Electronic component holding jig, and method for manufacturing said electronic component holding jig
AssigneeShin-Etsu Polymer Co., Ltd.
InventorsKiyoshi HAYASHI, Satoshi HOZUMI
Life of this patent
Estimating the term…
Abstract
Provided is a method of producing an electronic part holding jig, including applying laser light to an elastomer sheet to form a holding hole for holding an electronic part in the elastomer sheet, wherein the applying of the laser light is performed by passing the laser light emitted from a laser oscillator through a mask pattern having a transmission hole corresponding to a shape of the holding hole to be formed, and condensing the light with a lens, followed by the applying of the light to the elastomer sheet.
Claims7
A method of producing an electronic part holding jig, comprising applying laser light to an elastomer sheet to form a holding hole for holding an electronic part in the elastomer sheet, wherein the applying of the laser light is performed by passing the laser light emitted from a laser oscillator through a mask pattern having a transmission hole corresponding to a shape of the holding hole to be formed, and condensing the laser light with a lens, followed by the applying of the laser light to the elastomer sheet.
An electronic part holding jig, comprising an elastomer sheet having formed therein a penetrating holding hole for holding an electronic part, wherein an inner diameter of the holding hole reduces from a first opening edge thereof toward an inside, and reduces from a second opening edge thereof toward the inside.
Dependencies are inferred from the claim text.