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AssigneeMemjet Technology Limited
InventorsElmer Dimaculangan Perez, Angus North, Graeme Lowe, See-Huat Tan, Christopher Barton
Estimating the term…
A MEMS chip assembly including: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, each MEMS chip having an active surface including one or more MEMS devices and a plurality of bond pads disposed alongside a connection edge of the MEMS chip; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has encapsulant-retaining trenches defined in the active surface extending alongside the connection edge, each encapsulant-retaining trench being disposed between the bond pads and the MEMS devices.
A MEMS chip assembly comprising:
A MEMS chip comprising a substrate having an active surface, the active surface including a plurality of MEMS devices, a plurality of bond pads arranged alongside a connection edge of the substrate and one or more encapsulant-retaining trenches defined therein, wherein the encapsulant-retaining trenches extend alongside the connection edge and each encapsulant-retaining trench is disposed between the bond pads and the MEMS devices.
A method of fabricating a MEMS chip assembly, said method comprising the steps of:
Dependencies are inferred from the claim text.