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US 2019/0337115 A1Published application
Temperature Control in Chemical Mechanical Polish
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKei-Wei Chen, Chih Hung Chen
Life of this patent
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Abstract
A method includes polishing a wafer on a polishing pad, performing conditioning on the polishing pad using a disk of a pad conditioner, and conducting a heat-exchange media into the disk. The heat-exchange media conducted into the disk has a temperature different from a temperature of the polishing pad.
Claims20
An apparatus comprising:
- a polishing pad;
- a pad conditioner adjacent to the polishing pad, wherein the pad conditioner comprises a first channel therein;
- a heat-exchange supplying unit configured to store a first heat-exchange media, wherein the heat-exchange supplying unit is connected to the first channel;
- and
- a control unit configured to control operations of the pad conditioner and the heat-exchange supplying unit.
2 more elements
An apparatus comprising:
- a polishing platen;
- a polishing pad over the polishing platen;
- and
- a pad conditioner configured to condition the polishing pad, wherein the pad conditioner comprises:
- a first channel therein;
- and
- a second channel therein, wherein the first channel is separated from the second channel.
4 more elements
An apparatus comprising:
- a polishing platen;
- a polishing pad over the polishing platen;
- a wafer holder configured to rotate a wafer against the polishing pad, with the wafer contacting the polishing pad, wherein the wafer holder comprises a channel therein, with the channel configured to have a heat-exchange media flowing through;
- a heat-exchange supplying unit configured to store the heat-exchange media therein, wherein the heat-exchange supplying unit is connected to the channel;
- and
- a control unit configured to control a flow status of the heat-exchange media in the channel.
3 more elements
Dependencies are inferred from the claim text.