# US 2019/0355573 A1 · Film forming system, film forming method, and computer storage medium > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0355573 A1 - Document ID: US20190355573A1 - Status: Published application - Kind: A1 - Application number: 16/481,136 - Filed: 2018-01-04 - Published: 2019-11-21 - Earliest claimed: 2017-02-07 - Assignees: Tokyo Electron Limited - Applicants: Tokyo Electron Limited - Inventors: Satoru SHIMURA; Masashi ENOMOTO - Web page: https://patentgrep.com/patent/US20190355573A1 ## CPC - H10P 74/23: {characterised by multiple measurements, corrections, marking or sorting processes} - H10P 95/08: {Planarisation of organic insulating materials} - G03F 7/168: {Finishing the coated layer, e.g. drying, baking, soaking} - H10P 14/683: {carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC} - H10P 50/287: {by chemical means} - H10P 72/0436: {mainly by radiation} - H10P 72/0448: {Apparatus for applying a liquid, a resin, an ink or the like} - H10P 72/0458: {vertical arrangement} - H10P 72/0604: {Process monitoring, e.g. flow or thickness monitoring} - H10P 72/7618: {characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel} - H10P 76/2041: {Photolithographic processes} - H10W 20/01: {Manufacture or treatment} - H10P 14/6342: {Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating} - H10P 14/6902: {composed of carbon, e.g. alpha-C, diamond or hydrogen doped carbon} - H10P 72/0432: {mainly by conduction} - H10P 72/7612: {characterised by lifting arrangements, e.g. lift pins} - H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A film forming system is to form an organic film on a substrate having a pattern formed on a surface thereof, includes: an organic film formation section configured to perform an organic film formation treatment on the substrate to form the organic film on the substrate; a film thickness measurement section configured to measure a film thickness of the organic film on the substrate; and an ultraviolet treatment section configured to perform an ultraviolet irradiation treatment on the organic film on the substrate to remove a surface of the organic film. In the film forming system, the organic film formation section, the film thickness measurement section, and the ultraviolet treatment section are disposed side by side in this order along a transfer direction of the substrate. ## Claims ### Claim 1 A film forming system for forming an organic film on a substrate having a pattern formed on a surface thereof, the film forming system comprising: an organic film formation section configured to perform an organic film formation treatment on the substrate to form the organic film on the substrate; a film thickness measurement section configured to measure a film thickness of the organic film on the substrate; and an ultraviolet treatment section configured to perform an ultraviolet irradiation treatment on the organic film on the substrate to remove a surface of the organic film, wherein the organic film formation section, the film thickness measurement section, and the ultraviolet treatment section are disposed side by side in this order along a transfer direction of the substrate. ### Claim 2 (depends on 1) The film forming system according to claim 1, further comprising a controller configured to control the organic film formation section, the film thickness measurement section, and the ultraviolet treatment section. ### Claim 3 (depends on 2) The film forming system according to claim 2, wherein the controller is configured to perform control so that: the organic film formation section performs the organic film formation treatment on the substrate to form the organic film on the substrate, the ultraviolet treatment section removes the surface of the organic film, and the film thickness measurement section measures a film thickness of the organic film from which the surface has been removed; and the ultraviolet treatment unit further removes a surface of the organic film from which the surface has been removed, when a measurement result by the film thickness measurement section does not satisfy a predetermined condition. ### Claim 4 (depends on 3) The film forming system according to claim 3, wherein the controller is configured to perform control so that the organic film formation section performs an additional organic film formation treatment on the organic film from which the surface has been removed, when the measurement result by the film thickness measurement section satisfies the predetermined condition. ### Claim 5 (depends on 2) The film forming system according to claim 2, wherein the controller is configured to: perform control so that the film thickness measurement section measures the film thickness of the organic film formed by the organic film formation treatment by the organic film formation section, and adjust a treatment condition in the organic film formation treatment based on a measurement result; and perform control so that the film thickness measurement section measures a film thickness of the organic film which has been formed by the organic film formation treatment and from which the surface has been removed by the ultraviolet treatment section, and adjust a treatment condition in the ultraviolet irradiation treatment based on a measurement result. ### Claim 6 (depends on 2) The film forming system according to claim 2, wherein the controller is configured to perform control so that the film thickness measurement section measures a film thickness of the organic film which has been formed by the organic film formation treatment by the organic film formation section and from which the surface has been removed by the ultraviolet treatment section, and adjust a treatment condition in the organic film formation treatment based on a measurement result. ### Claim 7 (depends on 5) The film forming system according to claim 5, wherein the controller is configured to perform control so that the film thickness measurement section measures a film thickness of the organic film after an additional organic film formation treatment by the organic film formation section on the organic film from which the surface has been removed, and adjust a treatment condition in the additional organic film formation treatment based on a measurement result. ### Claim 8 (depends on 2) The film forming system according to claim 2, wherein the film thickness measurement section includes a first measurement part configured to measure the film thickness using a Scatterometry method, and a second measurement part configured to measure the film thickness based on a captured image. ### Claim 9 (depends on 4) The film forming system according to claim 4, wherein the controller is configured to: calculate at lease any one of a treatment condition in the organic film formation treatment, a treatment condition in the ultraviolet irradiation treatment, and a treatment condition in the additional organic film formation treatment, based on information relating to the pattern on the substrate; and perform control so that the film thickness measurement section measures a film thickness of the organic film after a treatment under the treatment condition relating to a calculation result, and adjust the treatment condition relating to the calculation result based on a measurement result. ### Claim 10 (depends on 1) The film forming system according to claim 1, further comprising another film thickness measurement section configured to measure the film thickness of the organic film on the substrate, wherein a transfer in/out section configured to transfer in/out the substrate to/from the film forming system, the another film thickness measurement section, and the organic film formation section are disposed side by side in this order along the transfer direction of the substrate. ### Claim 11 A film forming method of forming an organic film on a substrate having a pattern formed on a surface thereof, the film forming method comprising: performing an organic film formation treatment on the substrate to form the organic film on the substrate; removing a surface of the organic film formed by the organic film formation treatment, by an ultraviolet irradiation treatment; measuring a film thickness of the organic film from which the surface has been removed by the removing; and further removing a surface of the organic film from which the surface has been removed, when a measurement result at the measuring the film thickness of the organic film does not satisfy a predetermined condition. ### Claim 12 (depends on 11) The film forming method according to claim 11, further comprising performing an additional organic film formation treatment on the organic film from which the surface has been removed, when the measurement result at the measuring the film thickness of the organic film satisfies the predetermined condition. ### Claim 13 (depends on 12) The film forming method according to claim 12, further comprising: calculating at lease any one of a treatment condition in the organic film formation treatment, a treatment condition in the ultraviolet irradiation treatment, and a treatment condition in the additional organic film formation treatment, based on information relating to the pattern on the substrate; and measuring a film thickness of the organic film after a treatment under the treatment condition relating to a calculation result, wherein the treatment condition relating to the calculation result is adjusted based on a measurement result. ### Claim 14 A film forming method of forming an organic film on a substrate having a pattern formed on a surface thereof, the film forming method comprising: performing an organic film formation treatment on the substrate to form the organic film on the substrate; removing a surface of the organic film formed by the organic film formation treatment, by an ultraviolet irradiation treatment; and measuring a film thickness of the organic film on the substrate, wherein a treatment condition in the organic film formation treatment or in the ultraviolet irradiation treatment is adjusted based on a measurement result at the measuring the film thickness of the organic film. ### Claim 15 (depends on 14) The film forming method according to claim 14, wherein the measuring the film thickness of the organic film includes measuring the film thickness of the organic film formed by the organic film formation treatment, and measuring a film thickness of the organic film from which the surface has been removed by the ultraviolet irradiation treatment, and wherein the treatment condition in the organic film formation treatment is adjusted based on a measurement result at the measuring the film thickness of the organic film formed by the organic film formation treatment, and the treatment condition in the ultraviolet irradiation treatment is adjusted based on a measurement result at the measuring the film thickness of the organic film from which the surface has been removed by the ultraviolet irradiation treatment. ### Claim 16 (depends on 14) The film forming method according to claim 14, wherein the measuring the film thickness of the organic film includes measuring a film thickness of the organic film from which the surface has been removed by the ultraviolet irradiation treatment, and wherein the treatment condition in the organic film formation treatment is adjusted based on a measurement result at the measuring the film thickness of the organic film from which the surface has been removed by the ultraviolet irradiation treatment. ### Claim 17 (depends on 15) The film forming method according to claim 15, further comprising performing an additional organic film formation treatment on the organic film from which the surface has been removed, wherein the measuring the film thickness of the organic film includes measuring a film thickness of the organic film after the additional organic film formation treatment, and wherein a treatment condition in the additional organic film formation treatment is adjusted based on a measurement result at the measuring the film thickness of the organic film after the additional organic film formation treatment. ### Claim 18 (depends on 11) The film forming method according to claim 11, wherein the measuring the film thickness of the organic film includes measuring the film thickness using a Scatterometry method, and measuring the film thickness based on a captured image. ### Claim 19 A computer-readable storage medium storing a program running on a computer of a controller configured to control a film forming system to cause the film forming system to execute a film forming method of forming an organic film on a substrate having a pattern formed on a surface thereof, the film forming method comprising: performing an organic film formation treatment on the substrate to form the organic film on the substrate; removing a surface of the organic film formed by the organic film formation treatment, by an ultraviolet irradiation treatment; measuring a film thickness of the organic film from which the surface has been removed by the removing; and further removing a surface of the organic film from which the surface has been removed, when a measurement result at the measuring the film thickness of the organic film does not satisfy a predetermined condition. ### Claim 20 A computer-readable storage medium storing a program running on a computer of a controller configured to control a film forming system to cause the film forming system to execute a film forming method of forming an organic film on a substrate having a pattern formed on a surface thereof, the film forming method comprising: performing an organic film formation treatment on the substrate to form the organic film on the substrate; removing a surface of the organic film formed by the organic film formation treatment, by an ultraviolet irradiation treatment; and measuring a film thickness of the organic film on the substrate, wherein a treatment condition in the organic film formation treatment or in the ultraviolet irradiation treatment is adjusted based on a measurement result at the measuring the film thickness of the organic film.