# US 2019/0355577 A1 · Method for printing micro line pattern using inkjet technology > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0355577 A1 - Document ID: US20190355577A1 - Status: Published application - Kind: A1 - Application number: 16/411,152 - Filed: 2019-05-14 - Published: 2019-11-21 - Earliest claimed: 2018-05-16 - Assignees: Unijet Co., Ltd. - Applicants: Unijet Co., Ltd. - Inventors: Seog-soon KIM - Web page: https://patentgrep.com/patent/US20190355577A1 ## CPC - C09D 11/101: Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing - H10P 14/6346: {using printing, e.g. ink-jet printing} - C09D 11/34: Hot-melt inks - C09D 11/52: Electrically conductive inks - H05K 3/125: {by ink-jet printing} - H05K 3/1258: {by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern} - H10P 72/0602: {Temperature monitoring} - H10W 20/067: {by modifying the pattern of conductive parts} - H10W 20/095: {by irradiating with electromagnetic or particle radiation (plasma treatment H10W20/096)} - H10W 70/098: {Applying pastes or inks, e.g. screen printing (H10W70/095 takes precedence)} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H05K 3/1208: {Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns (providing shape patterns H05K3/1258; adhesion treatments H05K3/38)} - H05K 2201/09909: Special local insulating pattern, e.g. as dam around component - H05K 2203/013: Inkjet printing, e.g. for printing insulating material or resist - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 72/011: {Apparatus therefor} - H10W 72/072: {of bump connectors} - H10W 72/9413: {on encapsulations} - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method for printing a micro line pattern using inkjet printing, includes: a bump forming process for forming a micro bump that sections a predetermined conductive pattern by inkjet-printing a quick drying liquid on a substrate; and a pattern printing process for printing a conductive pattern according to the predetermined conductive pattern by inkjet-printing a conductive liquid on an area sectioned by the micro bump. ## Claims ### Claim 1 A method for printing a micro line pattern using inkjet printing, the method comprising: a bump forming process for forming a micro bump that sections a predetermined conductive pattern by inkjet-printing a quick drying liquid on a substrate; and a pattern printing process for printing a conductive pattern according to the predetermined conductive pattern by inkjet-printing a conductive liquid on an area sectioned by the micro bump. ### Claim 2 (depends on 1) The method of claim 1, wherein the quick drying liquid is photocurable ink that is inkjet-printed and then gelled by light. ### Claim 3 (depends on 1) The method of claim 1, wherein the quick drying liquid is hot melt ink that is inkjet-printed and then gelled by phase change due to a temperature difference. ### Claim 4 (depends on 1) The method of claim 1, wherein the quick drying liquid has a hydrophobic surface characteristic after dried. ### Claim 5 (depends on 1) The method of claim 1, wherein a surface of the substrate is hydrophobic-treated. ### Claim 6 (depends on 1) The method of claim 1, wherein the bump forming process increases a height of the micro bump by repeatedly inkjet-printing the quick drying liquid. ### Claim 7 (depends on 1) The method of claim 1, wherein the pattern printing process increases a height of the conductive pattern by repeatedly inkjet-printing the conductive liquid. ### Claim 8 (depends on 1) The method of claim 1, wherein each of the inkjet-printing of the quick drying liquid in the bump forming process and the inkjet-printing of the conductive liquid in the pattern printing process is performed by a drop on demand (DOD) inkjet printing method. ### Claim 9 (depends on 1) The method of claim 1, further comprising a bump removing process for removing the micro bump formed in the bump forming process after the pattern printing process. ### Claim 10 (depends on 2) The method of claim 2, wherein the bump forming process and the pattern printing process are performed by an inkjet printing device comprising: a transfer unit configured to transfer the substrate in one direction; a first head configured to reciprocatingly move in a vertical direction at a front end of a movement direction of the substrate to jet the quick drying liquid; a light irradiation unit installed adjacent to the first head; and a second head installed at a rear end of the movement direction of the substrate to reciprocatingly move in a direction perpendicular to the movement direction of the substrate, thereby jetting the conductive liquid, wherein the bump forming process is performed such that the quick drying liquid is deposited on the substrate in a state of being inkjet-printed by the first head and then gelled by light irradiated from the light irradiation unit, to form the micro bump, the pattern printing process is performed such that the conductive liquid is inkjet-printed between the micro bumps by the second head, to from the conductive pattern, and the micro bump and the conductive pattern are printed at the same time. ### Claim 11 (depends on 10) The method of claim 10, wherein the first head and the light irradiation unit are integrated with each other to move together, and the first head, the light irradiation unit, and the second head are integrated with each other to move together. ### Claim 12 (depends on 10) The method of claim 10, wherein the inkjet printing device is installed in a closed space having a helium gas atmosphere, and the process of forming the micro bump by the quick drying liquid that is inkjet-printed from the first head and the process of forming the conductive pattern by the conductive liquid that is inkjet-printed between the micro bumps by the second head are performed under the helium gas atmosphere.