Method of using a polishing system

A method of using a polishing system, the method comprising:

• polishing a first region of a wafer using a first polishing pad rotating about a first axis;
• measuring a thickness profile of the wafer;
• determining a second region of the wafer based on the measured thickness profile
• rotating the wafer about a second axis perpendicular to the first axis;
• and
• polishing the second region using a second polishing pad after rotating the wafer about the second axis, wherein the second polishing pad has a diameter less than a diameter of the first polishing pad.

A method of using a polishing system, the method comprising:

• securing a wafer to a wafer support;
• bringing the wafer into contact with a first polishing pad;
• polishing the wafer using the first polishing pad rotating about a first axis;
• bringing the wafer into contact with a second polishing pad, wherein bringing the wafer into contact with the second polishing pad comprises rotating the polished wafer about a second axis perpendicular to the first axis;
• polishing the rotated wafer using the second polishing pad.