web page: https://patentgrep.com/patent/US20190355594A1 ## CPC - B08B 3/02: Cleaning by the force of jets or sprays - B08B 3/041: {Cleaning travelling work} - B24B 37/345: {Feeding, loading or unloading work specially adapted to lapping} - H10P 72/0414: {using mainly spraying means, e.g. nozzles} - H10P 72/0456: {in-line arrangement} - H10P 72/0472: {comprising at least one polishing chamber} - H10P 72/3302: {Mechanical parts of transfer devices} - H10P 72/3304: {characterised by movements or sequence of movements of transfer devices} - H10P 72/7602: {the wafers being placed on a robot blade or gripped by a gripper for conveyance} - B08B: CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A mechanism that conveys a substrate is cleaned in a cleaning unit. A substrate processing apparatus that includes a substrate polishing device and a substrate cleaning unit is disclosed. The substrate cleaning unit includes a cleaning module and a cleaning unit conveyance mechanism. The cleaning unit conveyance mechanism includes a hand and a hand open/close mechanism. The substrate processing apparatus further includes a hand cleaning unit. The hand cleaning unit includes a hand cleaning tank and a cleaning liquid injection mechanism. ## Claims ### Claim 1 A substrate processing apparatus comprising: a substrate polishing device; and a substrate cleaning unit configured to clean a substrate polished by the substrate polishing device, wherein the substrate cleaning unit includes: a cleaning module configured to perform a cleaning of the substrate; and a cleaning unit conveyance mechanism configured to convey the substrate in the substrate cleaning unit, the cleaning unit conveyance mechanism includes: a hand configured to hold the substrate; and a hand open/close mechanism configured to open and close the hand, the substrate processing apparatus further includes a hand cleaning unit configured to clean the hand, and the hand cleaning unit includes: a hand cleaning tank disposed on a side portion of the cleaning module in a direction in which the hand opens and closes, the hand cleaning tank being configured to house the hand; and a cleaning liquid injection mechanism configured to inject a cleaning liquid toward a predetermined position when the hand is housed in the hand cleaning tank. ### Claim 2 (depends on 1) The substrate processing apparatus according to claim 1, wherein the predetermined position includes a position where the hand is to be housed. ### Claim 3 (depends on 1) The substrate processing apparatus according to claim 1, wherein the cleaning unit conveyance mechanism further includes a hand up-and-down motion mechanism that moves the hand up and down, and the hand cleaning tank is disposed at a position where the hand is allowed to be housed when the hand is opened and moved down by the hand open/close mechanism and the hand up-and-down motion mechanism. ### Claim 4 (depends on 1) The substrate processing apparatus according to claim 1, wherein the hand is configured to hold the substrate with a claw, and the predetermined position includes a position where the claw is to be housed. ### Claim 5 (depends on 1) The substrate processing apparatus according to claim 1, wherein the hand cleaning tank has a bottom portion where an opening is formed, and the bottom portion of the hand cleaning tank has a shape lowered toward the opening. ### Claim 6 (depends on 1) The substrate processing apparatus according to claim 1, wherein the hand cleaning tank has an open upper portion. ### Claim 7 (depends on 1) The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus further includes a control unit, and the control unit controls the substrate processing apparatus such that the cleaning liquid is injected toward the predetermined position in at least any case of: after the substrate is conveyed to the cleaning module; before the substrate is conveyed from the cleaning module; and in a standby time of the substrate cleaning unit. ### Claim 8 (depends on 1) A method for cleaning the hand in the substrate processing apparatus according to claim 1, the hand cleaning method comprising: housing the hand in the hand cleaning tank; and injecting the cleaning liquid toward the predetermined position using the cleaning liquid injection mechanism.