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US 2019/0338068 A1Published application
Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material
AssigneeHitachi Chemical Company, Ltd.
InventorsNaoki MARUYAMA, Tomoko HIGASHIUCHI, Kazumasa FUKUDA, Yuka YOSHIDA, Yoshitaka TAKEZAWA
Life of this patent
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Abstract
An epoxy resin, comprising a first epoxy compound having a mesogenic structure and a second epoxy compound having two or more mesogenic structures that are the same as the mesogenic structure of the first epoxy compound, a proportion, determined by liquid chromatography, of the first epoxy compound being from 40% to 50% with respect to a total amount of the epoxy resin.
Claims9
1:
- An epoxy resin, comprising a first epoxy compound having a mesogenic structure and a second epoxy compound having two or more mesogenic structures that are the same as the mesogenic structure of the first epoxy compound,
- a proportion, determined by liquid chromatography, of the first epoxy compound being from 40% to 50% with respect to a total amount of the epoxy resin, and
- an epoxy equivalent amount of the epoxy resin being 500 g/eq or less.
2:
- The epoxy resin according to claim 1, wherein the first epoxy compound comprises an epoxy compound represented by the following Formula (M):
- wherein, in Formula (M), each of R1 to R4 independently represents a hydrogen atom or an alkyl group having from 1 to 3 carbon atoms.
3:
- The epoxy resin according to claim 1, wherein the second epoxy compound comprises an epoxy compound having two or more structures represented by the following Formula (I):
- wherein, in Formula (I), each of R1 to R4 independently represents a hydrogen atom or an alkyl group having from 1 to 3 carbon atoms.
4:
- The epoxy resin according to claim 3, wherein the second epoxy compound comprises an epoxy compound having two of the structures represented by Formula (I).
5:
- The epoxy resin according to claim 1, wherein the second epoxy compound comprises at least one selected from the group consisting of structures represented by the following Formulae (II-A) to (II-D):
- wherein, in Formulae (II-A) to (II-D), each of R1 to R4 independently represents a hydrogen atom or an alkyl group having from 1 to 3 carbon atoms, each of R5 and R6 independently represents an alkyl group having from 1 to 8 carbon atoms, each of n and m independently represents an integer from 0 to 4, and each X independently represents —O— or —NH—.
6:
- An epoxy resin composition, comprising the epoxy resin according to claim 1 and a curing agent.
7:
- The epoxy resin composition according to claim 6, configured to form a smectic structure in a cured state.
8:
- An epoxy resin cured product, comprising a cured product of the epoxy resin composition according to claim 6.
9:
- A composite material, comprising the epoxy resin cured product according to claim 8 and a reinforcing material.