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US 2019/0338171 A1Published application
Thermally conductive paste and electronic device
AssigneeSumitomo Bakelite Co., Ltd.
InventorKoji MAKIHARA
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Abstract
A thermally conductive paste of the present invention includes a thermosetting resin, a curing agent, an acrylic compound, and a thermally conductive filler, at least one of the thermosetting resin and the curing agent contains a resin having a biphenyl skeleton, and the acrylic compound contains a (meth)acrylic monomer.
Claims17
A thermally conductive paste used for a die-attach material comprising:
- a thermosetting resin;
- a curing agent;
- an acrylic compound;
- and
- a thermally conductive filler,
- wherein at least one of the thermosetting resin and the curing agent contains a resin having a biphenyl skeleton,
- wherein the resin has a biphenyl skeleton contains a phenol resin having a biphenyl skeleton,
- wherein the acrylic compound contains a (meth)acrylic monomer, and
- wherein the thermosetting resin contains an epoxy resin.
6 more elements
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Dependencies are inferred from the claim text.