Systems and methods for post-treatment of dry adhesive microstructures
AssigneeOnrobot Los Angeles Inc.
InventorsMohammad DADKHAH TEHRANI, Nicholas WETTELS
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Abstract
Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.
Claims20
An integrated engagement sensing system in a gripping surface, comprising:
- a backing layer comprising a first material having a first electrical conductivity;
- a plurality of microstructure stalks comprising a second material having a second electrical conductivity, wherein an end of each microstructure stalk of said plurality of microstructure stalks is coupled to said backing layer, and wherein each microstructure stalk is configured to couple to at least one neighboring microstructure stalk when said gripping surface is in an engaged state, and wherein said second electrical conductivity is higher than said first electrical conductivity;
- a plurality of sensing electrodes disposed on or adjacent to said backing layer, wherein any two sensing electrodes of said plurality of sensing electrodes are configured to measure voltage;
- and
- one or more computer processors operatively coupled to said plurality of sensing electrodes, wherein said one or more computer processors are individually or collectively programmed to (i) apply a current to said backing layer, (ii) receive a reading of said voltage, and (iii) based on said reading of said voltage, determine said engaged state of said gripping surface.
A method for sensing engagement of a gripping surface, comprising:
- (a) applying a current to a backing layer of a gripping surface, wherein an end of each microstructure stalk of a plurality of microstructure stalks is attached to said backing layer;
- (b) measuring a voltage or current between a first reference point and a second reference point, wherein said first and second reference points are located on said backing layer;
- (c) opening a conductive pathway between said first and second reference points through said plurality of microstructure stalks, wherein each microstructure stalk is coupled to at least one neighboring microstructure stalk when said gripping surface is in an engaged state and wherein said plurality of microstructure stalks has a higher conductivity than said backing layer;
- and
- (d) determining, from a change in said voltage or current, said engaged state of said gripping surface.
Dependencies are inferred from the claim text.