Abutment, laser cutting device and control method thereof
AssigneeBoe Technology Group Co., Ltd.
InventorsLu LIU, Mingehe HSIEH, Hejin WANG
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Abstract
The present disclosure relates to the field of display technologies, and provides an abutment, a laser cutting device and a control method thereof, so as to improve the yield rate and prolong the service life of a product. Specifically, the abutment comprises a carrying region. The carrying region is used for placing a component to be cut thereon, and comprises an adsorbing region and a cutting region. Furthermore, the adsorbing region is provided with adsorbing holes for adsorbing the component to be cut. Besides, the cutting region extends from a side of the carrying region to an opposite side thereof.
Claims15
An abutment, comprising a carrying region for placing a component to be cut thereon, the carrying region comprising an adsorbing region and a cutting region, wherein
- the adsorbing region is provided with adsorbing holes for adsorbing the component to be cut, and
- the cutting region extends from a side of the carrying region to an opposite side thereof, wherein
- the cutting region is also provided with further adsorbing holes, wherein all the adsorbing holes in the adsorbing region and the cutting region are arranged in rows and columns, and
- the abutment further comprises a peripheral region at the periphery of the carrying region, wherein the peripheral region is provided with first retractable baffles and second retractable baffles, wherein
- each of the first retractable baffles is used for shielding a corresponding row of adsorbing holes in an unfolded state, and
- each of the second retractable baffles is used for shielding a corresponding column of adsorbing holes in an unfolded state.
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Dependencies are inferred from the claim text.