Thermally-Conductive Resin Composition, and Complex Comprising Same
AssigneeLotte Advanced Materials Co., Ltd.
InventorsJee Kwon PARK, Yeong Deuk SEO, Jung Ki KIM, Yoo Jin JUNG, Sang Hyun HONG
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Abstract
A thermally-conductive resin composition according to the present invention comprises: approximately 10-50 wt % polycarbonate resin; approximately 1-10 wt % glycol-modified polyester resin; approximately 1-15 wt % glass transition temperature depressing agent; approximately 5-20 wt % additive for laser direct structuring; approximately 10-35 wt % boron nitride having average particle size (D50) of approximately 10 μm or greater; and approximately 10-30 wt % glass fiber having a non-circular cross-sectional surface.
Claims14
A thermally conductive resin composition comprising:
- about 10 wt % to about 50 wt % of a polycarbonate resin;
- about 1 wt % to about 10 wt % of a glycol-modified polyester resin;
- about 1 wt % to about 15 wt % of a glass transition temperature reduction agent;
- about 5 wt % to about 20 wt % of an agent for laser direct structuring;
- about 10 wt % to about 35 wt % of boron nitride having an average particle diameter (D50) of about 10 μm or more;
- and
- about 10 wt % to about 30 wt % of glass fibers having a non-circular cross-section.
Dependencies are inferred from the claim text.